JP4939112B2 - Ledパッケージ - Google Patents
Ledパッケージ Download PDFInfo
- Publication number
- JP4939112B2 JP4939112B2 JP2006148459A JP2006148459A JP4939112B2 JP 4939112 B2 JP4939112 B2 JP 4939112B2 JP 2006148459 A JP2006148459 A JP 2006148459A JP 2006148459 A JP2006148459 A JP 2006148459A JP 4939112 B2 JP4939112 B2 JP 4939112B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- leds
- led package
- diffusion plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009792 diffusion process Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 24
- 239000003086 colorant Substances 0.000 claims description 11
- 239000002861 polymer material Substances 0.000 claims description 4
- 230000000295 complement effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 230000010076 replication Effects 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/008—Combination of two or more successive refractors along an optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Description
10a〜110c LED
120 側壁
130 拡散板
140 マイクロレンズアレイ
150a、150ab 反射漠
B 光混合領域
Claims (6)
- 基板と、
上記基板上に配置された複数個のLEDと、
上記複数個のLEDが配置された領域の縁に形成された側壁と、
上記複数個のLED上部に所定間隔離隔配置されるよう、上記基板と上記側壁の上部面との間に位置する拡散板と、
上記拡散板の上部に所定間隔離隔するよう配置され上記側壁の上部面に固定されたマイクロレンズアレイと、を含み、
上記拡散板の上面には上部に突出した複数のプリズム構造が形成され、上記プリズム構造は夫々三角錘状または四角錐状を有し、
上記マイクロレンズアレイは上記複数のプリズムと同じ方向に向かって上部に突出するように形成され、曲面を有する複数のマイクロレンズを含み、上記複数のマイクロレンズは、その下部が六角形の横断面を有することを特徴とするLEDパッケージ。 - 上記複数個のLEDは、互いに補色関係にある2色の光を各々放出するLEDを少なくとも一つずつ含むことを特徴とする請求項1に記載のLEDパッケージ。
- 上記複数個のLEDは、赤色光を放出する少なくとも一つのLED、緑色光を放出する少なくとも一つのLED及び青色光を放出する少なくとも一つのLEDとを含むことを特徴とする請求項1に記載のLEDパッケージ。
- 上記基板の上面には反射膜が形成されたことを特徴とする請求項1に記載のLEDパッケージ。
- 上記側壁は、その内部側面に傾斜面を有し、上記傾斜面には反射膜が塗布されたことを特徴とする請求項1に記載のLEDパッケージ。
- 上記拡散板及びマイクロレンズアレイは、ポリマー材質から成ることを特徴とする請求項1に記載のLEDパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0046473 | 2005-05-31 | ||
KR1020050046473A KR100649641B1 (ko) | 2005-05-31 | 2005-05-31 | Led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006339641A JP2006339641A (ja) | 2006-12-14 |
JP4939112B2 true JP4939112B2 (ja) | 2012-05-23 |
Family
ID=36808475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006148459A Expired - Fee Related JP4939112B2 (ja) | 2005-05-31 | 2006-05-29 | Ledパッケージ |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060267037A1 (ja) |
EP (1) | EP1729350A3 (ja) |
JP (1) | JP4939112B2 (ja) |
KR (1) | KR100649641B1 (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
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US7888868B2 (en) * | 2006-04-28 | 2011-02-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED light source with light-directing structures |
WO2008047285A1 (en) * | 2006-10-16 | 2008-04-24 | Koninklijke Philips Electronics N.V. | Lighting device |
KR100845856B1 (ko) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
DE102007039291A1 (de) * | 2007-08-20 | 2009-02-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen |
DE102007046339A1 (de) * | 2007-09-27 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lichtquelle mit veränderlicher Abstrahlcharakteristik |
NL2000916C2 (nl) * | 2007-10-10 | 2009-04-14 | Innovative & Superior Technology Inc | LED lichtbronmodule met homogenisatie van lichtopbrengst. |
DE102007057671A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
KR100955390B1 (ko) * | 2007-12-31 | 2010-04-29 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이 장치 |
TWI384651B (zh) * | 2008-08-20 | 2013-02-01 | Au Optronics Corp | 發光二極體結構及其製造方法 |
US20110163334A1 (en) * | 2008-09-16 | 2011-07-07 | Koninklijke Philips Electronics N.V. | Colour mixing method for consistent colour quality |
DE102008054029A1 (de) * | 2008-10-30 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
DE102008054219A1 (de) | 2008-10-31 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Organisches strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines organischen strahlungsemittierenden Bauelements |
DE102009042479A1 (de) | 2009-09-24 | 2011-03-31 | Msg Lithoglas Ag | Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug |
TWI423483B (zh) * | 2009-09-28 | 2014-01-11 | Silicon Base Dev Inc | 光二極體封裝結構 |
CN104154463A (zh) * | 2010-09-27 | 2014-11-19 | 北京京东方光电科技有限公司 | 发光二极管光源及其制造方法、具有其的背光源 |
CN102418851B (zh) | 2010-09-27 | 2014-07-30 | 北京京东方光电科技有限公司 | 发光二极管光源及其制造方法、具有其的背光源 |
EP2444713A1 (en) | 2010-10-19 | 2012-04-25 | University College Cork | A light source |
EP2458268B1 (en) * | 2010-11-26 | 2016-04-20 | LG Innotek Co., Ltd. | Phosphor plate and lighting device |
KR101065708B1 (ko) * | 2011-01-13 | 2011-09-19 | 엘지전자 주식회사 | 평판형 엘이디 조명장치 및 그 제조방법 |
TWI475724B (zh) * | 2011-08-10 | 2015-03-01 | Lite On Singapore Pte Ltd | 發光單元、其製造方法及觸控面板 |
KR20130047334A (ko) * | 2011-10-31 | 2013-05-08 | 엘지이노텍 주식회사 | 조명 부재 및 이를 포함하는 조명 장치 |
DE102011087614A1 (de) * | 2011-12-02 | 2013-06-06 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
US20140375929A1 (en) * | 2011-12-27 | 2014-12-25 | 3M Innovative Properties Company | Light management film |
KR101506571B1 (ko) * | 2013-08-22 | 2015-03-27 | (주)에스에스에이디티 | 사각 반구형 마이크로렌즈 어레이를 구비한 엘이디 조명 시스템 |
US9736895B1 (en) | 2013-10-03 | 2017-08-15 | Ketra, Inc. | Color mixing optics for LED illumination device |
US10043783B1 (en) * | 2013-11-11 | 2018-08-07 | Andrey Zykin | LED spirit system and manufacturing method |
CN103712155B (zh) * | 2013-12-24 | 2017-11-03 | 京东方科技集团股份有限公司 | 灯罩、背光模组和显示装置 |
DE102014116687A1 (de) | 2014-11-14 | 2016-05-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Beleuchtungsvorrichtung |
CN104570481A (zh) * | 2014-12-26 | 2015-04-29 | 上海天马微电子有限公司 | 一种led光源、背光模组及液晶显示装置 |
WO2017045938A1 (en) * | 2015-09-15 | 2017-03-23 | Philips Lighting Holding B.V. | Light emitting device. |
JP6759556B2 (ja) * | 2015-10-30 | 2020-09-23 | 日亜化学工業株式会社 | 照明装置 |
KR102650950B1 (ko) | 2017-09-29 | 2024-03-26 | 서울반도체 주식회사 | 발광 소자 및 그것을 갖는 표시 장치 |
CN107833946A (zh) * | 2017-11-28 | 2018-03-23 | 西安科锐盛创新科技有限公司 | 一种led封装方法 |
WO2020001327A1 (zh) * | 2018-06-26 | 2020-01-02 | 苏州欧普照明有限公司 | 灯泡及水晶灯 |
US20200191354A1 (en) * | 2018-11-20 | 2020-06-18 | G.Skill International Enterprise Co., Ltd. | Light guide device |
CN109411460B (zh) * | 2018-12-20 | 2024-03-29 | 广州美锐健康产业股份有限公司 | 多光谱固态发光器件及多光谱照射光源 |
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-
2005
- 2005-05-31 KR KR1020050046473A patent/KR100649641B1/ko not_active IP Right Cessation
-
2006
- 2006-05-29 JP JP2006148459A patent/JP4939112B2/ja not_active Expired - Fee Related
- 2006-05-31 EP EP06252802A patent/EP1729350A3/en not_active Withdrawn
- 2006-05-31 US US11/442,964 patent/US20060267037A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1729350A2 (en) | 2006-12-06 |
US20060267037A1 (en) | 2006-11-30 |
JP2006339641A (ja) | 2006-12-14 |
KR100649641B1 (ko) | 2006-11-27 |
EP1729350A3 (en) | 2012-04-04 |
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