JP4916651B2 - 発光装置及び蛍光体 - Google Patents

発光装置及び蛍光体 Download PDF

Info

Publication number
JP4916651B2
JP4916651B2 JP2004248471A JP2004248471A JP4916651B2 JP 4916651 B2 JP4916651 B2 JP 4916651B2 JP 2004248471 A JP2004248471 A JP 2004248471A JP 2004248471 A JP2004248471 A JP 2004248471A JP 4916651 B2 JP4916651 B2 JP 4916651B2
Authority
JP
Japan
Prior art keywords
light
phosphor
emitting device
light emitting
light emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004248471A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005150691A5 (enExample
JP2005150691A (ja
Inventor
正彦 吉野
直人 木島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2004248471A priority Critical patent/JP4916651B2/ja
Publication of JP2005150691A publication Critical patent/JP2005150691A/ja
Publication of JP2005150691A5 publication Critical patent/JP2005150691A5/ja
Application granted granted Critical
Publication of JP4916651B2 publication Critical patent/JP4916651B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
JP2004248471A 2003-08-28 2004-08-27 発光装置及び蛍光体 Expired - Fee Related JP4916651B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004248471A JP4916651B2 (ja) 2003-08-28 2004-08-27 発光装置及び蛍光体

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003305020 2003-08-28
JP2003305020 2003-08-28
JP2003361114 2003-10-21
JP2003361114 2003-10-21
JP2004248471A JP4916651B2 (ja) 2003-08-28 2004-08-27 発光装置及び蛍光体

Publications (3)

Publication Number Publication Date
JP2005150691A JP2005150691A (ja) 2005-06-09
JP2005150691A5 JP2005150691A5 (enExample) 2007-10-04
JP4916651B2 true JP4916651B2 (ja) 2012-04-18

Family

ID=34704843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004248471A Expired - Fee Related JP4916651B2 (ja) 2003-08-28 2004-08-27 発光装置及び蛍光体

Country Status (1)

Country Link
JP (1) JP4916651B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7452483B2 (en) * 2004-09-30 2008-11-18 Global Tungsten & Powders Corp. Yellow-emitting phosphor blend for electroluminescent lamps
US20090008663A1 (en) * 2005-02-28 2009-01-08 Mitshubishi Chemcial Phosphor and method for production thereof, and application thereof
EP1895599B1 (en) * 2005-06-15 2019-09-04 Nichia Corporation Light emitting device
CN101799126B (zh) * 2005-06-28 2014-05-28 首尔伟傲世有限公司 用于交流电力操作的发光装置
WO2007018260A1 (ja) * 2005-08-10 2007-02-15 Mitsubishi Chemical Corporation 蛍光体及びそれを用いた発光装置
JP2008050493A (ja) * 2006-08-25 2008-03-06 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置
WO2009017206A1 (ja) * 2007-08-01 2009-02-05 Mitsubishi Chemical Corporation 蛍光体及びその製造方法、結晶性窒化珪素及びその製造方法、蛍光体含有組成物、並びに、該蛍光体を用いた発光装置、画像表示装置及び照明装置
JP5075552B2 (ja) * 2007-09-25 2012-11-21 株式会社東芝 蛍光体およびそれを用いたｌｅｄランプ
US8487330B2 (en) 2007-12-07 2013-07-16 Kabushiki Kaisha Toshiba Phosphor and LED light-emitting device using the same
JP5406639B2 (ja) * 2009-08-31 2014-02-05 カシオ計算機株式会社 光源装置及びプロジェクタ
JP5740017B2 (ja) * 2012-03-30 2015-06-24 コバレントマテリアル株式会社 セラミックス複合体
JPWO2015099145A1 (ja) * 2013-12-27 2017-03-23 国立大学法人京都大学 蛍光体、及び蛍光体の製造方法
KR102069081B1 (ko) 2015-06-12 2020-01-22 가부시끼가이샤 도시바 형광체 및 그 제조 방법, 그리고 led 램프

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE252814T1 (de) * 1999-07-23 2003-11-15 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Leuchstoff für lichtquellen und zugehörige lichtquelle

Also Published As

Publication number Publication date
JP2005150691A (ja) 2005-06-09

Similar Documents

Publication Publication Date Title
US7704410B2 (en) Light-emitting device and phosphor
JP4032682B2 (ja) 蛍光体
EP1484803B1 (en) Light emitting device and illuminating device using it
JP4916651B2 (ja) 発光装置及び蛍光体
US8440104B2 (en) Kimzeyite garnet phosphors
JP4168776B2 (ja) 発光装置及びそれを用いた照明装置
JP4411841B2 (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP4165255B2 (ja) 発光装置及びそれを用いた照明装置
JP2004235546A (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP2005298805A (ja) 発光装置及び照明装置
JP2004253747A (ja) 発光装置及びそれを用いた照明装置
JP5326986B2 (ja) 発光装置に用いる蛍光体
JP4972904B2 (ja) 蛍光体、その蛍光体の製造方法、その蛍光体を用いた発光装置、画像表示装置及び照明装置
JP4656109B2 (ja) 蛍光体
JP4561064B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP4246502B2 (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP2010059429A (ja) 蛍光体、それを用いた発光装置、画像表示装置及び照明装置
JP4604516B2 (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
CN100473895C (zh) 发光装置和萤光体
JP4433847B2 (ja) 蛍光体、それを用いた発光装置、画像表示装置及び照明装置
JP4337468B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP4337465B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP2005064189A (ja) 発光装置及び照明装置ならびに画像表示装置
JP2015183084A (ja) 紫光励起用蛍光体、該蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、該発光装置を用いた照明装置及び画像表示装置
JP4380118B2 (ja) 発光装置及びそれを用いた照明装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070822

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070822

RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20090618

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100622

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100622

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100730

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101019

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110119

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110302

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20110307

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20110415

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120125

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150203

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4916651

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees