JP4872981B2 - 圧電デバイスを備えた電子モジュール及びその製造方法 - Google Patents

圧電デバイスを備えた電子モジュール及びその製造方法 Download PDF

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Publication number
JP4872981B2
JP4872981B2 JP2008195060A JP2008195060A JP4872981B2 JP 4872981 B2 JP4872981 B2 JP 4872981B2 JP 2008195060 A JP2008195060 A JP 2008195060A JP 2008195060 A JP2008195060 A JP 2008195060A JP 4872981 B2 JP4872981 B2 JP 4872981B2
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JP
Japan
Prior art keywords
lid
electronic module
piezoelectric
adjustment
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008195060A
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English (en)
Japanese (ja)
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JP2008301515A (ja
JP2008301515A5 (enExample
Inventor
協 堀江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2008195060A priority Critical patent/JP4872981B2/ja
Publication of JP2008301515A publication Critical patent/JP2008301515A/ja
Publication of JP2008301515A5 publication Critical patent/JP2008301515A5/ja
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008195060A 2008-07-29 2008-07-29 圧電デバイスを備えた電子モジュール及びその製造方法 Expired - Fee Related JP4872981B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008195060A JP4872981B2 (ja) 2008-07-29 2008-07-29 圧電デバイスを備えた電子モジュール及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008195060A JP4872981B2 (ja) 2008-07-29 2008-07-29 圧電デバイスを備えた電子モジュール及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006167342A Division JP4244053B2 (ja) 2006-06-16 2006-06-16 圧電デバイスを備えた電子モジュール

Publications (3)

Publication Number Publication Date
JP2008301515A JP2008301515A (ja) 2008-12-11
JP2008301515A5 JP2008301515A5 (enExample) 2009-07-23
JP4872981B2 true JP4872981B2 (ja) 2012-02-08

Family

ID=40174505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008195060A Expired - Fee Related JP4872981B2 (ja) 2008-07-29 2008-07-29 圧電デバイスを備えた電子モジュール及びその製造方法

Country Status (1)

Country Link
JP (1) JP4872981B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5747574B2 (ja) 2011-03-11 2015-07-15 セイコーエプソン株式会社 圧電デバイス及び電子機器
JP2013051512A (ja) * 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd 水晶振動子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4251070B2 (ja) * 2003-12-10 2009-04-08 エプソントヨコム株式会社 圧電発振器、電子部品、及び圧電発振器の製造方法
JP4244865B2 (ja) * 2004-06-03 2009-03-25 セイコーエプソン株式会社 圧電発振器および電子機器

Also Published As

Publication number Publication date
JP2008301515A (ja) 2008-12-11

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