JP4896778B2 - 搭載装置およびその制御方法 - Google Patents

搭載装置およびその制御方法 Download PDF

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Publication number
JP4896778B2
JP4896778B2 JP2007062769A JP2007062769A JP4896778B2 JP 4896778 B2 JP4896778 B2 JP 4896778B2 JP 2007062769 A JP2007062769 A JP 2007062769A JP 2007062769 A JP2007062769 A JP 2007062769A JP 4896778 B2 JP4896778 B2 JP 4896778B2
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Prior art keywords
ball
workpiece
mask
wafer
camera
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Expired - Fee Related
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JP2007062769A
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Japanese (ja)
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JP2008227118A (ja
JP2008227118A5 (cg-RX-API-DMAC10.html
Inventor
成司 永田
邦一 浅野
利幸 小竹
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Athlete FA Corp
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Athlete FA Corp
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Priority to JP2007062769A priority Critical patent/JP4896778B2/ja
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Publication of JP2008227118A5 publication Critical patent/JP2008227118A5/ja
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JP2007062769A 2007-03-13 2007-03-13 搭載装置およびその制御方法 Expired - Fee Related JP4896778B2 (ja)

Priority Applications (1)

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JP2007062769A JP4896778B2 (ja) 2007-03-13 2007-03-13 搭載装置およびその制御方法

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Application Number Priority Date Filing Date Title
JP2007062769A JP4896778B2 (ja) 2007-03-13 2007-03-13 搭載装置およびその制御方法

Publications (3)

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JP2008227118A JP2008227118A (ja) 2008-09-25
JP2008227118A5 JP2008227118A5 (cg-RX-API-DMAC10.html) 2010-05-27
JP4896778B2 true JP4896778B2 (ja) 2012-03-14

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JP2007062769A Expired - Fee Related JP4896778B2 (ja) 2007-03-13 2007-03-13 搭載装置およびその制御方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5189002B2 (ja) * 2009-01-27 2013-04-24 ミナミ株式会社 基板へのフラックス印刷及びはんだボール搭載装置
JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
US10879102B2 (en) * 2017-08-07 2020-12-29 Boston Process Technologies, Inc Flux-free solder ball mount arrangement
JP2023061572A (ja) 2021-10-20 2023-05-02 株式会社ディスコ 基準マーク形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682145B2 (ja) * 1989-06-16 1997-11-26 松下電器産業株式会社 スクリーン印刷装置及びスクリーン印刷方法
JPH0434756Y2 (cg-RX-API-DMAC10.html) * 1989-10-02 1992-08-18
JPH0976454A (ja) * 1995-09-18 1997-03-25 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP3310540B2 (ja) * 1996-05-22 2002-08-05 松下電器産業株式会社 スクリーン印刷方法とその装置
JP2004273774A (ja) * 2003-03-10 2004-09-30 Yokogawa Electric Corp 基板用印刷装置
JP2005166859A (ja) * 2003-12-02 2005-06-23 Athlete Fa Kk ボール搭載装置
JP4255438B2 (ja) * 2004-12-13 2009-04-15 アスリートＦａ株式会社 微小粒子の配置方法および装置

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JP2008227118A (ja) 2008-09-25

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