JP4847575B2 - ソケット及びこれを使用する検査装置 - Google Patents
ソケット及びこれを使用する検査装置 Download PDFInfo
- Publication number
- JP4847575B2 JP4847575B2 JP2009500136A JP2009500136A JP4847575B2 JP 4847575 B2 JP4847575 B2 JP 4847575B2 JP 2009500136 A JP2009500136 A JP 2009500136A JP 2009500136 A JP2009500136 A JP 2009500136A JP 4847575 B2 JP4847575 B2 JP 4847575B2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- cover
- frame
- movable
- movable frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/44—Means for preventing access to live contacts
- H01R13/447—Shutter or cover plate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
2………ベースフレーム(ベース部材)
2a……段部
2b……突出部
2c……凹部
2d……キー
3………可動フレーム(可動部材)
3c……被位置決め部
4………カバー(加圧部材)
4a……加圧部、加圧部兼位置決め部
5………ヒンジ
6………レバー
6a……先端部
7………軸
8………コイルスプリング
9………ねじ
10……コイルスプリング
21……基板
22……ベースプレート
23……I/Oコネクタ
24……コネクタ
26……デバイス
Claims (3)
- 2つの接続対象物間を接続するソケットにおいて、
前記ソケットは、2つの前記接続対象物のうちの一方の接続対象物と、前記一方の接続対象物が所定位置に配置されるベース部材と、前記ベース部材に移動可能に保持され、2つの接続対象物のうちの他方の接続対象物を収容する可動部材と、前記ベース部材に回転可能に保持される加圧部材とを有し、
前記可動部材は、弾性部材によって常時所定位置に付勢され、かつ、前記他方の接続対象物を所定位置に収容する収容部を有し、
前記加圧部材は、前記他方の接続対象物を加圧する加圧部と、位置決め部を有し、
前記可動部材は前記位置決め部と係合する被位置決め部を有し、
前記加圧部材を操作することにより、前記弾性部材の付勢力に反して、前記加圧部材が前記他方の接続対象物を加圧して前記両方の接続対象物間を接続するとともに、前記位置決め部と前記被位置決め部とが係合することにより、前記可動部材又は前記加圧部材の一方が他方に対して位置決めされることを特徴とするソケット。 - 前記ベース部材又は前記可動部材の一方にキーが設けられ、他方に前記キーと係合するキー溝が設けられることを特徴とする請求項1記載のソケット。
- 請求項1又は2記載のソケットを使用することを特徴とする検査装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009500136A JP4847575B2 (ja) | 2007-02-21 | 2008-02-08 | ソケット及びこれを使用する検査装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007041166 | 2007-02-21 | ||
JP2007041166 | 2007-02-21 | ||
JP2009500136A JP4847575B2 (ja) | 2007-02-21 | 2008-02-08 | ソケット及びこれを使用する検査装置 |
PCT/JP2008/052110 WO2008102652A1 (ja) | 2007-02-21 | 2008-02-08 | ソケット及びこれを使用する検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008102652A1 JPWO2008102652A1 (ja) | 2010-05-27 |
JP4847575B2 true JP4847575B2 (ja) | 2011-12-28 |
Family
ID=39709929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009500136A Expired - Fee Related JP4847575B2 (ja) | 2007-02-21 | 2008-02-08 | ソケット及びこれを使用する検査装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4847575B2 (ja) |
CN (1) | CN101589524A (ja) |
TW (1) | TW200849746A (ja) |
WO (1) | WO2008102652A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5187282B2 (ja) * | 2009-06-24 | 2013-04-24 | 住友電装株式会社 | リテーナ嵌合状態検査用装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6258780U (ja) * | 1985-09-30 | 1987-04-11 | ||
JPH08236235A (ja) * | 1995-12-04 | 1996-09-13 | Enplas Corp | Icソケット |
JPH10125426A (ja) * | 1996-10-11 | 1998-05-15 | Minnesota Mining & Mfg Co <3M> | Icソケット |
-
2008
- 2008-02-08 CN CNA2008800027098A patent/CN101589524A/zh active Pending
- 2008-02-08 WO PCT/JP2008/052110 patent/WO2008102652A1/ja active Application Filing
- 2008-02-08 JP JP2009500136A patent/JP4847575B2/ja not_active Expired - Fee Related
- 2008-02-20 TW TW097105834A patent/TW200849746A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6258780U (ja) * | 1985-09-30 | 1987-04-11 | ||
JPH08236235A (ja) * | 1995-12-04 | 1996-09-13 | Enplas Corp | Icソケット |
JPH10125426A (ja) * | 1996-10-11 | 1998-05-15 | Minnesota Mining & Mfg Co <3M> | Icソケット |
Also Published As
Publication number | Publication date |
---|---|
WO2008102652A1 (ja) | 2008-08-28 |
CN101589524A (zh) | 2009-11-25 |
TW200849746A (en) | 2008-12-16 |
JPWO2008102652A1 (ja) | 2010-05-27 |
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