JP4894713B2 - 偏光板、画像表示装置 - Google Patents

偏光板、画像表示装置 Download PDF

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Publication number
JP4894713B2
JP4894713B2 JP2007270708A JP2007270708A JP4894713B2 JP 4894713 B2 JP4894713 B2 JP 4894713B2 JP 2007270708 A JP2007270708 A JP 2007270708A JP 2007270708 A JP2007270708 A JP 2007270708A JP 4894713 B2 JP4894713 B2 JP 4894713B2
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Japan
Prior art keywords
film
polarizing
bonding
substrate
bonding film
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Expired - Fee Related
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JP2007270708A
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English (en)
Japanese (ja)
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JP2009098465A5 (enrdf_load_stackoverflow
JP2009098465A (ja
Inventor
泰秀 松尾
賢治 大塚
和央 樋口
康介 若松
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2007270708A priority Critical patent/JP4894713B2/ja
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  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Polarising Elements (AREA)
JP2007270708A 2007-10-17 2007-10-17 偏光板、画像表示装置 Expired - Fee Related JP4894713B2 (ja)

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JP2007270708A JP4894713B2 (ja) 2007-10-17 2007-10-17 偏光板、画像表示装置

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JP2007270708A JP4894713B2 (ja) 2007-10-17 2007-10-17 偏光板、画像表示装置

Publications (3)

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JP2009098465A JP2009098465A (ja) 2009-05-07
JP2009098465A5 JP2009098465A5 (enrdf_load_stackoverflow) 2010-12-02
JP4894713B2 true JP4894713B2 (ja) 2012-03-14

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JP2007270708A Expired - Fee Related JP4894713B2 (ja) 2007-10-17 2007-10-17 偏光板、画像表示装置

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JP (1) JP4894713B2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4946780B2 (ja) * 2007-10-17 2012-06-06 セイコーエプソン株式会社 接合膜付き偏光板、画像表示装置
JP5125719B2 (ja) * 2008-04-17 2013-01-23 セイコーエプソン株式会社 波長板及びこれを用いた光ピックアップ装置並びにプロジェクタ
JP5195354B2 (ja) * 2008-12-01 2013-05-08 セイコーエプソン株式会社 光学素子
JP5299022B2 (ja) * 2009-03-27 2013-09-25 セイコーエプソン株式会社 光学物品の製造方法
JP2011237767A (ja) * 2010-04-15 2011-11-24 Seiko Epson Corp 光学素子
JP2012226000A (ja) * 2011-04-15 2012-11-15 Seiko Epson Corp 光学素子、投射型映像装置及び光学素子の製造方法
JP5767890B2 (ja) * 2011-08-05 2015-08-26 日東電工株式会社 偏光フィルムの製造方法
JP5838646B2 (ja) * 2011-08-10 2016-01-06 セイコーエプソン株式会社 投射型映像装置及び投射型映像装置の光学素子の製造方法
US8431436B1 (en) * 2011-11-03 2013-04-30 International Business Machines Corporation Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding
KR20230131283A (ko) * 2021-02-09 2023-09-12 오꾸라 고교 가부시키가이샤 편광판
WO2023080182A1 (ja) * 2021-11-05 2023-05-11 日東電工株式会社 積層体、及び積層体の製造方法
TW202343041A (zh) * 2022-03-03 2023-11-01 日商大倉工業股份有限公司 附接合層之偏光薄膜、偏光板及其製造方法
TW202411699A (zh) * 2022-08-01 2024-03-16 日商大倉工業股份有限公司 附無機基板之偏光板及其製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3714338B2 (ja) * 2003-04-23 2005-11-09 ウシオ電機株式会社 接合方法
JP4993243B2 (ja) * 2005-01-06 2012-08-08 日本フイルコン株式会社 樹脂製微小流路化学デバイスの製造方法並びに該製法により製造された樹脂製微小流路化学デバイス構造体
JP4946780B2 (ja) * 2007-10-17 2012-06-06 セイコーエプソン株式会社 接合膜付き偏光板、画像表示装置

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