JP4854928B2 - キャスティングされた強誘電性ポリマーフィルム用レベリング剤 - Google Patents
キャスティングされた強誘電性ポリマーフィルム用レベリング剤 Download PDFInfo
- Publication number
- JP4854928B2 JP4854928B2 JP2004063421A JP2004063421A JP4854928B2 JP 4854928 B2 JP4854928 B2 JP 4854928B2 JP 2004063421 A JP2004063421 A JP 2004063421A JP 2004063421 A JP2004063421 A JP 2004063421A JP 4854928 B2 JP4854928 B2 JP 4854928B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- ferroelectric polymer
- mol
- cycloalkyl
- ferroelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/47—Levelling agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
- H01L21/0212—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US45280703P | 2003-03-07 | 2003-03-07 | |
| US60/452807 | 2003-03-07 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004307830A JP2004307830A (ja) | 2004-11-04 |
| JP2004307830A5 JP2004307830A5 (enExample) | 2007-03-29 |
| JP4854928B2 true JP4854928B2 (ja) | 2012-01-18 |
Family
ID=32825443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004063421A Expired - Fee Related JP4854928B2 (ja) | 2003-03-07 | 2004-03-08 | キャスティングされた強誘電性ポリマーフィルム用レベリング剤 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7429627B2 (enExample) |
| EP (1) | EP1454955B1 (enExample) |
| JP (1) | JP4854928B2 (enExample) |
| DE (1) | DE602004001245T2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR112012000523A2 (pt) | 2009-07-07 | 2016-02-16 | Ak Steel Properties Inc | substrato metálico revestido com polímero e método para a obtenção do mesmo |
| JP6409781B2 (ja) * | 2013-10-29 | 2018-10-24 | ダイキン工業株式会社 | フィルム及びその製造方法 |
| TW201631065A (zh) * | 2014-12-17 | 2016-09-01 | 漢高股份有限及兩合公司 | 可印刷鐵電型墨水 |
| FR3070041B1 (fr) * | 2017-08-09 | 2019-08-30 | Arkema France | Formulations a base de fluoropolymeres electroactifs et leurs applications |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159459A (ja) * | 1986-12-23 | 1988-07-02 | Central Glass Co Ltd | 樹脂組成物 |
| IT1243982B (it) * | 1990-10-01 | 1994-06-28 | Ausimont Spa | Geli reversibili a base di fluoroelastomeri |
| JPH09199130A (ja) * | 1996-01-22 | 1997-07-31 | Elf Atochem Japan Kk | 電極およびそれを使用した二次電池 |
| ATE307167T1 (de) * | 1999-05-31 | 2005-11-15 | Arkema | Polymerzusammensetzung enthaltend ein halb- krystallines fluorpolymer, ein acrylpolymer und ein nukleierungsmittel, sowie daraus hergestellte beschichtungen |
| JP2001001478A (ja) * | 1999-06-22 | 2001-01-09 | Nakae Bussan Kk | ポリカーボネート又はポリエチレンテレフタレートの成形物 |
| DE10048258B4 (de) | 2000-09-29 | 2004-08-19 | Byk-Chemie Gmbh | Verlaufmittel für Oberflächenbeschichtungen |
| US7173084B2 (en) * | 2001-10-17 | 2007-02-06 | Efka Additives B.V. | Levelling agent and anti-cratering agent |
| US6635714B1 (en) * | 2002-04-30 | 2003-10-21 | Atofina Chemicals, Inc. | Weatherable fluoropolymer-acrylic composition |
-
2004
- 2004-03-08 JP JP2004063421A patent/JP4854928B2/ja not_active Expired - Fee Related
- 2004-03-08 EP EP04251336A patent/EP1454955B1/en not_active Expired - Lifetime
- 2004-03-08 DE DE602004001245T patent/DE602004001245T2/de not_active Expired - Lifetime
- 2004-03-08 US US10/795,848 patent/US7429627B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004001245D1 (de) | 2006-08-03 |
| US7429627B2 (en) | 2008-09-30 |
| US20050004302A1 (en) | 2005-01-06 |
| EP1454955A3 (en) | 2004-12-15 |
| DE602004001245T2 (de) | 2007-04-26 |
| JP2004307830A (ja) | 2004-11-04 |
| EP1454955B1 (en) | 2006-06-21 |
| EP1454955A2 (en) | 2004-09-08 |
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