JP4945362B2 - 穿孔加工方法及びその装置 - Google Patents
穿孔加工方法及びその装置 Download PDFInfo
- Publication number
- JP4945362B2 JP4945362B2 JP2007197859A JP2007197859A JP4945362B2 JP 4945362 B2 JP4945362 B2 JP 4945362B2 JP 2007197859 A JP2007197859 A JP 2007197859A JP 2007197859 A JP2007197859 A JP 2007197859A JP 4945362 B2 JP4945362 B2 JP 4945362B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- powder
- wall
- fuel injection
- injection nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005553 drilling Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 18
- 239000000945 filler Substances 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 78
- 239000000843 powder Substances 0.000 description 52
- 238000002347 injection Methods 0.000 description 45
- 239000007924 injection Substances 0.000 description 45
- 239000000446 fuel Substances 0.000 description 30
- 239000011148 porous material Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000000155 melt Substances 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
Description
前記中空部の内部に、前記レーザ光によって溶融しない充填物を挿入する工程と、
前記充填物を振動させながら前記レーザ光を照射し、前記貫通孔が形成されたときに該貫通孔を通過した前記レーザ光を前記充填物に入射させる工程と、
を有することを特徴とする。
前記中空部の内部に挿入され、前記レーザ光によって溶融しない充填物と、
前記充填物を振動させる振動手段と、
を有することを特徴とする。
R={(3V0−tfZ)/4π}1/3 …(1)
10、20…穿孔加工装置 12…超音波振動子
16…ジルコニア製ボール 22…粉体
28…ピストン 36…熱センサ
Claims (2)
- 中空部の壁部に対して外方からレーザ光を照射することで前記壁部に貫通孔を形成する穿孔加工方法において、
前記中空部の内部に、前記レーザ光によって溶融しない充填物を挿入する工程と、
前記充填物を振動させながら前記レーザ光を照射し、前記貫通孔が形成されたときに該貫通孔を通過した前記レーザ光を前記充填物に入射させる工程と、
を有することを特徴とする穿孔加工方法。 - 中空部の壁部に対して外方からレーザ光を照射することで前記壁部に貫通孔を形成する穿孔加工装置において、
前記中空部の内部に挿入され、前記レーザ光によって溶融しない充填物と、
前記充填物を振動させる振動手段と、
を有することを特徴とする穿孔加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007197859A JP4945362B2 (ja) | 2007-07-30 | 2007-07-30 | 穿孔加工方法及びその装置 |
DE102008033208A DE102008033208B4 (de) | 2007-07-30 | 2008-07-15 | Perforierverfahren und Perforiervorrichtung |
US12/178,263 US8173932B2 (en) | 2007-07-30 | 2008-07-23 | Perforation method and perforation apparatus |
CNA2008101301443A CN101357418A (zh) | 2007-07-30 | 2008-07-30 | 穿孔方法和穿孔装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007197859A JP4945362B2 (ja) | 2007-07-30 | 2007-07-30 | 穿孔加工方法及びその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009028777A JP2009028777A (ja) | 2009-02-12 |
JP4945362B2 true JP4945362B2 (ja) | 2012-06-06 |
Family
ID=40176113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007197859A Active JP4945362B2 (ja) | 2007-07-30 | 2007-07-30 | 穿孔加工方法及びその装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8173932B2 (ja) |
JP (1) | JP4945362B2 (ja) |
CN (1) | CN101357418A (ja) |
DE (1) | DE102008033208B4 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5283538B2 (ja) * | 2009-03-02 | 2013-09-04 | 本田技研工業株式会社 | 穴あけ装置及び貫通穴の形成方法 |
US20100219166A1 (en) * | 2009-03-02 | 2010-09-02 | Honda Motor Co., Ltd. | Hole-forming machine |
JP5328424B2 (ja) * | 2009-03-02 | 2013-10-30 | 本田技研工業株式会社 | 穴あけ装置 |
JP5518680B2 (ja) * | 2010-11-17 | 2014-06-11 | 本田技研工業株式会社 | 孔開け加工装置 |
EP2589456A1 (de) * | 2011-11-07 | 2013-05-08 | Siemens Aktiengesellschaft | Verfahren zum Laserbohren und Bauteil |
CN104254428B (zh) * | 2011-12-07 | 2016-12-07 | 通用原子公司 | 用于激光制造加工的方法和系统 |
US9561560B2 (en) * | 2013-03-15 | 2017-02-07 | United Technologies Corporation | Backstrike detection system for laser drilling thin materials |
US9305839B2 (en) * | 2013-12-19 | 2016-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Curing photo resist for improving etching selectivity |
DE102014200033A1 (de) * | 2014-01-07 | 2015-07-09 | Siemens Aktiengesellschaft | Anpassung der Parameter beim Schweißverfahren am Ende einer Schweißnaht |
WO2015196373A1 (zh) * | 2014-06-24 | 2015-12-30 | 西门子公司 | 利用激光脉冲在空心部件上加工孔的控制方法和系统 |
WO2017151122A1 (en) * | 2016-03-02 | 2017-09-08 | Cummins Inc. | Systems and methods for preventing laser back-wall damage |
CN107671435A (zh) * | 2017-11-08 | 2018-02-09 | 钦成科技有限公司 | 用于喷油嘴打孔的后壁保护装置及其使用方法 |
CN108044243A (zh) * | 2017-12-18 | 2018-05-18 | 中国科学院西安光学精密机械研究所 | 具有复杂腔体工件的激光加工制孔方法及辅助填充系统 |
CN111014987B (zh) * | 2019-12-13 | 2022-03-22 | 西安中科微精光子制造科技有限公司 | 激光加工喷油嘴喷孔的定位及对壁保护装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2809154A (en) * | 1948-10-15 | 1957-10-08 | Kindred L Storrs | Heat treatment of substances for the recovery of decomposition products |
US4156571A (en) * | 1977-09-07 | 1979-05-29 | The Singer Company | Laser mirror scatter and reflectivity measuring system |
US4228406A (en) * | 1978-05-10 | 1980-10-14 | The University Of Rochester | Laser apparatus |
US4239954A (en) | 1978-12-11 | 1980-12-16 | United Technologies Corporation | Backer for electron beam hole drilling |
JPS61169188A (ja) * | 1985-01-22 | 1986-07-30 | Mitsubishi Electric Corp | レ−ザビ−ムを用いた切断および溶接方法 |
US4857696A (en) * | 1987-06-12 | 1989-08-15 | Raycon Textron Inc. | Laser/EDM drilling manufacturing cell |
JPH01146386A (ja) * | 1987-12-03 | 1989-06-08 | Toshiba Corp | レーザビームダンプ |
FR2699844B1 (fr) * | 1992-12-30 | 1995-02-03 | Snecma | Procédé et dispositif d'usinage par faisceau laser. |
JP3316281B2 (ja) * | 1993-11-19 | 2002-08-19 | 三菱重工業株式会社 | レーザ加工用バックプロテクタ |
JPH0966381A (ja) | 1995-09-01 | 1997-03-11 | Zexel Corp | 孔明け加工方法、孔明け加工装置および燃料噴射ノズルのノズルボディ |
JPH10249565A (ja) * | 1997-03-06 | 1998-09-22 | Ishikawajima Harima Heavy Ind Co Ltd | 中子を用いた鋳造品の穴加工法 |
GB2328894B (en) * | 1997-09-03 | 1999-07-14 | Oxford Lasers Ltd | Laser drilling |
DE19832774B4 (de) * | 1998-07-22 | 2008-01-24 | Siemens Ag | Schutzvorrichtung zum Herstellen von Kleinstbohrungen in rohrartigen Bauteilen sowie Verfahren zum Herstellen von in einen Hohlraum mündenden Bohrungen |
US6070813A (en) * | 1998-08-11 | 2000-06-06 | Caterpillar Inc. | Laser drilled nozzle in a tip of a fuel injector |
DE19908630A1 (de) * | 1999-02-27 | 2000-08-31 | Bosch Gmbh Robert | Abschirmung gegen Laserstrahlen |
JP3230157B2 (ja) * | 1999-04-20 | 2001-11-19 | 株式会社岡崎製作所 | 管のレーザ加工に用いるビーム吸収材 |
CN1301177C (zh) | 2002-10-15 | 2007-02-21 | 竹内株式会社 | 检测工作机械加工空间区域内的集尘能力降低的检测装置 |
DE10314844B4 (de) * | 2003-04-01 | 2006-06-08 | Siemens Ag | Verfahren und Verwendung eines Verfahrens zur Herstellung von Durchgangsbohrungen und Düse eines Injektors |
DE502004003169D1 (de) * | 2004-11-30 | 2007-04-19 | Delphi Tech Inc | Vorrichtung zur Herstellung einer Bohrung mittels Laserstrahlung |
JP2006218346A (ja) * | 2005-02-08 | 2006-08-24 | Honda Motor Co Ltd | 水素吸着材及びその製造方法 |
US20070175872A1 (en) * | 2006-01-27 | 2007-08-02 | Rhoades Lawrence J | Laser back wall protection by particulate shading |
-
2007
- 2007-07-30 JP JP2007197859A patent/JP4945362B2/ja active Active
-
2008
- 2008-07-15 DE DE102008033208A patent/DE102008033208B4/de not_active Expired - Fee Related
- 2008-07-23 US US12/178,263 patent/US8173932B2/en active Active
- 2008-07-30 CN CNA2008101301443A patent/CN101357418A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2009028777A (ja) | 2009-02-12 |
DE102008033208A1 (de) | 2009-02-05 |
CN101357418A (zh) | 2009-02-04 |
US8173932B2 (en) | 2012-05-08 |
US20090032508A1 (en) | 2009-02-05 |
DE102008033208B4 (de) | 2011-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4945362B2 (ja) | 穿孔加工方法及びその装置 | |
ES2439704T3 (es) | Método y dispositivo para anclar una espiga usando vibraciones mecánicas | |
CN103028847B (zh) | 用于对机械构件上的部分进行微机械加工的加工方法和加工系统 | |
JP2001526961A (ja) | レーザー穿孔方法 | |
JP4581910B2 (ja) | 孔表面加工処理方法 | |
JP6063636B2 (ja) | レーザ加工装置、レーザ加工システム、レーザ加工方法 | |
JP5448042B2 (ja) | レーザー加工装置、レーザー加工装置の製造方法、及びレーザー加工方法 | |
KR20170016379A (ko) | 2개의 물체를 접합하는 방법 | |
TW201249583A (en) | Laser machining apparatus | |
JP2004534409A (ja) | 基板上にハンダを塗布する方法及び装置 | |
US20190032434A1 (en) | Downhole High Power Laser Scanner Tool and Methods | |
Nag et al. | Utilization of ultrasonically forced pulsating water jet decaying for bone cement removal | |
CN102762333A (zh) | 纤维强化树脂的切割装置 | |
JP5873978B2 (ja) | レーザ加工方法、およびノズルの製造方法 | |
JP6210630B2 (ja) | 微小バブル発生装置、微小吐出孔ノズル及びその製造方法 | |
JP5518680B2 (ja) | 孔開け加工装置 | |
JP2009090443A (ja) | 表面改質装置およびその改質方法 | |
GB2524337A (en) | A method of forming a membrane, a membrane and an ultrasonic atomiser using the membrane | |
JP6482658B2 (ja) | 液体ジェット射出装置及び液体ジェット射出方法 | |
JP5970360B2 (ja) | レーザ加工装置及びレーザ加工システム、レーザ加工方法 | |
JP2011045906A (ja) | 機構部品における微細加工部の加工方法および加工装置 | |
US20220218896A1 (en) | Apparatus and methods for medical applications of laser driven microfluid pumps | |
JP6004711B2 (ja) | レーザー加工装置 | |
JP2008137036A (ja) | レーザ切断装置 | |
JP5283538B2 (ja) | 穴あけ装置及び貫通穴の形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091126 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110427 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120207 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120305 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4945362 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150309 Year of fee payment: 3 |