JP4933894B2 - 気化器モジュール - Google Patents
気化器モジュール Download PDFInfo
- Publication number
- JP4933894B2 JP4933894B2 JP2006509732A JP2006509732A JP4933894B2 JP 4933894 B2 JP4933894 B2 JP 4933894B2 JP 2006509732 A JP2006509732 A JP 2006509732A JP 2006509732 A JP2006509732 A JP 2006509732A JP 4933894 B2 JP4933894 B2 JP 4933894B2
- Authority
- JP
- Japan
- Prior art keywords
- vaporizer
- flow controller
- teos
- substrate
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
Description
Claims (7)
- 気化器モジュールであって、
液体流量コントローラと、
前記流量コントローラと協働し、所定温度で前記流量コントローラを維持する温度コントローラと、
前記流量コントローラに結合された入口、前記半導体処理チャンバにガス状の前駆体を流すように適合された出口を有する気化器と、
前記流量コントローラに結合されたヒートシンクと、
前記ヒートシンクの近傍に配置され、前記ヒートシンクと協働して前記流量コントローラを冷却するファンと、
を備える、前記気化器モジュール。 - 前記気化器と前記流量コントローラの間に配置された断熱部材を更に備える、請求項1記載の気化器モジュール。
- 前記断熱部材は、少なくともシリコンゴムで部分的に製造されている、請求項2記載の気化器モジュール。
- 前記気化器と流量コントローラを収容する容器を更に備える、請求項2記載の気化器モジュール。
- 前記気化器は、90℃から150℃の範囲内の温度まで加熱され、前記流量コントローラは、25℃で維持される、請求項1記載の気化器モジュール。
- 気化器モジュールであって、
液体流量コントローラと、
前記流量コントローラと協働し、所定温度で前記流量コントローラを維持する温度コントローラと、
前記流量コントローラに結合された入口、前記半導体処理チャンバにガス状の前駆体を流すように適合された出口を有する気化器と、
第1側部を有する少なくとも0.3175センチメートルの厚みを有する第1の熱伝導性プレートと、
前記気化器を画成する為に前記第1のプレートに結合された第2の熱伝導性プレートと、
前記第1のプレート内で少なくとも部分的に機械加工され、前記第2のプレートにより覆われ、前記気化器の前記入口及び出口を結合する、複数の溝と、
を備える、前記気化器モジュール。 - 前記出口に結合され、0.3556から0.47498センチメートルのオリフィスを有する制限装置を更に備える、請求項1記載の気化器モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/409,466 | 2003-04-07 | ||
US10/409,466 US7031600B2 (en) | 2003-04-07 | 2003-04-07 | Method and apparatus for silicon oxide deposition on large area substrates |
PCT/US2004/010543 WO2004093163A2 (en) | 2003-04-07 | 2004-04-05 | Method and apparatus for silicone oxide deposition on large area substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006522495A JP2006522495A (ja) | 2006-09-28 |
JP4933894B2 true JP4933894B2 (ja) | 2012-05-16 |
Family
ID=33097841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006509732A Expired - Fee Related JP4933894B2 (ja) | 2003-04-07 | 2004-04-05 | 気化器モジュール |
Country Status (7)
Country | Link |
---|---|
US (2) | US7031600B2 (ja) |
EP (1) | EP1644972A2 (ja) |
JP (1) | JP4933894B2 (ja) |
KR (1) | KR101160357B1 (ja) |
CN (3) | CN101319311B (ja) |
TW (1) | TWI297739B (ja) |
WO (1) | WO2004093163A2 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040237889A1 (en) * | 2003-05-28 | 2004-12-02 | Winbond Electronics Corporation | Chemical gas deposition process and dry etching process and apparatus of same |
US9725805B2 (en) * | 2003-06-27 | 2017-08-08 | Spts Technologies Limited | Apparatus and method for controlled application of reactive vapors to produce thin films and coatings |
US20050109276A1 (en) * | 2003-11-25 | 2005-05-26 | Applied Materials, Inc. | Thermal chemical vapor deposition of silicon nitride using BTBAS bis(tertiary-butylamino silane) in a single wafer chamber |
US20050223986A1 (en) * | 2004-04-12 | 2005-10-13 | Choi Soo Y | Gas diffusion shower head design for large area plasma enhanced chemical vapor deposition |
CN1954094A (zh) * | 2004-05-20 | 2007-04-25 | 阿克佐诺贝尔股份有限公司 | 用于固体化学制品持续蒸汽发送的起泡器 |
DE102004061095A1 (de) * | 2004-12-18 | 2006-06-22 | Aixtron Ag | Vorrichtung zur temperierten Aufbewahrung eines Behälters |
US8709162B2 (en) * | 2005-08-16 | 2014-04-29 | Applied Materials, Inc. | Active cooling substrate support |
US20070082507A1 (en) * | 2005-10-06 | 2007-04-12 | Applied Materials, Inc. | Method and apparatus for the low temperature deposition of doped silicon nitride films |
US7501355B2 (en) * | 2006-06-29 | 2009-03-10 | Applied Materials, Inc. | Decreasing the etch rate of silicon nitride by carbon addition |
US20100047954A1 (en) * | 2007-08-31 | 2010-02-25 | Su Tzay-Fa Jeff | Photovoltaic production line |
KR20100051738A (ko) * | 2007-08-31 | 2010-05-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 광전지 생산 라인 |
US8168268B2 (en) * | 2008-12-12 | 2012-05-01 | Ovishinsky Innovation, LLC | Thin film deposition via a spatially-coordinated and time-synchronized process |
US8965185B2 (en) * | 2009-03-02 | 2015-02-24 | Btu International, Inc. | Infrared furnace system |
US20120009347A1 (en) * | 2010-07-07 | 2012-01-12 | Applied Materials, Inc. | Precise temperature control for teos application by heat transfer fluid |
JP6303733B2 (ja) * | 2014-03-31 | 2018-04-04 | ソニー株式会社 | 磁気記録媒体およびその製造方法、ならびに成膜装置 |
US9953843B2 (en) * | 2016-02-05 | 2018-04-24 | Lam Research Corporation | Chamber for patterning non-volatile metals |
KR102338026B1 (ko) * | 2017-07-25 | 2021-12-10 | 가부시키가이샤 후지킨 | 유체 제어 장치 |
FR3079345B1 (fr) * | 2018-03-26 | 2020-02-21 | Soitec | Procede de fabrication d'un substrat pour dispositif radiofrequence |
CN112342531A (zh) * | 2020-10-19 | 2021-02-09 | 绍兴同芯成集成电路有限公司 | 一种利用低频射频电浆制备ild绝缘层的晶圆制造工艺 |
Family Cites Families (17)
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EP0058571A1 (en) | 1981-02-18 | 1982-08-25 | National Research Development Corporation | Method and apparatus for delivering a controlled flow rate of reactant to a vapour deposition process |
US4872947A (en) * | 1986-12-19 | 1989-10-10 | Applied Materials, Inc. | CVD of silicon oxide using TEOS decomposition and in-situ planarization process |
US5000113A (en) | 1986-12-19 | 1991-03-19 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
ZA884511B (en) * | 1987-07-15 | 1989-03-29 | Boc Group Inc | Method of plasma enhanced silicon oxide deposition |
JP2631481B2 (ja) | 1987-12-08 | 1997-07-16 | 株式会社 リンテック | 質量流量計とその計測方法 |
JPH0784662B2 (ja) * | 1989-12-12 | 1995-09-13 | アプライドマテリアルズジャパン株式会社 | 化学的気相成長方法とその装置 |
US5078092A (en) * | 1989-12-22 | 1992-01-07 | Corning Incorporated | Flash vaporizer system for use in manufacturing optical waveguide fiber |
JPH0795527B2 (ja) | 1991-02-05 | 1995-10-11 | 株式会社リンテック | 液体原料用気化供給器 |
JPH06291040A (ja) | 1992-03-03 | 1994-10-18 | Rintetsuku:Kk | 液体気化供給方法と液体気化供給器 |
JPH1089532A (ja) | 1995-12-13 | 1998-04-10 | Rintetsuku:Kk | 気化装置の弁構造 |
JPH10150030A (ja) * | 1996-11-19 | 1998-06-02 | Kokusai Electric Co Ltd | 成膜装置 |
US5849089A (en) | 1997-03-14 | 1998-12-15 | Kabushiki Kaisha Toshiba | Evaporator for liquid raw material and evaporation method therefor |
JP2000017457A (ja) * | 1998-07-03 | 2000-01-18 | Shincron:Kk | 薄膜形成装置および薄膜形成方法 |
US6261374B1 (en) | 1998-09-29 | 2001-07-17 | Applied Materials, Inc. | Clog resistant gas delivery system |
DE29903296U1 (de) * | 1999-02-24 | 2000-08-03 | Cpc Cellular Process Chemistry | Mikroreaktor |
JP2001104769A (ja) | 1999-10-04 | 2001-04-17 | Mitsui Eng & Shipbuild Co Ltd | 揮発性物質の供給装置およびその制御方法 |
KR100436657B1 (ko) * | 2001-12-17 | 2004-06-22 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 가열 및 냉각장치 |
-
2003
- 2003-04-07 US US10/409,466 patent/US7031600B2/en not_active Expired - Lifetime
-
2004
- 2004-04-05 WO PCT/US2004/010543 patent/WO2004093163A2/en not_active Application Discontinuation
- 2004-04-05 CN CN2008100926851A patent/CN101319311B/zh not_active Expired - Fee Related
- 2004-04-05 JP JP2006509732A patent/JP4933894B2/ja not_active Expired - Fee Related
- 2004-04-05 KR KR1020057017242A patent/KR101160357B1/ko active IP Right Grant
- 2004-04-05 CN CNB2004800067720A patent/CN100555581C/zh not_active Expired - Fee Related
- 2004-04-05 CN CN2009101690107A patent/CN101643896B/zh not_active Expired - Fee Related
- 2004-04-05 EP EP04759158A patent/EP1644972A2/en not_active Withdrawn
- 2004-04-07 TW TW093109649A patent/TWI297739B/zh not_active IP Right Cessation
-
2006
- 2006-02-07 US US11/348,595 patent/US20060127068A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US7031600B2 (en) | 2006-04-18 |
WO2004093163A2 (en) | 2004-10-28 |
CN101319311B (zh) | 2011-06-22 |
TW200427862A (en) | 2004-12-16 |
KR101160357B1 (ko) | 2012-06-26 |
CN1759476A (zh) | 2006-04-12 |
CN101319311A (zh) | 2008-12-10 |
TWI297739B (en) | 2008-06-11 |
CN100555581C (zh) | 2009-10-28 |
US20040194701A1 (en) | 2004-10-07 |
US20060127068A1 (en) | 2006-06-15 |
CN101643896A (zh) | 2010-02-10 |
EP1644972A2 (en) | 2006-04-12 |
WO2004093163A3 (en) | 2004-12-23 |
CN101643896B (zh) | 2013-04-17 |
JP2006522495A (ja) | 2006-09-28 |
KR20050120641A (ko) | 2005-12-22 |
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