JP4851317B2 - 能動的冷却を備えたled光アセンブリ - Google Patents
能動的冷却を備えたled光アセンブリ Download PDFInfo
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- JP4851317B2 JP4851317B2 JP2006507466A JP2006507466A JP4851317B2 JP 4851317 B2 JP4851317 B2 JP 4851317B2 JP 2006507466 A JP2006507466 A JP 2006507466A JP 2006507466 A JP2006507466 A JP 2006507466A JP 4851317 B2 JP4851317 B2 JP 4851317B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
多数のLED照明装置は、通常のフィラメント電球システムと異なる熱伝達経路を通して放熱する。より具体的には、高出力LED照明装置は、カソード(負端子)脚部を介して、又は直接ダイス取付け装置内に取り付けられたダイスを通して、相当量の熱を放熱する。通常の放熱システム(すなわち、大部分の熱をランプの前面レンズに放射するもの)は、高出力LEDシステムの熱を適切に減少させない。したがって、高出力LEDシステムは、高い作動温度で作動する傾向がある。
小さい照明設置面積内で高輝度LEDを使用するために、ある程度の能動的冷却が、LEDの温度低下、よって、大きなヒートシンクが不要であることから照明器具全体のサイズの減少を容易にすることができる。ファンを用いるスポット冷却が周知である。周知のファンは、周囲全体の周りに、内部チャンバを定める剛性ハウジング(housing)に取り付けられた可撓性ダイアフラムを含む。ダイアフラムは、オリフィスを含む。ダイアフラムは、圧電アクチュエータによって作動されるとき、内部チャンバに出入りする。
ダイアフラムがチャンバから外に移動すると、チャンバの体積が増加し、周囲流体がオリフィス内に、よってチャンバ内に引き込まれる。渦は、既にオリフィスの縁部から移動されているので、チャンバ内に運ばれる周囲流体によって影響を受けない。渦がオリフィスから遠ざかるように移動するとき、周囲流体を巻き込むことによって、流体の噴流、すなわち「合成噴流」を合成する。電子パッケージの冷却に有用であることが見出されたのは、これらのファンすなわち合成噴流生成装置である。
図1を参照すると、LED光アセンブリの一部10が、ファン18が取り付けられた放熱構造体16に固定された複数のLED14から構成されるLEDアレイ12を含む。「ファン」という用語は、空気の流れを生成する装置、又は空気を動かすために羽根を回転させるモータを用いる機械だけに限定されるものではない。「ファン」という用語は、空気だけに限られず、流体の流れを生成するための装置を説明するように、より広く用いられる。LEDアセンブリの一部10は、半透明のカバー(図示せず)で覆うことができ、及び/又は、取付け具又はハウジング(図示せず)内に配置し、LEDアセンブリを形成することができる。各々のLED14は、電源(図示せず)から電力を受け取り、その電力をLED14に供給するダイス(見えない)を含む。ダイスは、ダイス支持体20内に収納される。LEDにより生成される熱は、ダイスを介して放熱構造体16に伝えられる。
LEDの取付け、及びLEDに電力を供給するために用いられる電気接続は、当該技術分野において周知であり、よって更なる説明は不要である。LED14は、当該技術分野において周知の通常のLEDとすることができる。LED14は、取付け板22上に取り付けられる。取付け板22、よってLEDアレイ12は、放熱構造体16の第1の面すなわち下面24に取り付けられる。
ファン18は、圧電材料36に取り付けられたブレード34を含む。ブレードは、可撓性材料、好ましくは可撓性金属で作られる。ブレード34の取り付けられていない端部38は、台座30から離れるように、上面26の上方に片持ち状に突出する。ブレードは、台座面32に取り付けられるので、ブレードが動いているとき、ブレード34の取り付けられていない端部38は、上面26に接触しない。圧電材料36は、取り付けられていない端部38の反対側及び台座30の上方のブレード34に取り付けられる。代替的に、圧電材料36は、ブレード34の長さ又は長さの一部に及ぶことができる。圧電材料36は、通常の方法で、電源(図示せず)に電気的に接続されたセラミック材料を含む。電気が第1の方向に圧電材料36に適用されると、圧電材料が膨張し、ブレード34をある方向に移動させる。次に、電気が他の方向に適用されると、圧電材料が収縮し、ブレード34を反対方向に移動させる。交流が、ブレード34を連続的に前後に移動させる。
放熱構造体56はまた、該放熱構造体56の上面66から上方に突出する台座70も含む。台座70はまた、下面64から離れるように上面66の面とほぼ垂直に上方に突出する。台座70は、図1及び図2に関して前述された台座30と類似している。各々のフィンの端部と台座との間に隙間72が定められるように、台座70が、フィン68から間隔をおいて配置される。台座70は、フィン68より上方に隆起している台座表面74を含む。
深さD(図6)、幅W(図6)、及び長さLを有するほぼ矩形のキャビティ116が、壁112内に形成される。キャビティ116は、離間配置された、ほぼ平行な一対の側壁118及び120(図6)、及び離間配置された、ほぼ平行な一対の端部壁122及び124を有する。壁は、流路表面114内に開口部126を定める。キャビティ116の開口部126は、可撓性でほぼ矩形のアクチュエータ・ブレード128で覆われている。
作動中、交流電圧が制御可能な電源からブレード128に印加される。圧電層132の両端に電位が適用されると、該層132は、電圧の極性によって膨張又は収縮する。圧電層132は可撓性層130に結合されるので、交流電圧の印加が、曲げひずみを引き起こし、これによりブレード128が振動する。
オリフィス152は、図12に示されるような一連の穴とすることができ、或いは図13に示されるような長いスロットの形態を取ることもできる。オリフィス152のサイズ、形状、数、及び角度は、特定の用途に適するように変えることができ、例えば、オリフィス152は、下流方向に角度を付けることができ(ピッチ角)、或いはオリフィス152のアレイは、オリフィス板144の面内に角度を付けることができる(ヨー(yaw)角)。
Claims (12)
- ハウジング(housing)と、前記ハウジング内に配置されたLED(14、54)と、前記LEDと熱的に連通した放熱構造体(16、56、112、142、204)とを含むLED光アセンブリであって、
圧電材料を含む流体流れ生成装置(18、58、110、148、170、200)が、前記放熱構造体の上に流れを生成するために前記ハウジング内に配置され、
前記流体流れ生成装置(148)が、第1の可撓性側板(154)と、可撓性のヒンジ(hinge)(156)で接続された第2の可撓性側板(154)と、を含む、
ことを特徴とするLED光アセンブリ。 - 前記流体流れ生成装置が、可撓性材料からなるブレード(34、78、128)を含み、前記ブレードは、該放熱構造体(16、56、112)の表面から間隔をおいて配置され、該ブレードの取り付けられていない端部が前記表面に対して移動できるようになったことを特徴とする請求項1に記載のアセンブリ。
- 前記放熱構造体(16、56)の前記表面から延びる台座(30、70)をさらに含み、前記ブレードが前記台座に取り付けられ、該ブレードが該表面から間隔をおいて配置されるようになったことを特徴とする請求項2に記載のアセンブリ。
- 圧電材料が、少なくともほぼ前記ブレード(34、78、128)の長さに及ぶことを特徴とする請求項2に記載のアセンブリ。
- 前記放熱構造体(56)の前記表面から延びる複数のフィン(68)をさらに含むことを特徴とする請求項2に記載のアセンブリ。
- 前記放熱構造体(112)が、開口部(126)を定めるキャビティ(116)を含み、前記流体流れ生成装置が該放熱構造体に取り付けられたブレード(128)を含み、前記ブレードが前記開口部の一部を覆うことを特徴とする請求項1に記載のアセンブリ。
- 前記キャビティ(116)は、流れが軸方向に流れるのを妨げる端部壁(124)によって定められることを特徴とする請求項6のアセンブリ。
- 前記放熱構造体(112)がプリント基板を含むことを特徴とする請求項6のアセンブリ。
- 前記ブレード(128)が、前記開口部(126)の少なくとも2つの隣接した側部から間隔をおいて配置されることを特徴とする請求項6に記載のアセンブリ。
- 前記第1の可撓性板(154)、前記第2の可撓性板(154)、及び前記可撓性ヒンジ(156)が内部キャビティ(158)を定め、前記流体流れ生成装置は、前記内部キャビティと流体連通した放出導管(172)を含み、前記放出導管は、前記放熱構造体(142)に隣接する遠位端を有することを特徴とする請求項1に記載のアセンブリ。
- 前記放熱構造体(148)がLEDのためのダイスを含むことを特徴とする請求項1に記載のアセンブリ。
- 前記ハウジング内に配置された複数のLED(14、54)と、
前記ハウジング内に配置された複数の流体流れ生成装置(18、58、110、148、170、200)と、
をさらに備え、
前記流体流れ生成装置の少なくとも1つが、特定のLEDを冷却するように配置されることを特徴とする請求項1に記載のアセンブリ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45923803P | 2003-03-31 | 2003-03-31 | |
US60/459,238 | 2003-03-31 | ||
US10/726,882 US7204615B2 (en) | 2003-03-31 | 2003-12-03 | LED light with active cooling |
US10/726,882 | 2003-12-03 | ||
PCT/US2004/008788 WO2004095593A1 (en) | 2003-03-31 | 2004-03-23 | Led light assembly with active cooling |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011178839A Division JP5984347B2 (ja) | 2003-03-31 | 2011-08-18 | 能動的冷却を備えたled光アセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006522479A JP2006522479A (ja) | 2006-09-28 |
JP4851317B2 true JP4851317B2 (ja) | 2012-01-11 |
Family
ID=32995050
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2006507466A Expired - Fee Related JP4851317B2 (ja) | 2003-03-31 | 2004-03-23 | 能動的冷却を備えたled光アセンブリ |
JP2011178839A Expired - Fee Related JP5984347B2 (ja) | 2003-03-31 | 2011-08-18 | 能動的冷却を備えたled光アセンブリ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011178839A Expired - Fee Related JP5984347B2 (ja) | 2003-03-31 | 2011-08-18 | 能動的冷却を備えたled光アセンブリ |
Country Status (4)
Country | Link |
---|---|
US (1) | US7204615B2 (ja) |
EP (2) | EP2302707B1 (ja) |
JP (2) | JP4851317B2 (ja) |
WO (1) | WO2004095593A1 (ja) |
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JP2001177026A (ja) * | 1999-11-09 | 2001-06-29 | Samsung Electronics Co Ltd | 微細構造の冷却フィンをもつ冷却装置 |
Also Published As
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JP2012023381A (ja) | 2012-02-02 |
EP1611620B1 (en) | 2016-09-14 |
EP2302707A1 (en) | 2011-03-30 |
EP2302707B1 (en) | 2019-07-24 |
US7204615B2 (en) | 2007-04-17 |
US20040190305A1 (en) | 2004-09-30 |
JP5984347B2 (ja) | 2016-09-06 |
EP1611620A1 (en) | 2006-01-04 |
WO2004095593A1 (en) | 2004-11-04 |
JP2006522479A (ja) | 2006-09-28 |
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