JP4948980B2 - 窒化物半導体発光素子 - Google Patents
窒化物半導体発光素子 Download PDFInfo
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- JP4948980B2 JP4948980B2 JP2006310534A JP2006310534A JP4948980B2 JP 4948980 B2 JP4948980 B2 JP 4948980B2 JP 2006310534 A JP2006310534 A JP 2006310534A JP 2006310534 A JP2006310534 A JP 2006310534A JP 4948980 B2 JP4948980 B2 JP 4948980B2
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- 150000004767 nitrides Chemical class 0.000 title claims description 60
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 230000004888 barrier function Effects 0.000 claims description 14
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 238000005121 nitriding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 238000005401 electroluminescence Methods 0.000 description 10
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Description
るために選択された他の組成で形成された活性層は、そのエネルギーバンドギャップの差によって異なる活性層における再結合効率を低下させる傾向がある。
先ず、サファイア基板上に1.2μm厚さのn型GaN層を形成した。その後、上記n型GaN層上に3対のIn0.1Ga0.9N量子井戸層24aとGaN量子障壁層24bとを有する青色活性層24と、3対のIn0.15Ga0.85N量子井戸層26aとGaN量子障壁層26bとを有する緑色活性層26とで構成された多重量子井戸構造の活性層を形成した(図2a参照)。
前例と同様に、多重量子井戸構造の活性層のみを異にして窒化物発光素子を作製した。即ち、本実施例の活性層では、図2bに示すように、上記n型GaN層上に5対のIn0.15Ga0.85N量子井戸層26aとGaN量子障壁層26bで構成された緑色活性層26を形成し、その後3対のIn0.1Ga0.9N量子井戸層24aとGaN量子障壁層24bで構成された青色活性層24を形成した。
前例とほぼ同じ条件で、多重量子井戸構造の活性層のみを異にして窒化物発光素子を作製した。即ち、本例の活性層では、図2cに示すように、上記n型GaN層上に5対のIn0.15Ga0.85N量子井戸層26aとGaN量子障壁層26bとで構成された緑色活性層26を形成し、その後1対のIn0.1Ga0.9N量子井戸層24aとGaN量子障壁層24
bとで構成された青色活性層24を形成した。
たはそれ以上であることがより好ましい。
12 n型窒化物半導体層
14、24 第1活性層
16、26 第2活性層
17 p型窒化物半導体層
19a 第1電極
19b 第2電極
24a、26a 量子井戸層
24b、26b 量子障壁層
Eg1、Eg2 バンドギャップ
Claims (3)
- p型及びn型窒化物層とその間に順次に形成された互いに異なる波長光を発する複数の活性層を有する窒化物半導体発光素子において、
前記複数の活性層は少なくとも第1波長光を放出する第1活性層と、前記第1波長光より長波長である第2波長光を放出する第2活性層とを含み、前記第1活性層及び第2活性層は各々交互に形成された少なくとも一つの量子井戸層と量子障壁層とを有し、
前記第1活性層は前記第2活性層よりp型窒化物層に隣接するように配置され、前記第1活性層の量子井戸層の数は1個、前記第2活性層の量子井戸層の数は5個以上であり、
前記複数の活性層のうち前記第2活性層を除いた他の活性層の全体厚さは200nm以下であり、
前記第1活性層は約450〜約475nmの発光波長を有し、前記第2活性層は約550〜600nmの発光波長を有し、
前記複数個の活性層は、約600〜約635nmの波長光を生成し、交互に形成された少なくとも一つの量子井戸層と量子障壁層とから成る第3活性層をさらに含む、ことを特徴とする、窒化物半導体発光素子。 - 前記第1活性層及び第2活性層の量子井戸層は、各々In1-x1Gax1N及びIn1-x2Gax2Nから成り、前記第1活性層及び第2活性層の量子障壁層はIn1-yGayNから成り、ここでx1<1、0<x2<x1、0≦1−y<1−x1であることを特徴とする、請求項1に記載の窒化物半導体発光素子。
- 前記複数個の活性層のうち前記第2活性層を除いた他の活性層の量子井戸層の数は5つ以下であることを特徴とする、請求項1に記載の窒化物半導体発光素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0111057 | 2005-11-19 | ||
KR1020050111057A KR100691444B1 (ko) | 2005-11-19 | 2005-11-19 | 질화물 반도체 발광소자 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011000117A Division JP2011091434A (ja) | 2005-11-19 | 2011-01-04 | 窒化物半導体発光素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007142426A JP2007142426A (ja) | 2007-06-07 |
JP4948980B2 true JP4948980B2 (ja) | 2012-06-06 |
Family
ID=38052616
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006310534A Expired - Fee Related JP4948980B2 (ja) | 2005-11-19 | 2006-11-16 | 窒化物半導体発光素子 |
JP2011000117A Pending JP2011091434A (ja) | 2005-11-19 | 2011-01-04 | 窒化物半導体発光素子 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011000117A Pending JP2011091434A (ja) | 2005-11-19 | 2011-01-04 | 窒化物半導体発光素子 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070114540A1 (ja) |
JP (2) | JP4948980B2 (ja) |
KR (1) | KR100691444B1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010525583A (ja) | 2007-05-01 | 2010-07-22 | エグザロス・アクチェンゲゼルシャフト | 光源および装置 |
JP4958641B2 (ja) | 2007-05-29 | 2012-06-20 | 株式会社日立製作所 | 記憶制御装置及びその制御方法 |
JP2009036989A (ja) * | 2007-08-01 | 2009-02-19 | Mitsubishi Electric Corp | 面発光表示装置 |
DE102007058723A1 (de) * | 2007-09-10 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Lichtemittierende Struktur |
KR100972984B1 (ko) * | 2008-03-10 | 2010-07-29 | 삼성엘이디 주식회사 | 넓은 발광파장 스펙트럼을 갖는 반도체 발광소자 |
KR101228983B1 (ko) | 2008-11-17 | 2013-02-04 | 삼성전자주식회사 | 질화물 반도체 발광소자 |
KR101504155B1 (ko) | 2008-11-27 | 2015-03-19 | 삼성전자주식회사 | 질화물 반도체 발광소자 |
JP5671244B2 (ja) * | 2010-03-08 | 2015-02-18 | 日亜化学工業株式会社 | 窒化物系半導体発光素子 |
KR101134406B1 (ko) | 2010-08-10 | 2012-04-09 | 엘지이노텍 주식회사 | 발광소자 |
CN102593289B (zh) * | 2011-01-10 | 2015-05-20 | 晶元光电股份有限公司 | 发光元件 |
JP6002364B2 (ja) * | 2011-01-27 | 2016-10-05 | 晶元光電股▲ふん▼有限公司 | 発光素子 |
JP6190585B2 (ja) * | 2012-12-12 | 2017-08-30 | スタンレー電気株式会社 | 多重量子井戸半導体発光素子 |
KR102399381B1 (ko) | 2015-05-20 | 2022-05-19 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 |
KR102569461B1 (ko) | 2015-11-30 | 2023-09-04 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 이를 포함하는 조명장치 |
CN108474651B (zh) * | 2015-12-22 | 2020-09-15 | Asml荷兰有限公司 | 形貌测量系统 |
KR102155544B1 (ko) * | 2018-12-03 | 2020-09-14 | 한국광기술원 | 스트레인 인가층을 포함하는 다중 파장 발광 소자 |
CN113140657B (zh) * | 2021-05-13 | 2022-04-19 | 西安瑞芯光通信息科技有限公司 | 一种紫外led外延结构及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
US5684309A (en) * | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
JPH11135838A (ja) * | 1997-10-20 | 1999-05-21 | Ind Technol Res Inst | 白色発光ダイオード及びその製造方法 |
US6608330B1 (en) * | 1998-09-21 | 2003-08-19 | Nichia Corporation | Light emitting device |
JP3719047B2 (ja) * | 1999-06-07 | 2005-11-24 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP2001053336A (ja) * | 1999-08-05 | 2001-02-23 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
JP4032636B2 (ja) * | 1999-12-13 | 2008-01-16 | 日亜化学工業株式会社 | 発光素子 |
JP2002176198A (ja) * | 2000-12-11 | 2002-06-21 | Mitsubishi Cable Ind Ltd | 多波長発光素子 |
CN1254869C (zh) * | 2001-03-28 | 2006-05-03 | 日亚化学工业株式会社 | 氮化物半导体元件 |
JP3763754B2 (ja) * | 2001-06-07 | 2006-04-05 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子 |
JP2004128444A (ja) * | 2002-07-31 | 2004-04-22 | Shin Etsu Handotai Co Ltd | 発光素子及びそれを用いた照明装置 |
JP4106615B2 (ja) * | 2002-07-31 | 2008-06-25 | 信越半導体株式会社 | 発光素子及びそれを用いた照明装置 |
US20060006375A1 (en) * | 2003-04-14 | 2006-01-12 | Chen Ou | Light Mixing LED |
US6897489B1 (en) * | 2004-03-10 | 2005-05-24 | Hui Peng | (AlGa)InPN high brightness white or desired color LED's |
-
2005
- 2005-11-19 KR KR1020050111057A patent/KR100691444B1/ko not_active IP Right Cessation
-
2006
- 2006-11-16 JP JP2006310534A patent/JP4948980B2/ja not_active Expired - Fee Related
- 2006-11-17 US US11/600,870 patent/US20070114540A1/en not_active Abandoned
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2011
- 2011-01-04 JP JP2011000117A patent/JP2011091434A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR100691444B1 (ko) | 2007-03-09 |
JP2007142426A (ja) | 2007-06-07 |
US20070114540A1 (en) | 2007-05-24 |
JP2011091434A (ja) | 2011-05-06 |
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