JP4941944B2 - 基板への接着テープの貼り付け方法及び貼り付け装置 - Google Patents

基板への接着テープの貼り付け方法及び貼り付け装置 Download PDF

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JP4941944B2
JP4941944B2 JP2008089329A JP2008089329A JP4941944B2 JP 4941944 B2 JP4941944 B2 JP 4941944B2 JP 2008089329 A JP2008089329 A JP 2008089329A JP 2008089329 A JP2008089329 A JP 2008089329A JP 4941944 B2 JP4941944 B2 JP 4941944B2
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adhesive tape
substrate
wafer
mounting
mounting table
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JP2009246067A (ja
JP2009246067A5 (enExample
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隆博 芦田
隆樹 谷川
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Takatori Corp
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Takatori Corp
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008089329A 2008-03-31 2008-03-31 基板への接着テープの貼り付け方法及び貼り付け装置 Active JP4941944B2 (ja)

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JP2008089329A JP4941944B2 (ja) 2008-03-31 2008-03-31 基板への接着テープの貼り付け方法及び貼り付け装置

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JP2008089329A JP4941944B2 (ja) 2008-03-31 2008-03-31 基板への接着テープの貼り付け方法及び貼り付け装置

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JP2009246067A JP2009246067A (ja) 2009-10-22
JP2009246067A5 JP2009246067A5 (enExample) 2011-05-12
JP4941944B2 true JP4941944B2 (ja) 2012-05-30

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011133499A (ja) * 2009-12-22 2011-07-07 Csun Mfg Ltd ウェハへのフィルム貼付方法およびその設備
US20110186215A1 (en) * 2010-02-03 2011-08-04 C Sun Mfg. Ltd. Apparatus and method for laminating a film on a wafer
JP6216606B2 (ja) * 2013-10-23 2017-10-18 リンテック株式会社 シート貼付装置
JP6374680B2 (ja) * 2013-12-13 2018-08-15 東京応化工業株式会社 貼付方法
JP6369297B2 (ja) * 2014-11-12 2018-08-08 株式会社Sumco 半導体ウェーハの支持方法及びその支持装置
JP2019106493A (ja) * 2017-12-13 2019-06-27 第一精工株式会社 基板に対する粘着テープの貼付方法及び基板に対する粘着テープの貼付装置
TWI767611B (zh) * 2021-03-15 2022-06-11 萬潤科技股份有限公司 散熱膠墊貼合方法及設備
CN114658737B (zh) * 2022-03-28 2024-05-03 航天材料及工艺研究所 一种航天舱段软木自动化粘贴装置及方法
CN115782202B (zh) * 2022-11-30 2024-07-23 中国电子科技集团公司第二十九研究所 一种橡胶材料辅助粘贴工具

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0287546A (ja) * 1988-09-22 1990-03-28 Nitto Denko Corp 保護フイルムの貼付方法
JP2856216B2 (ja) * 1989-06-09 1999-02-10 富士通株式会社 半導体ウエハに粘着テープを接着する方法
JPH10233430A (ja) * 1997-02-19 1998-09-02 Nitto Denko Corp 粘着テープ貼付け装置
JP3607143B2 (ja) * 1999-11-19 2005-01-05 株式会社タカトリ 半導体ウエハへの保護テープ貼り付け方法及び装置
JP2001308033A (ja) * 2000-04-18 2001-11-02 Lintec Corp ウエハ固定方法

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