JP4896963B2 - ウエハ状計測装置及びその製造方法 - Google Patents

ウエハ状計測装置及びその製造方法 Download PDF

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Publication number
JP4896963B2
JP4896963B2 JP2008510776A JP2008510776A JP4896963B2 JP 4896963 B2 JP4896963 B2 JP 4896963B2 JP 2008510776 A JP2008510776 A JP 2008510776A JP 2008510776 A JP2008510776 A JP 2008510776A JP 4896963 B2 JP4896963 B2 JP 4896963B2
Authority
JP
Japan
Prior art keywords
wafer
bonding layer
bonding
substrate
forming step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008510776A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2007119359A1 (ja
Inventor
健志 枩田
朋秀 南
良樹 山西
宗生 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008510776A priority Critical patent/JP4896963B2/ja
Publication of JPWO2007119359A1 publication Critical patent/JPWO2007119359A1/ja
Application granted granted Critical
Publication of JP4896963B2 publication Critical patent/JP4896963B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2008510776A 2006-03-16 2007-03-14 ウエハ状計測装置及びその製造方法 Expired - Fee Related JP4896963B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008510776A JP4896963B2 (ja) 2006-03-16 2007-03-14 ウエハ状計測装置及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006073052 2006-03-16
JP2006073052 2006-03-16
PCT/JP2007/055084 WO2007119359A1 (ja) 2006-03-16 2007-03-14 ウエハ状計測装置及びその製造方法
JP2008510776A JP4896963B2 (ja) 2006-03-16 2007-03-14 ウエハ状計測装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2007119359A1 JPWO2007119359A1 (ja) 2009-08-27
JP4896963B2 true JP4896963B2 (ja) 2012-03-14

Family

ID=38609155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008510776A Expired - Fee Related JP4896963B2 (ja) 2006-03-16 2007-03-14 ウエハ状計測装置及びその製造方法

Country Status (4)

Country Link
US (1) US20090085031A1 (cg-RX-API-DMAC7.html)
JP (1) JP4896963B2 (cg-RX-API-DMAC7.html)
TW (1) TW200741934A (cg-RX-API-DMAC7.html)
WO (1) WO2007119359A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020040381A1 (ko) * 2018-08-22 2020-02-27 한국표준과학연구원 다층 저항-열전식 온도측정 웨이퍼 센서 및 그 제조 방법

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* Cited by examiner, † Cited by third party
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JP2009528692A (ja) * 2006-04-20 2009-08-06 エヌエックスピー ビー ヴィ 半導体基板の温度を測定する方法および装置
US8104342B2 (en) * 2007-02-23 2012-01-31 Kla-Tencor Corporation Process condition measuring device
JP5476114B2 (ja) 2009-12-18 2014-04-23 東京エレクトロン株式会社 温度測定用装置
JP5314664B2 (ja) * 2010-12-24 2013-10-16 東京エレクトロン株式会社 物理量計測装置及び物理量計測方法
US10215786B2 (en) * 2011-12-23 2019-02-26 Sanofi-Aventis Deutschland Gmbh Sensor arrangement for a packaging of a medicament
KR20150130367A (ko) * 2013-03-07 2015-11-23 스미또모 베이크라이트 가부시키가이샤 장치, 접착제용 조성물, 접착 시트
CN103258772B (zh) * 2013-05-02 2016-02-10 苏州日月新半导体有限公司 打线工艺的加热座及加热装置
JP6094392B2 (ja) * 2013-06-11 2017-03-15 株式会社デンソー 半導体装置
CN107850854B (zh) 2015-07-16 2020-08-11 Asml荷兰有限公司 检查衬底和检查方法
CN111742203B (zh) * 2018-03-15 2023-03-10 贺利氏先进传感器技术有限公司 温度传感器元件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06137960A (ja) * 1992-10-29 1994-05-20 Kyocera Corp 温度センサ
JPH109963A (ja) * 1996-06-19 1998-01-16 Yamari Sangyo Kk 測温抵抗体素子によるシリコンウェハー等の温度計測構造

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1018844B (zh) * 1990-06-02 1992-10-28 中国科学院兰州化学物理研究所 防锈干膜润滑剂
US5141334A (en) * 1991-09-24 1992-08-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Sub-kelvin resistance thermometer
JPH09166501A (ja) * 1995-12-13 1997-06-24 Oki Electric Ind Co Ltd 温度測定装置及び温度測定方法
US6744346B1 (en) * 1998-02-27 2004-06-01 Micron Technology, Inc. Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
JP2001289715A (ja) * 2000-04-05 2001-10-19 Yamari Sangyo Kk 測温基板
JP2002202204A (ja) * 2000-12-28 2002-07-19 Sensarray Japan Corp 温度計測用球状半導体デバイス
JP4486289B2 (ja) * 2001-03-30 2010-06-23 株式会社デンソー フローセンサ及びその製造方法
US6919730B2 (en) * 2002-03-18 2005-07-19 Honeywell International, Inc. Carbon nanotube sensor
US6870270B2 (en) * 2002-12-28 2005-03-22 Intel Corporation Method and structure for interfacing electronic devices
JP2005340291A (ja) * 2004-05-24 2005-12-08 Komatsu Ltd 基板熱状態測定装置及び基板熱状態分析制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06137960A (ja) * 1992-10-29 1994-05-20 Kyocera Corp 温度センサ
JPH109963A (ja) * 1996-06-19 1998-01-16 Yamari Sangyo Kk 測温抵抗体素子によるシリコンウェハー等の温度計測構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020040381A1 (ko) * 2018-08-22 2020-02-27 한국표준과학연구원 다층 저항-열전식 온도측정 웨이퍼 센서 및 그 제조 방법

Also Published As

Publication number Publication date
TW200741934A (en) 2007-11-01
US20090085031A1 (en) 2009-04-02
JPWO2007119359A1 (ja) 2009-08-27
TWI331785B (cg-RX-API-DMAC7.html) 2010-10-11
WO2007119359A1 (ja) 2007-10-25

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