JP4925571B2 - 基板の熱的性質判定方法及び熱処理条件の決定方法 - Google Patents
基板の熱的性質判定方法及び熱処理条件の決定方法 Download PDFInfo
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- JP4925571B2 JP4925571B2 JP2004232584A JP2004232584A JP4925571B2 JP 4925571 B2 JP4925571 B2 JP 4925571B2 JP 2004232584 A JP2004232584 A JP 2004232584A JP 2004232584 A JP2004232584 A JP 2004232584A JP 4925571 B2 JP4925571 B2 JP 4925571B2
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- 238000010438 heat treatment Methods 0.000 title claims description 113
- 239000000758 substrate Substances 0.000 title claims description 97
- 238000000034 method Methods 0.000 title claims description 39
- 238000012545 processing Methods 0.000 claims description 34
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 128
- 230000002093 peripheral effect Effects 0.000 description 29
- 238000005336 cracking Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000012937 correction Methods 0.000 description 5
- 239000012466 permeate Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012886 linear function Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Toxicology (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Description
(急速熱処理装置)
まず、図1〜図5を参照して急速熱処理装置(RTP装置)について説明する。図1は、急速熱処理装置の一例を示す斜視図(一部断面図)であり、図2は、図1の急速熱処理装置の部分拡大断面図である。急速熱処理装置1は、例えば、シリコンウェハ等のウェハW(基板)を温度制御しながら熱処理を行うための枚葉式急速熱処理装置である。急速熱処理装置1は、例えばLSI等の半導体デバイスの製造に用いられる。急速熱処理装置1はベース部2a、側壁部2b及び蓋部2cから構成されるチャンバ2を備える。
次に、第1実施形態に係る基板の熱的性質判定方法及び熱処理条件の決定方法について説明する。本実施形態に係る基板の熱的性質判定方法は、急速熱処理装置1を用いて好適に実施される。また、本実施形態に係る熱処理条件の決定方法は、上述のオープンループステップL1及びクローズドループステップL2を含む急速熱処理に先立って、急速熱処理装置1を用いて好適に実施される。
まず、上記波形UA,UHで表される温度データの最大値T1max、及び、最大値T1maxと最小値T1minとの差ΔT1を用いて、下記式(1)で表される吸収補正係数Kabを定義する。
Kab=1−(ΔT1/T1max) … (1)
G1=p×(Kab)・(T1min)+q … (2)
一方、中央ランプパワーG1の決定とは別に、面内温度差ΔTを最小にする比率G2/G1の算出を行う。まず、比率G2/G1について図10(A)及び図10(B)を用いて説明する。
上述のようにして得られた中央ランプパワーG1及び比率G2/G1を用いて周縁ランプパワーG2を決定する。
次に、第2実施形態に係る基板の熱的性質判定方法及び熱処理条件の決定方法について説明する。本実施形態に係る基板の熱的性質判定方法は、急速熱処理装置1を用いて好適に実施される。また、本実施形態に係る熱処理条件の決定方法は、上述のオープンループステップL1及びクローズドループステップL2を含む急速熱処理に先立って、急速熱処理装置1を用いて好適に実施される。
Claims (6)
- 基板を加熱するためのランプと、前記ランプに対向配置された温度センサとを備え、前記基板は、前記ランプと前記温度センサとの間に配置され、前記ランプからの放射エネルギーによって基板が加熱されるとき、前記温度センサには、前記基板における、前記ランプからの放射エネルギーの吸収に係り、前記基板の裏面から輻射されるエネルギー(吸収成分)とともに前記ランプから前記基板を透過した放射透過エネルギー(透過成分)が入射される、急速熱処理装置に適用される基板の熱的性質判定方法であって、
前記ランプを用いてパルス加熱を施しながら、前記温度センサから逐次出力される温度データを得る工程と、ここに、前記パルス加熱は、前記基板に温度の低下がもたらされる冷却期間と前記基板に温度の上昇がもたらされる加熱期間とが交互に繰り返される加熱方式であること、
前記温度データを用いて前記基板の熱的性質を判定する工程と、
を含む基板の熱的性質判定方法。 - 前記パルス加熱におけるパルス幅は、1秒以上である請求項1に記載の基板の熱的性質
判定方法。 - 前記パルス加熱におけるパルス幅は、10秒以下である請求項1又は2に記載の基板の
熱的性質判定方法。 - 前記基板の熱的性質を判定する工程が、
前記逐次出力される温度データから、前記基板の温度の最大値及び最小値を判定するス
テップと、
前記パルス加熱によって前記基板がどのくらい温まりやすいのかを、前記温度の最大値
及び最小値により判定するステップと、
を含む、請求項1又は2に記載の基板の熱的性質判定方法。 - 前記基板の熱的性質を判定する工程が、
前記逐次出力される温度データから、前記基板の温度の最大値及び最小値を判定するス
テップと、
前記基板がどのくらいエネルギー線を透過しやすいのかを、前記温度の最大値と最小値
との差により判定するステップと、
を含む、請求項1又は2に記載の基板の熱的性質判定方法。 - 前記基板の熱的性質を判定する工程が、
前記逐次出力される温度データから、前記基板の温度の波形を記録するステップと、
前記基板がどのくらいエネルギー線を透過しやすいのかを、前記波形の形により判定するステップと、
を含む、請求項1又は2に記載の基板の熱的性質判定方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004232584A JP4925571B2 (ja) | 2004-08-09 | 2004-08-09 | 基板の熱的性質判定方法及び熱処理条件の決定方法 |
PCT/JP2005/014577 WO2006016579A1 (ja) | 2004-08-09 | 2005-08-09 | 基板の熱的性質判定方法及び熱処理条件の決定方法 |
US11/573,257 US8308350B2 (en) | 2004-08-09 | 2005-08-09 | Method of determining thermal property of substrate and method of deciding heat treatment condition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004232584A JP4925571B2 (ja) | 2004-08-09 | 2004-08-09 | 基板の熱的性質判定方法及び熱処理条件の決定方法 |
Publications (2)
Publication Number | Publication Date |
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JP2006054214A JP2006054214A (ja) | 2006-02-23 |
JP4925571B2 true JP4925571B2 (ja) | 2012-04-25 |
Family
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JP2004232584A Expired - Fee Related JP4925571B2 (ja) | 2004-08-09 | 2004-08-09 | 基板の熱的性質判定方法及び熱処理条件の決定方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8308350B2 (ja) |
JP (1) | JP4925571B2 (ja) |
WO (1) | WO2006016579A1 (ja) |
Families Citing this family (11)
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US7398693B2 (en) * | 2006-03-30 | 2008-07-15 | Applied Materials, Inc. | Adaptive control method for rapid thermal processing of a substrate |
JP5562529B2 (ja) * | 2008-04-17 | 2014-07-30 | 大日本スクリーン製造株式会社 | 熱処理装置 |
WO2009135137A2 (en) | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | System for non radial temperature control for rotating substrates |
WO2013112313A1 (en) * | 2012-01-26 | 2013-08-01 | Applied Materials, Inc. | Thermal processing chamber with top substrate support assembly |
US9568443B2 (en) | 2012-10-15 | 2017-02-14 | Board Of Trustees Of Michigan State University | Testing system for estimating thermal properties of a material |
US9756579B2 (en) | 2013-10-18 | 2017-09-05 | Board Of Trustees Of Michigan State University | Near field communication system and method for controlling transmission power of near field communication system |
JP6150937B2 (ja) * | 2014-03-25 | 2017-06-21 | 株式会社日立国際電気 | 基板処理装置、温度制御方法及び半導体装置の製造方法並びに記録媒体 |
US10840114B1 (en) * | 2016-07-26 | 2020-11-17 | Raytheon Company | Rapid thermal anneal apparatus and method |
JP6820717B2 (ja) | 2016-10-28 | 2021-01-27 | 株式会社日立ハイテク | プラズマ処理装置 |
US20210366791A1 (en) * | 2018-11-27 | 2021-11-25 | Hitachi High-Technologies Corporation | Plasma processing device and method for processing sample using same |
JP7312020B2 (ja) | 2019-05-30 | 2023-07-20 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
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2004
- 2004-08-09 JP JP2004232584A patent/JP4925571B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-09 US US11/573,257 patent/US8308350B2/en not_active Expired - Fee Related
- 2005-08-09 WO PCT/JP2005/014577 patent/WO2006016579A1/ja active Application Filing
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Publication number | Publication date |
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US20070291818A1 (en) | 2007-12-20 |
JP2006054214A (ja) | 2006-02-23 |
US8308350B2 (en) | 2012-11-13 |
WO2006016579A1 (ja) | 2006-02-16 |
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