JP4884675B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4884675B2
JP4884675B2 JP2005008643A JP2005008643A JP4884675B2 JP 4884675 B2 JP4884675 B2 JP 4884675B2 JP 2005008643 A JP2005008643 A JP 2005008643A JP 2005008643 A JP2005008643 A JP 2005008643A JP 4884675 B2 JP4884675 B2 JP 4884675B2
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Japan
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layer
region
substrate
gate electrode
mask
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Expired - Fee Related
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JP2005008643A
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Japanese (ja)
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JP2005244185A (ja
JP2005244185A5 (enExample
Inventor
慎志 前川
舜平 山崎
博信 小路
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2005008643A priority Critical patent/JP4884675B2/ja
Publication of JP2005244185A publication Critical patent/JP2005244185A/ja
Publication of JP2005244185A5 publication Critical patent/JP2005244185A5/ja
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Publication of JP4884675B2 publication Critical patent/JP4884675B2/ja
Anticipated expiration legal-status Critical
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  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2005008643A 2004-01-26 2005-01-17 半導体装置の作製方法 Expired - Fee Related JP4884675B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005008643A JP4884675B2 (ja) 2004-01-26 2005-01-17 半導体装置の作製方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004017694 2004-01-26
JP2004017675 2004-01-26
JP2004017694 2004-01-26
JP2004017675 2004-01-26
JP2005008643A JP4884675B2 (ja) 2004-01-26 2005-01-17 半導体装置の作製方法

Publications (3)

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JP2005244185A JP2005244185A (ja) 2005-09-08
JP2005244185A5 JP2005244185A5 (enExample) 2008-02-07
JP4884675B2 true JP4884675B2 (ja) 2012-02-29

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JP2005008643A Expired - Fee Related JP4884675B2 (ja) 2004-01-26 2005-01-17 半導体装置の作製方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5314842B2 (ja) * 2006-08-25 2013-10-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5329784B2 (ja) * 2006-08-25 2013-10-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5210594B2 (ja) * 2006-10-31 2013-06-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5095650B2 (ja) * 2008-09-30 2012-12-12 シャープ株式会社 膜パターンとその膜パターン形成方法、及び導電膜配線、並びに電気光学装置
JP6578533B1 (ja) * 2018-06-13 2019-09-25 株式会社Nsc 液晶パネル製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273669A (ja) * 1985-09-26 1987-04-04 Seiko Instr & Electronics Ltd 薄膜トランジスタ装置の製造方法
GB9919913D0 (en) * 1999-08-24 1999-10-27 Koninkl Philips Electronics Nv Thin-film transistors and method for producing the same
CN1292496C (zh) * 2001-05-23 2006-12-27 造型逻辑有限公司 器件的图案形成
JP2003059940A (ja) * 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
JP4683825B2 (ja) * 2002-04-24 2011-05-18 株式会社半導体エネルギー研究所 半導体装置およびその作製方法

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JP2005244185A (ja) 2005-09-08

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