JP4934565B2 - Optical module - Google Patents

Description

  The present invention relates to an optical module in which waveguides of two or more waveguide devices each having a waveguide are coupled.

Along with the spread and progress of optical communication networks, higher performance of optical components used in optical communication systems is progressing. Optical components include optical active components that emit or receive signal light, optical passive components that branch / couple or demultiplex / multiplex signal light, and optical fibers that serve as signal light transmission lines. There is a growing need for higher functionality and lower costs for each optical component. Among these, with respect to the optical active component, a device based on a semiconductor material such as a semiconductor laser or a semiconductor photodiode is mainly used, and technological development is being advanced. An optical active component based on a semiconductor material is characterized by an optical amplification function, high-speed operation, and compact integration. On the other hand, for optical passive components, planar lightwave circuits (PLCs) having optical waveguides (PLC waveguides) based on silica-based materials (SiO ₂ ) have been commercialized.

  Up to now, the performance of each individual component has been improved for both optical active components and optical passive components. However, with the advancement of needs due to the advancement of optical communication systems, high-performance optical components that have the advantages of both have been developed. The demand is growing. Therefore, development of an optical module (hybrid optical integrated device) in which a semiconductor active element such as a semiconductor laser diode and a PLC are combined has been performed.

For example, in the conventional technique disclosed in Non-Patent Document 1, an optical wavelength selector is realized by hybrid integration of an arrayed waveguide grating (AWG) on a PLC and a semiconductor optical amplifier (SOA). Here, the SOA is used as a gate switch, and the input waveguide and output waveguide of the SOA are in contact with separate end faces of the semiconductor substrate, and are in contact with the PLC substrate at each end face and coupled to the optical waveguide on the PLC substrate. is doing.
(I. Ogawa, F. Ebisawa, N. Yoshimoto, K. Takiguchi, F. Hanawa, T. Hashimoto, A. Sugita, M. Yanagisawa, Y. Inoue, Y. Yamada, Y. Tohmori, S. Mino, T Ito, K. Magari, Y. Kawaguchi, A. Himeno, and K. Kato, “Lossless hybrid integrated 8-ch optical wavelength selector module using PLC platform and PLC-PLC direct attachment techniques,” Proc. OFC'98, 1998 , paper PD4-1)

By the way, conventionally, the PLC waveguides formed on the Si substrate or the PLC waveguide formed on the Si substrate and the semiconductor waveguide mounted on the subcarrier (for example, Si subcarrier) are coupled. The vertical relationship between the substrate and the waveguide of the two waveguide devices to be bonded was the same. For example, as shown in FIG. 9, waveguides of two waveguide devices 102 and 103 each having a silicon (Si) substrate 100 and a PLC waveguide (SiO ₂ PLC waveguide) 101 formed on the Si substrate 100. In the case where an optical module is manufactured by coupling them together, both the waveguide devices 102 and 103 have the Si substrate 100 on the bottom and the PLC waveguide 101 on the top. In such a case, the Si substrate 100 has a thickness of about 1 mm, whereas the gap between the PLC waveguides 101 is as narrow as several μm. Therefore, when UV light (ultraviolet light) is applied to the UV curable adhesive (UV curable resin) 104 injected between the Si substrates 100 of both waveguide devices 102 and 103, the UV light is blocked by the Si substrate 100 and is narrow. There was a problem that the entire UV curing adhesive 104 injected into the gap did not reach the entire surface and the entire UV curing adhesive 104 was not sufficiently cured.

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide an optical module capable of bonding two waveguide devices with high strength using a UV curable adhesive. It is in.

  In order to solve the above-mentioned problems, an optical module according to the invention described in claim 1 is an optical module in which the waveguides of two or more waveguide devices each having a waveguide are coupled, and the waveguides are coupled to each other. A glass upper plate transparent to ultraviolet light, which is bonded and fixed to at least one of the two waveguide devices or the upper surface of the waveguide, and at least one of the two waveguide devices is guided to the substrate. The end face of the upper plate and the end face of the other substrate of the two waveguide devices are bonded with a UV curable adhesive in a state where the vertical relationship of the waveguide is inverted.

  According to this configuration, when two waveguide devices are integrated using a UV curable adhesive so that the waveguides of each waveguide device are coupled, one of the two waveguide devices is guided with the substrate. A glass upper plate transparent to ultraviolet rays in a UV curable adhesive injected between the end surface of the upper plate and the end surface of the other substrate of the two waveguide devices with the vertical relationship of the waveguides reversed. UV light is radiated through. As a result, the UV light passes through the glass upper plate transparent to the ultraviolet rays and reaches the UV curable adhesive, so that the UV light can sufficiently reach the entire UV curable adhesive in the narrow gap. The entire UV curable adhesive can be cured sufficiently. Therefore, it is possible to realize an optical module in which two waveguide devices are bonded with high strength using a UV curable adhesive.

  The optical module according to the invention of claim 2 has one of the two waveguide devices having a silicon (Si) substrate as the substrate and a PLC waveguide formed on the Si substrate, The other of the two waveguide devices has a subcarrier as the substrate and a semiconductor waveguide chip mounted on the subcarrier and having a semiconductor waveguide, and the PLC waveguide of the one waveguide device. The upper plate made of glass is bonded and fixed to the upper surface of the waveguide, and the one waveguide device is in an upside-down relationship between the Si substrate and the PLC waveguide, and the end surface of the upper plate; An end surface of the subcarrier of the other waveguide device is bonded with a UV curable adhesive.

  According to this configuration, when two waveguide devices are integrated using a UV curable adhesive so that the waveguides of each waveguide device are coupled, one waveguide device is connected to the Si substrate and the PLC conductor. Through the upper plate made of glass transparent to ultraviolet rays, the UV curing adhesive injected between the end surface of the upper plate and the end surface of the sub-carrier of the other waveguide device with the vertical relationship of the waveguide inverted. Irradiate with UV light. As a result, the UV light passes through the glass upper plate transparent to the ultraviolet rays and reaches the UV curable adhesive, so that the UV light can sufficiently reach the entire UV curable adhesive in the narrow gap. The entire UV curable adhesive can be cured sufficiently. Accordingly, it is possible to realize an optical module in which two waveguide devices having different types of waveguides are bonded with high strength using a UV curable adhesive.

  In the optical module according to the third aspect of the present invention, an upper plate made of glass transparent to ultraviolet light is bonded and fixed on the subcarrier of the other waveguide device, and the upper surface of the PLC waveguide is fixed. The end surface of the upper plate that is bonded and fixed to the end surface of the subcarrier of the other waveguide device is bonded with a UV curable adhesive, and the end surface of the upper plate that is bonded and fixed to the subcarrier. And an end face of the Si substrate of the one waveguide device are bonded with a UV curing adhesive.

  According to this configuration, the UV curing adhesive injected between the end face of the glass upper plate transparent to the ultraviolet ray on the upper surface of the PLC waveguide and the end face of the subcarrier of the other waveguide device is further UV light is irradiated through the plate, and UV curing adhesive injected between the end surface of the upper plate made of glass transparent to ultraviolet rays on the subcarrier and the end surface of the Si substrate of one waveguide device, UV light is irradiated through the upper plate. As a result, UV light passes through the glass upper plate transparent to the ultraviolet rays on the upper surface of the PLC waveguide and the glass upper plate transparent to the ultraviolet rays on the subcarrier, respectively, and becomes UV curing adhesive. Therefore, the UV light can sufficiently reach the entire UV curing adhesive in the narrow gap, and the entire UV curing adhesive can be sufficiently cured. Therefore, it is possible to realize an optical module in which two waveguide devices having different types of waveguides are bonded with higher strength.

  According to an optical module of the present invention, the two waveguide devices include a silicon (Si) substrate as the substrate and a PLC waveguide that is a planar lightwave circuit formed on the Si substrate. An upper plate made of glass transparent to ultraviolet rays is bonded and fixed to the upper surface of the PLC waveguide of the one waveguide device, and the one waveguide device is connected to the Si substrate and the An end face of the upper plate and an end face of the Si substrate of the other waveguide device are bonded with a UV curing adhesive in a state where the vertical relationship of the PLC waveguide is inverted.

  According to this configuration, when two waveguide devices are integrated using a UV curable adhesive so that the waveguides of each waveguide device are coupled, one waveguide device is connected to the Si substrate and the PLC conductor. Through a glass top plate transparent to ultraviolet rays, the UV curing adhesive injected between the end surface of the upper plate and the end surface of the Si substrate of the other waveguide device with the vertical relationship of the waveguide inverted. Irradiate with UV light. As a result, the UV light passes through the glass upper plate transparent to the ultraviolet rays and reaches the UV curable adhesive, so that the UV light can sufficiently reach the entire UV curable adhesive in the narrow gap. The entire UV curable adhesive can be cured sufficiently. Therefore, it is possible to realize an optical module in which two waveguide devices having the same kind of waveguide (PLC waveguide) are bonded with high strength using a UV curable adhesive.

  In the optical module according to the fifth aspect of the present invention, a glass upper plate transparent to the ultraviolet light is bonded and fixed to the upper surface of the PLC waveguide of the other waveguide device. An end face of the upper plate bonded and fixed to the upper surface of the PLC waveguide of the waveguide device and an end face of the Si substrate of the other waveguide device are bonded with a UV-curing adhesive, and the other waveguide An end face of the upper plate bonded and fixed to the upper surface of the PLC waveguide of the device and an end face of the Si substrate of the one waveguide device are bonded with a UV curable adhesive.

  According to this configuration, the UV curing injected between the end surface of the glass upper plate transparent to the ultraviolet light on the upper surface of the PLC waveguide of one waveguide device and the end surface of the Si substrate of the other waveguide device. The adhesive is irradiated with UV light through the upper plate, and the end surface of the upper plate made of glass transparent to the ultraviolet light on the upper surface of the PLC waveguide of the other waveguide device and the Si substrate of the one waveguide device. The UV curing adhesive injected between the end faces is irradiated with UV light through the upper plate. As a result, UV light passes through the glass upper plate transparent to the ultraviolet light on one waveguide device side and the glass upper plate transparent to the ultraviolet light on the other waveguide device side. Thus, the entire UV curable adhesive is reached, so that the UV light can sufficiently reach the entire UV curable adhesive in the narrow gap, and the UV curable adhesive can be sufficiently cured. Therefore, it is possible to realize an optical module in which two waveguide devices having the same type of waveguide (PLC waveguide) are joined with higher strength.

  According to the present invention, it is possible to realize an optical module in which two waveguide devices are bonded with high strength using a UV curable adhesive.

Next, embodiments embodying the present invention will be described with reference to the drawings. In the description of each embodiment, similar parts are denoted by the same reference numerals, and redundant description is omitted.
(First embodiment)
An optical module 10 according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a longitudinal sectional view of the optical module 10, and FIG. 2 is a plan view of the optical module 10.

  In the first embodiment, the present invention is applied to an optical module in which two waveguide devices having different types of waveguides are bonded with a UV curable adhesive so that the waveguides are coupled to each other.

  As shown in FIGS. 1 and 2, the optical module 10 is a hybrid optical integrated device manufactured by combining the waveguides of two waveguide devices 20 and 30 each having a PLC waveguide 22 and a semiconductor waveguide 32. is there.

  The optical module 10 includes an upper plate 40 made of glass transparent to ultraviolet light, which is bonded and fixed to the upper surface of one of the two waveguide devices 20 and 30 to which the waveguides are coupled.

  One of the two waveguide devices (hereinafter referred to as “PLC waveguide device”) 20 has a silicon (Si) substrate 21 as a substrate and a PLC waveguide 22 formed on the Si substrate 21. An upper plate 40 made of glass transparent to ultraviolet rays is bonded and fixed to the upper surface of the PLC waveguide 22 of the PLC waveguide device 20. Here, the upper surface of the PLC waveguide 22 refers to the upper surface of the upper clad of the PLC waveguide 22. The upper plate 40 is disposed on the upper surface of the PLC waveguide 22 so that the end surface 40 a coincides with the end surface 21 a of the Si substrate 21.

The PLC waveguide device 20 having the PLC waveguide 22 is manufactured as follows.
A silica material (SiO ₂ -based glass particles) serving as a lower cladding layer and a core layer is deposited on the Si substrate 21 by flame deposition (FHD), and heated to melt and transparentize the glass film. . Thereafter, a desired waveguide is formed by photolithography and reactive ion etching, and an upper cladding is formed again by the FHD method.

  The other of the two waveguide devices (hereinafter referred to as “semiconductor waveguide device”) 30 is a semiconductor having a subcarrier 31 as a substrate and a semiconductor waveguide 32 mounted on the subcarrier 31 (solder mounting). And a waveguide chip 33. The subcarrier 31 is bonded and fixed on the Si bench 34. The subcarrier 31 is made of a semiconductor or a semiconductor compound such as silicon (Si) or aluminum nitride (AlN), for example.

  Further, in the optical module 10, the PLC waveguide device 20 is placed between the end face 40 a of the upper plate 40 and the subcarrier 31 of the semiconductor waveguide device 30 with the vertical relationship between the Si substrate 21 and the PLC waveguide 22 reversed. The end surface 31 a is bonded with a UV curing adhesive 50. The UV curing adhesive 50 is also interposed between the semiconductor waveguide 33 and the PLC waveguide 22 as shown in FIG.

  Thus, before bonding the end surface 40a of the glass upper plate 40 transparent to the ultraviolet rays of the PLC waveguide device 20 and the end surface 31a of the subcarrier 31 of the semiconductor waveguide device 30 with the UV curing adhesive 50, Alignment work of the semiconductor waveguide 32 and the PLC waveguide 22 is performed.

According to 1st Embodiment comprised as mentioned above, there exist the following effects.
When the PLC waveguide device 20 and the semiconductor waveguide device 30 are integrated using the UV curable adhesive 50 so that the PLC waveguide 22 and the semiconductor waveguide 33 are combined, the PLC waveguide device 20 is bonded to the Si substrate. The up-and-down relationship between 21 and the PLC waveguide 22 is reversed (see FIG. 1). In this state, UV curing adhesion is performed between the end face 40 a of the upper plate 40 of the PLC waveguide device 20 and the end face 31 a of the subcarrier 31 of the semiconductor waveguide device 30 and between the semiconductor waveguide 32 and the PLC waveguide 22. Each of the agents 50 is injected. Thereafter, UV light is irradiated from below the upper plate 40 toward the UV curable adhesive 50 through the upper plate 40 made of glass transparent to ultraviolet rays as shown in FIG. At this time, it is preferable to irradiate the UV curable adhesive 50 with UV light also from above.

  Thereby, since UV light permeate | transmits the glass upper board 40 transparent with respect to an ultraviolet-ray and reaches | attains the UV curing adhesive 50, UV light fully reaches | attains the UV curing adhesive 50 whole in a narrow gap | interval. And the entire UV curable adhesive 50 can be sufficiently cured. Therefore, by using the UV curable adhesive 50, it is possible to realize an optical module in which two waveguide devices having different types of waveguides are bonded with high strength.

(Second Embodiment)
An optical module 10A according to the second embodiment will be described with reference to FIGS. FIG. 3 is a longitudinal sectional view of the optical module 10A, and FIG. 4 is a plan view of the optical module 10A.
As shown in FIGS. 3 and 4, the optical module 10 </ b> A is a glass transparent to two ultraviolet rays on the subcarrier 31 of the semiconductor waveguide device 30 in the optical module 10 according to the first embodiment. The upper plates 42 and 43 made by bonding are fixed by adhesion.

  The two upper plates 42 and 43 are disposed on both sides of the semiconductor waveguide chip 33 on the subcarrier 31 so that the end faces 42 a and 43 a coincide with the end face 31 a of the subcarrier 31.

  In the optical module 10A, as in the first embodiment, the end surface 40a of the upper plate 40 bonded and fixed to the upper surface of the PLC waveguide 22 of the PLC waveguide device 20 and the subcarrier 31 of the semiconductor waveguide device 30 are used. The end surface 31a of the two is bonded with a UV curing adhesive 50. At the same time, in the optical module 10 </ b> A, the end surfaces 42 a and 43 a of the upper plates 42 and 43 that are bonded and fixed on the subcarrier 31 and the end surface 21 a of the Si substrate 21 of the PLC waveguide device 20 are bonded with the UV curable adhesive 50. Has been.

According to 2nd Embodiment comprised as mentioned above, there exist the following effects.
When the PLC waveguide device 20 and the semiconductor waveguide device 30 are integrated using the UV curing adhesive 50 so that the PLC waveguide 22 and the semiconductor waveguide 33 are coupled, as in the first embodiment, In the PLC waveguide device 20, the vertical relationship between the Si substrate 21 and the PLC waveguide 22 is reversed (see FIG. 3).

  In this state, between the end face 40a of the upper plate 40 of the PLC waveguide device 20 and the end face 31a of the subcarrier 31 of the semiconductor waveguide device 30, between the semiconductor waveguide 32 and the PLC waveguide 22, and the subcarrier. A UV curable adhesive 50 is injected between the end faces 42 a, 43 a of the upper plates 42, 43 bonded and fixed on 31 and the end face 21 a of the Si substrate 21.

  Thereafter, as shown in FIG. 3, the UV light is irradiated from below the upper plate 40 toward the UV curable adhesive 50 through the glass upper plate 40 transparent to the ultraviolet rays and transparent to the ultraviolet rays. Irradiation is performed from above the upper plates 42 and 43 toward the UV curable adhesive 50 through the upper plates 42 and 43 made of glass.

  As a result, the UV light passes through the upper plate 40 on the upper surface of the PLC waveguide 22 and the upper plates 42 and 43 on the subcarrier 31 to reach the UV curable adhesive 50, so that the UV curable adhesive in a narrow gap is obtained. UV light can sufficiently reach the entire agent 50, and the entire UV curable adhesive 50 can be sufficiently cured. Therefore, it is possible to realize an optical module in which two waveguide devices having different types of waveguides are bonded with higher strength.

(Third embodiment)
Next, an optical module 10B according to a third embodiment will be described with reference to FIGS. FIG. 5 is a longitudinal sectional view showing an optical module 10B according to the third embodiment, and FIG. 6 is a plan view of the optical module 10B.
In the third embodiment, the present invention is applied to an optical module in which two waveguide devices having the same type of waveguide are bonded with a UV curable adhesive so that the waveguides are coupled to each other.

  As shown in FIGS. 5 and 6, the optical module 10 </ b> B is a hybrid optical integrated device manufactured by combining the waveguides of two PLC waveguide devices 20 </ b> A and 20 </ b> B each having a PLC waveguide 22.

  In the optical module 10B, the PLC waveguide of the optical module 10 according to the first embodiment shown in FIG. 1 is formed on the upper surface of the PLC waveguide 22 of one PLC waveguide device 20A of the two PLC waveguide devices 20A and 20B. Similar to the waveguide device 20, a glass upper plate 40 transparent to ultraviolet rays is bonded and fixed.

  Then, as shown in FIGS. 5 and 6, with one PLC waveguide device 20A in an upside-down relationship between the Si substrate 21 and the PLC waveguide 22, the end surface 40a of the upper plate 40 and the other PLC The end surface 21 a of the Si substrate 21 of the waveguide device 20 </ b> B is bonded with a UV curing adhesive 50.

According to 3rd Embodiment comprised as mentioned above, there exist the following effects.
When two PLC waveguide devices 20A, 20B are integrated using a UV curable adhesive 50 so that each PLC waveguide 22, 22 is bonded, one PLC waveguide device 20A is connected to the Si substrate 21. The vertical relationship of the PLC waveguide 22 is reversed. In this state, UV curing adhesive 50 is injected between the end face 40a of the upper plate 40 and the end face 21a of the Si substrate 21 of the other PLC waveguide device 20B and between the two PLC waveguides 22 and 22, respectively. .

  Thereafter, UV light is irradiated from below the upper plate 40 toward the UV curable adhesive 50 through the upper plate 40 made of glass transparent to ultraviolet rays as shown in FIG. At this time, it is preferable to irradiate the UV curable adhesive 50 with UV light also from above.

  Thereby, since the UV light passes through the upper plate 40 and reaches the UV curable adhesive 50, the UV light can sufficiently reach the entire UV curable adhesive 50 in the narrow gap, and the UV curable adhesive 50. The whole can be cured sufficiently. Therefore, it is possible to realize an optical module in which two waveguide devices having the same kind of waveguide (PLC waveguide) are bonded with high strength using a UV curable adhesive.

(Fourth embodiment)
An optical module 10C according to the fourth embodiment will be described with reference to FIGS. FIG. 7 is a longitudinal sectional view of the optical module 10C, and FIG. 8 is a plan view of the optical module 10C.
This optical module 10C is the same as the optical module 10B according to the third embodiment shown in FIG. 5 except that the upper surface of the PLC waveguide 22 of the other PLC waveguide device 20B is also exposed to ultraviolet rays as shown in FIGS. On the other hand, a transparent glass upper plate 44 is bonded and fixed to the upper surface of the PLC waveguide 22.

  Then, with one PLC waveguide device 20A in an upside-down relationship between the Si substrate 21 and the PLC waveguide 22, the end surface 40a of the upper plate 40 and the end surface 21a of the Si substrate 21 of the other PLC waveguide device 20B. Are bonded with a UV curable adhesive 50, and an end surface 44 a of the upper plate 44 and an end surface 21 a of the Si substrate 21 of one PLC waveguide device 20 </ b> A are bonded with a UV curable adhesive 50.

According to 4th Embodiment comprised as mentioned above, there exist the following effects.
When two PLC waveguide devices 20A, 20B are integrated using a UV curable adhesive 50 so that each PLC waveguide device 20A, 20B is bonded, one PLC waveguide device 20A is bonded to the Si substrate 21. And the vertical relationship of the PLC waveguide 22 are reversed. In this state, between the end surface 40a of the upper plate 40 and the end surface 21a of the Si substrate 21 of the other PLC waveguide device 20B, between the two PLC waveguides 22 and 22, and between the end surface 44a of the upper plate 44 and the PLC A UV curing adhesive 50 is injected between the end face 21a of the Si substrate 21 of the waveguide device 20A.

  Thereafter, UV light is irradiated from below the upper plate 40 toward the UV curable adhesive 50 through the glass upper plate 40 transparent to ultraviolet rays, and the UV light is made of glass transparent to ultraviolet rays. Irradiation is performed from above the upper plate 44 toward the UV curing adhesive 50 through the upper plate 44.

  As a result, the UV light passes through the upper plate 40 on the PLC waveguide device 20A side and the upper plate 44 on the PLC waveguide device 20B side and reaches the entire UV curable adhesive 50, so that there is a narrow gap. The UV light can sufficiently reach the entire UV curable adhesive 50, and the UV curable adhesive can be sufficiently cured. Therefore, it is possible to realize an optical module in which two waveguide devices having the same type of waveguide (PLC waveguide) are joined with higher strength.

In addition, this invention can also be changed and embodied as follows.
In each of the above embodiments, two waveguide devices having different types of waveguides, or an optical module in which two waveguide devices of the same type are bonded with a UV curable adhesive so that the waveguides are coupled to each other. However, the present invention is not limited to this. Two or more waveguide devices having different types of waveguides, or two or more waveguide devices having the same kind of waveguides are bonded to an optical module bonded with a UV curable adhesive so that the waveguides are coupled to each other. The present invention is also applicable.

1 is a longitudinal sectional view of an optical module according to a first embodiment of the present invention. The top view which shows the module. The longitudinal cross-sectional view of the optical module which concerns on 2nd Embodiment of this invention. The top view which shows the module. The longitudinal cross-sectional view of the optical module which concerns on 3rd Embodiment of this invention. The top view which shows the module. The longitudinal cross-sectional view of the optical module which concerns on 4th Embodiment of this invention. The top view which shows the module. The longitudinal cross-sectional view of the conventional optical module.

Explanation of symbols

10, 10A, 10B, 10C: Optical module 20, 20A, 20B: PLC waveguide device (waveguide device)
21: Silicon (Si) substrate 22: PLC waveguide 30: Semiconductor waveguide device (waveguide device)
31: Subcarrier 32: Semiconductor waveguide 33: Semiconductor waveguide chip 34: Si bench 40, 42.43, 44: Upper plate 40a, 42a, 43a, 44a made of glass transparent to ultraviolet rays: End face of upper plate 50: UV curing adhesive

Claims (5)

An optical module combining waveguides of two or more waveguide devices each having a waveguide on a substrate ,
One of the two waveguide device waveguide with each other are coupled, the includes a silicon (Si) substrate as the substrate, and a waveguide formed on said Si substrate, to the waveguide upper surface, ultraviolet A transparent glass top plate is bonded and fixed to
Wherein the hand of the two waveguide device, in a state where an inverted hierarchical relationship of the waveguide and the substrate, an end surface of the upper plate, the end face and the UV curing of the other substrate of the two waveguide device An optical module, which is bonded with an adhesive. One of the two waveguide devices has a silicon (Si) substrate as the substrate and a PLC waveguide formed on the Si substrate,
The other of the two waveguide devices has a subcarrier as the substrate, and a semiconductor waveguide chip mounted on the subcarrier and having a semiconductor waveguide,
The upper plate made of glass is bonded and fixed to the upper surface of the PLC waveguide of the one waveguide device,
With the one waveguide device in an upside-down relationship between the Si substrate and the PLC waveguide, the end surface of the upper plate and the end surface of the subcarrier of the other waveguide device are bonded by UV curing. The optical module according to claim 1, wherein the optical module is bonded with an agent. On the subcarrier of the other waveguide device, a glass upper plate transparent to ultraviolet rays is bonded and fixed,
The end surface of the upper plate bonded and fixed to the upper surface of the PLC waveguide and the end surface of the subcarrier of the other waveguide device are bonded with a UV curable adhesive and bonded and fixed on the subcarrier. 3. The optical module according to claim 2, wherein an end face of the upper plate and an end face of the Si substrate of the one waveguide device are bonded with a UV curable adhesive. The two waveguide devices each have a silicon (Si) substrate as the substrate and a PLC waveguide that is a planar lightwave circuit formed on the Si substrate,
An upper plate made of glass transparent to the ultraviolet light is bonded and fixed to the upper surface of the PLC waveguide of the one waveguide device,
In the state in which the one waveguide device has an upside-down relationship between the Si substrate and the PLC waveguide, the end surface of the upper plate and the end surface of the Si substrate of the other waveguide device are bonded by UV curing. The optical module according to claim 1, wherein the optical module is bonded with an agent. The PLC waveguide upper surface of the other waveguide devices, the top plate made of transparent glass are bonded and fixed relative to ultraviolet rays,
The end surface of the upper plate bonded and fixed to the upper surface of the PLC waveguide of the one waveguide device and the end surface of the Si substrate of the other waveguide device are bonded with a UV curable adhesive, The end face of the upper plate bonded and fixed to the upper surface of the PLC waveguide of the other waveguide device and the end face of the Si substrate of the one waveguide device are bonded with a UV curable adhesive. The optical module according to claim 4.

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