JP4848376B2 - 高圧処理システム用超臨界流体均質化方法及びシステム - Google Patents
高圧処理システム用超臨界流体均質化方法及びシステム Download PDFInfo
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- JP4848376B2 JP4848376B2 JP2007534720A JP2007534720A JP4848376B2 JP 4848376 B2 JP4848376 B2 JP 4848376B2 JP 2007534720 A JP2007534720 A JP 2007534720A JP 2007534720 A JP2007534720 A JP 2007534720A JP 4848376 B2 JP4848376 B2 JP 4848376B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Microelectronics & Electronic Packaging (AREA)
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- Cleaning Or Drying Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Description
実質的に超臨界流体特性を持つ流体であって、処理室内に導入された流体により前記基板を処理するように構成された処理室と、
前記処理室に高圧流体を導入するように構成された高圧流体供給システムと、
前記処理室に処理化学物質を導入するように構成された処理化学物質供給システムと、
前記処理室に結合され、前記高圧流体及び前記処理化学物質を前記処理室に導入する前に、前記高圧流体供給システムから前記高圧流体を受け、前記処理化学物質供給システムから前記処理化学物質を受け、前記高圧流体及び前記処理化学物質を混合するように構成された事前混合システムと、
前記処理室に結合され、前記処理室を介して前記基板上に前記高圧流体及び前記処理化学物質を循環させるように構成された流体フローシステムとを含む、高圧処理システムが開示される。
前記高圧処理システム用の高圧流体を供給し、
前記高圧処理システム用の処理化学物質を供給し、
前記高圧流体及び前記処理化学物質を前記高圧処理システムに導入する前に、前記高圧流体及び前記処理化学物質を混合し、
前記高圧流体及び前記処理化学物質を前記高圧処理システムに導入し、
前記流体を実質的に超臨界流体特性を持つ状態とし、該状態の流体に基板を晒すことによって、前記基板を、前記高圧処理システム内の前記高圧流体及び前記処理化学物質に晒す、方法が開示される。
Claims (12)
- 基板を処理する高圧処理システムであって、
実質的に超臨界流体特性を持つ流体であって、処理室内に導入された流体により前記基板を処理するように構成された処理室と、
前記処理室に高圧流体を導入するように構成された高圧流体供給システムと、
前記処理室に処理化学物質を導入するように構成された処理化学物質供給システムと、
前記処理室に結合され、前記高圧流体及び前記処理化学物質を前記処理室に導入する前に、前記高圧流体供給システムから前記高圧流体を受け、前記処理化学物質供給システムから前記処理化学物質を受け、前記高圧流体及び前記処理化学物質を混合するように構成された事前混合システムと、
前記処理室に結合され、前記事前混合システムにより混合されて生成される前記高圧流体及び前記処理化学物質を前記処理室に導入すると共に、該導入後に前記処理室から出される前記高圧流体及び前記処理化学物質を、これらの混合状態を維持しつつ再度前記処理室に導入するように構成された再循環システムとを含み、
前記事前混合システムは、前記高圧流体及び前記処理化学物質が所定基準以上十分に混合されるまで、前記高圧流体及び前記処理化学物質を閉じた循環ループ内で循環させ、前記高圧流体及び前記処理化学物質が所定基準以上十分に混合されたと判断した前記高圧流体及び前記処理化学物質を前記処理室に導入するように構成される、高圧処理システム。 - 前記流体は、二酸化炭素を含む、請求項1に記載の高圧処理システム。
- 前記処理化学物質供給システムは、溶剤、補助溶剤、界面活性剤、前駆体系繊維、還元剤、又は、これらの任意の組み合わせを導入するように構成されている、請求項1に記載の高圧処理システム。
- 前記処理化学物質供給システムは、
異物、残留物、硬化残留物、フォトレジスト、硬化フォトレジスト、ポストエッチング残留物、ポストアッシュ残留物、化学機械的研磨(CMP)後残留物、研磨後残留物、ポストインプラント残留物、又は、これらの任意の組み合わせを除去するための洗浄剤、
粒子を除供するための洗浄剤、
薄膜、多孔薄膜、多孔低誘電率材料、エアギャップ誘電体、又は、これらの任意の組み合わせを乾燥させる乾燥剤、誘電体薄膜、金属薄膜、又は、これらの任意の組み合わせを用意するための前駆体系繊維、
又は、これらの任意の組み合わせを導入するように構成されている、請求項1に記載の高圧処理システム。 - 前記事前混合システムは、バイパスライン及び一以上のバルブを含み、前記処理室を介した高圧流体及び処理化学物質の流れに対して前記一以上のバルブが閉じたときに、前記流れが前記バイパスラインを通るようにする、請求項1に記載の高圧処理システム。
- 前記事前混合システムは、更に、前記バイパスラインに結合されたフローメータであって、前記高圧流体及び前記処理化学物質が混合されるときを決定するように構成されたフローメータを含む、請求項5に記載の高圧処理システム。
- 前記再循環システムは、ポンプを含む、請求項1に記載の高圧処理システム。
- 前記再循環システムは、更に、ヒータ及びフィルタを含む、請求項7に記載の高圧処理システム。
- 前記事前混合システムは、
前記ポンプの出口側に結合された一端と、前記ポンプの入口側に結合された他端を有するバイパスラインと、
前記バイパスラインに結合され、前記高圧流体及び前記処理化学物質の流れに対して前記処理室を開閉するように構成された一以上のバルブとを含む、請求項7に記載の高圧処理システム。 - 高圧処理システムにおける基板処理方法であって、
前記高圧処理システム用の高圧流体を供給し、
前記高圧処理システム用の処理化学物質を供給し、
前記高圧流体及び前記処理化学物質を処理室に導入する前に、前記高圧流体及び前記処理化学物質を混合し、
前記高圧流体及び前記処理化学物質を前記処理室に導入し、
前記流体を実質的に超臨界流体特性を持つ状態とし、該状態の流体に前記処理室内の基板を晒すことによって、前記基板を、前記高圧流体及び前記処理化学物質に晒し、
前記高圧流体及び前記処理化学物質を混合することは、前記高圧流体及び前記処理化学物質が所定基準以上十分に混合されるまで、前記高圧流体及び前記処理化学物質を前記処理室に対して閉じた循環ループ内で循環させることを含む、方法。 - 前記高圧流体を供給することは、前記処理システムを通って超臨界流体を再循環させることを含む、請求項10に記載の方法。
- 前記高圧流体は、高圧二酸化炭素であり、前記基板を晒すことは、超臨界二酸化炭素に前記基板を晒すことを含む、請求項11に記載の方法。
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US10/955,325 | 2004-09-30 | ||
US10/955,325 US20060065189A1 (en) | 2004-09-30 | 2004-09-30 | Method and system for homogenization of supercritical fluid in a high pressure processing system |
PCT/US2005/034749 WO2006039314A1 (en) | 2004-09-30 | 2005-09-27 | Method and system for homogenization of supercritical fluid in a high pressure processing system |
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JP2008518430A JP2008518430A (ja) | 2008-05-29 |
JP4848376B2 true JP4848376B2 (ja) | 2011-12-28 |
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US (1) | US20060065189A1 (ja) |
JP (1) | JP4848376B2 (ja) |
TW (1) | TWI289334B (ja) |
WO (1) | WO2006039314A1 (ja) |
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2004
- 2004-09-30 US US10/955,325 patent/US20060065189A1/en not_active Abandoned
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2005
- 2005-09-27 JP JP2007534720A patent/JP4848376B2/ja active Active
- 2005-09-27 WO PCT/US2005/034749 patent/WO2006039314A1/en active Application Filing
- 2005-09-29 TW TW094133923A patent/TWI289334B/zh not_active IP Right Cessation
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JP2003531478A (ja) * | 2000-04-18 | 2003-10-21 | エス.シー.フルーイズ,インコーポレイテッド | 半導体ウエハの処理のための超臨界流体の搬送・回収システム |
JP2002353185A (ja) * | 2001-05-29 | 2002-12-06 | Dainippon Screen Mfg Co Ltd | 高圧処理装置 |
WO2003023840A2 (en) * | 2001-09-13 | 2003-03-20 | Micell Technologies, Inc. | Methods and apparatus for cleaning and/or treating a substrate using co¿2? |
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TWI289334B (en) | 2007-11-01 |
JP2008518430A (ja) | 2008-05-29 |
TW200620449A (en) | 2006-06-16 |
US20060065189A1 (en) | 2006-03-30 |
WO2006039314A1 (en) | 2006-04-13 |
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