JP4949114B2 - 接続材料塗布装置および半導体装置の製造方法 - Google Patents

接続材料塗布装置および半導体装置の製造方法 Download PDF

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Publication number
JP4949114B2
JP4949114B2 JP2007104263A JP2007104263A JP4949114B2 JP 4949114 B2 JP4949114 B2 JP 4949114B2 JP 2007104263 A JP2007104263 A JP 2007104263A JP 2007104263 A JP2007104263 A JP 2007104263A JP 4949114 B2 JP4949114 B2 JP 4949114B2
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connection material
transfer
semiconductor package
adhesive sheet
sheet carrier
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JP2007104263A
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Japanese (ja)
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JP2008263039A (ja
JP2008263039A5 (https=
Inventor
孝 大塚
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2007104263A priority Critical patent/JP4949114B2/ja
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Publication of JP2008263039A5 publication Critical patent/JP2008263039A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component

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  • Wire Bonding (AREA)
JP2007104263A 2007-04-11 2007-04-11 接続材料塗布装置および半導体装置の製造方法 Active JP4949114B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007104263A JP4949114B2 (ja) 2007-04-11 2007-04-11 接続材料塗布装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007104263A JP4949114B2 (ja) 2007-04-11 2007-04-11 接続材料塗布装置および半導体装置の製造方法

Publications (3)

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JP2008263039A JP2008263039A (ja) 2008-10-30
JP2008263039A5 JP2008263039A5 (https=) 2010-04-15
JP4949114B2 true JP4949114B2 (ja) 2012-06-06

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ID=39985299

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JP2007104263A Active JP4949114B2 (ja) 2007-04-11 2007-04-11 接続材料塗布装置および半導体装置の製造方法

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JP (1) JP4949114B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421863B2 (ja) * 2010-06-28 2014-02-19 新光電気工業株式会社 半導体パッケージの製造方法
JP6167412B2 (ja) * 2013-03-19 2017-07-26 パナソニックＩｐマネジメント株式会社 積層パッケージの製造システムおよび製造方法
JP7365542B2 (ja) * 2020-02-18 2023-10-20 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195897A (ja) * 1998-12-14 2000-07-14 Toshiba Corp フラックス転写装置とその転写方法
JP3798597B2 (ja) * 1999-11-30 2006-07-19 富士通株式会社 半導体装置
JP3636153B2 (ja) * 2002-03-19 2005-04-06 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP3891297B2 (ja) * 2003-10-02 2007-03-14 セイコーエプソン株式会社 半導体装置製造用治具

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Publication number Publication date
JP2008263039A (ja) 2008-10-30

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