JP4861860B2 - プリント基板検査用治具及びプリント基板検査装置 - Google Patents

プリント基板検査用治具及びプリント基板検査装置 Download PDF

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Publication number
JP4861860B2
JP4861860B2 JP2007058427A JP2007058427A JP4861860B2 JP 4861860 B2 JP4861860 B2 JP 4861860B2 JP 2007058427 A JP2007058427 A JP 2007058427A JP 2007058427 A JP2007058427 A JP 2007058427A JP 4861860 B2 JP4861860 B2 JP 4861860B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
board inspection
probe pin
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007058427A
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English (en)
Japanese (ja)
Other versions
JP2008226881A (ja
JP2008226881A5 (enExample
Inventor
浩二 荒井
秀幸 若林
敦史 丸山
友史 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007058427A priority Critical patent/JP4861860B2/ja
Priority to US12/044,593 priority patent/US20080218188A1/en
Publication of JP2008226881A publication Critical patent/JP2008226881A/ja
Publication of JP2008226881A5 publication Critical patent/JP2008226881A5/ja
Application granted granted Critical
Publication of JP4861860B2 publication Critical patent/JP4861860B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
JP2007058427A 2007-03-08 2007-03-08 プリント基板検査用治具及びプリント基板検査装置 Expired - Fee Related JP4861860B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007058427A JP4861860B2 (ja) 2007-03-08 2007-03-08 プリント基板検査用治具及びプリント基板検査装置
US12/044,593 US20080218188A1 (en) 2007-03-08 2008-03-07 Jig for printed substrate inspection and printed substrate inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007058427A JP4861860B2 (ja) 2007-03-08 2007-03-08 プリント基板検査用治具及びプリント基板検査装置

Publications (3)

Publication Number Publication Date
JP2008226881A JP2008226881A (ja) 2008-09-25
JP2008226881A5 JP2008226881A5 (enExample) 2010-02-12
JP4861860B2 true JP4861860B2 (ja) 2012-01-25

Family

ID=39741003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007058427A Expired - Fee Related JP4861860B2 (ja) 2007-03-08 2007-03-08 プリント基板検査用治具及びプリント基板検査装置

Country Status (2)

Country Link
US (1) US20080218188A1 (enExample)
JP (1) JP4861860B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8760186B2 (en) * 2010-02-19 2014-06-24 International Business Machines Corporation Probe apparatus assembly and method
JP2011247838A (ja) 2010-05-31 2011-12-08 Ricoh Co Ltd スイッチプローブ、基板検査装置及び基板検査システム
JP6016292B2 (ja) * 2011-10-13 2016-10-26 デクセリアルズ株式会社 太陽電池用測定治具及び太陽電池セルの出力測定方法
JP6407128B2 (ja) * 2015-11-18 2018-10-17 三菱電機株式会社 半導体装置の評価装置および半導体装置の評価方法
CN106443299B (zh) * 2016-09-27 2019-01-04 惠州市金百泽电路科技有限公司 一种侦断印制电路板台阶孔开短路功能性缺陷的检测方法
JP2020188046A (ja) * 2019-05-10 2020-11-19 信越半導体株式会社 プローブカード
IT202300008097A1 (it) * 2023-04-26 2024-10-26 Technoprobe Spa Testa di misura con sonde di contatto aventi proprietà di deformazione migliorate
IT202300008094A1 (it) * 2023-04-26 2024-10-26 Technoprobe Spa Testa di misura con sonde di contatto aventi mezzi di arresto e una configurazione perfezionata
TW202509486A (zh) * 2023-04-26 2025-03-01 義大利商探針科技公司 具有改善組態之接觸探針之探針頭
IT202300008088A1 (it) * 2023-04-26 2024-10-26 Technoprobe Spa Testa di misura con sonde di contatto perfezionate
IT202300008100A1 (it) * 2023-04-26 2024-10-26 Technoprobe Spa Testa di misura con sonde di contatto aventi una configurazione perfezionata
CN118566590A (zh) * 2024-05-22 2024-08-30 国网山西省电力公司电力科学研究院 一种电缆缓冲层体积电阻率测试电极、装置及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4496903A (en) * 1981-05-11 1985-01-29 Burroughs Corporation Circuit board test fixture
US4870354A (en) * 1988-08-11 1989-09-26 Zehntel, Inc. Apparatus for contacting a printed circuit board with an array of test probes
US4977370A (en) * 1988-12-06 1990-12-11 Genrad, Inc. Apparatus and method for circuit board testing
JPH0385456A (ja) * 1989-08-30 1991-04-10 Hitachi Electron Eng Co Ltd プローバ
US5574382A (en) * 1991-09-17 1996-11-12 Japan Synthetic Rubber Co., Ltd. Inspection electrode unit for printed wiring board
JP3821171B2 (ja) * 1995-11-10 2006-09-13 オー・エイチ・ティー株式会社 検査装置及び検査方法
US5898314A (en) * 1996-02-26 1999-04-27 Delaware Capital Formation, Inc. Translator fixture with force applying blind pins
US6661245B1 (en) * 1996-10-31 2003-12-09 International Business Machines Corporation Method to eliminate wiring of electrical fixtures using spring probes
US6229322B1 (en) * 1998-08-21 2001-05-08 Micron Technology, Inc. Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus
JP2005077262A (ja) * 2003-09-01 2005-03-24 Matsushita Electric Ind Co Ltd プリント配線板の検査用基板
CN100549708C (zh) * 2004-07-15 2009-10-14 Jsr株式会社 电路基板的检查装置以及电路基板的检查方法

Also Published As

Publication number Publication date
US20080218188A1 (en) 2008-09-11
JP2008226881A (ja) 2008-09-25

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