JP4884485B2 - 高性能電気コネクタ - Google Patents
高性能電気コネクタ Download PDFInfo
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- JP4884485B2 JP4884485B2 JP2008555438A JP2008555438A JP4884485B2 JP 4884485 B2 JP4884485 B2 JP 4884485B2 JP 2008555438 A JP2008555438 A JP 2008555438A JP 2008555438 A JP2008555438 A JP 2008555438A JP 4884485 B2 JP4884485 B2 JP 4884485B2
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- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
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- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
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- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
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- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/60—Connections between or with tubular conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
Description
本出願は、本件の譲受人と共同所有権を共有するS法人(Subchapter S corporation)デシジョン・トラックLLC(Decision Track LLC)の代理で2006年2月17日出願の米国特許仮出願第60/774725号の利益を主張する。前記仮出願の内容はそのまま参照によってここに採り入れられる。
該当せず
該当せず
Claims (3)
- ボールグリッドアレイ端子を備えるマイクロエレクトロニクス装置のためのソケットであって、前記ソケットは、
a.上面と下面を備える誘電性基板と、
b.上端と下端を備える1つ以上のコンタクト円筒と、
c.前記コンタクト円筒の各々は薄い金属壁を有しており、
d.前記コンタクト円筒の各々の前記上端は前記壁を通る2つ以上の螺旋状切断を有しており、
e.前記上面の1つ以上の金属コンタクトパッドとを含んでおり、各パッドは各々の前記コンタクト円筒の前記下端と嵌合するために造形されており、
f.前記コンタクト円筒の各々の前記下端は前記コンタクトパッドに永久的に固定されており、
g.それによって前記コンタクト円筒の各々は嵌合する前記コンタクトパッドと電気的接触している、ソケット。 - 前記コンタクトパッドは前記基板の前記上面の円筒形凹部に形成されている請求項1に記載のソケット。
- シールドされた電気的接続を行うための同軸コネクタ装置であって、
a.上面と下面を備える第1の誘電性基板と、
b.2つ以上の螺旋形プロングに切断されている上端と、前記第1の基板の前記上面に固定されている下端を備える導電性信号コンタクト円筒と、
c.前記第1の誘電性基板の前記上面に固定されている下端と上端とを備える導電性シールド円筒と、
d.前記シールド円筒は前記信号コンタクト円筒を包囲するように配置されており、
e.上面と下面を備える第2の誘電性基板と、
f.前記第2の誘電性基板の前記下面の導電性コンタクトポストとを含んでおり、
g.それによって前記第2の基板が前記第1の基板に下方へ強制された時に前記第1の基板の前記信号コンタクト円筒の前記上端と前記第2の誘電性基板の前記ポストとの間で電気的接触が行われる、同軸コネクタ装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77472506P | 2006-02-17 | 2006-02-17 | |
US60/774,725 | 2006-02-17 | ||
US11/670,340 US7393214B2 (en) | 2006-02-17 | 2007-02-01 | High performance electrical connector |
US11/670,340 | 2007-02-01 | ||
PCT/US2007/061836 WO2007098319A2 (en) | 2006-02-17 | 2007-02-08 | High performance electrical connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009527874A JP2009527874A (ja) | 2009-07-30 |
JP4884485B2 true JP4884485B2 (ja) | 2012-02-29 |
Family
ID=38428821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008555438A Expired - Fee Related JP4884485B2 (ja) | 2006-02-17 | 2007-02-08 | 高性能電気コネクタ |
Country Status (7)
Country | Link |
---|---|
US (2) | US7393214B2 (ja) |
JP (1) | JP4884485B2 (ja) |
KR (1) | KR101350326B1 (ja) |
DE (1) | DE112007000396T5 (ja) |
GB (1) | GB2448452B (ja) |
TW (1) | TWI408848B (ja) |
WO (1) | WO2007098319A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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GB0814378D0 (en) | 2008-09-10 |
US7393214B2 (en) | 2008-07-01 |
GB2448452A (en) | 2008-10-15 |
US20080194124A1 (en) | 2008-08-14 |
KR20080097464A (ko) | 2008-11-05 |
US7559770B2 (en) | 2009-07-14 |
KR101350326B1 (ko) | 2014-02-17 |
US20070197099A1 (en) | 2007-08-23 |
TWI408848B (zh) | 2013-09-11 |
WO2007098319A3 (en) | 2008-04-17 |
WO2007098319A2 (en) | 2007-08-30 |
TW200805799A (en) | 2008-01-16 |
JP2009527874A (ja) | 2009-07-30 |
GB2448452B (en) | 2010-12-08 |
DE112007000396T5 (de) | 2009-02-12 |
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