JP4831904B2 - スクリーンプリントに関する改善 - Google Patents

スクリーンプリントに関する改善 Download PDF

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Publication number
JP4831904B2
JP4831904B2 JP2001510661A JP2001510661A JP4831904B2 JP 4831904 B2 JP4831904 B2 JP 4831904B2 JP 2001510661 A JP2001510661 A JP 2001510661A JP 2001510661 A JP2001510661 A JP 2001510661A JP 4831904 B2 JP4831904 B2 JP 4831904B2
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JP
Japan
Prior art keywords
chamber
screen
pasty product
print
main body
Prior art date
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Expired - Fee Related
Application number
JP2001510661A
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English (en)
Japanese (ja)
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JP2003504249A5 (cg-RX-API-DMAC7.html
JP2003504249A (ja
Inventor
フィリップ ジョン ランバート，
Original Assignee
ディーイーケー インターナショナル ゲゼルシャフト ミット ベシュレンクテル ハフツング
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Publication date
Application filed by ディーイーケー インターナショナル ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical ディーイーケー インターナショナル ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2003504249A publication Critical patent/JP2003504249A/ja
Publication of JP2003504249A5 publication Critical patent/JP2003504249A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paper (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001510661A 1999-07-19 2000-07-19 スクリーンプリントに関する改善 Expired - Fee Related JP4831904B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9916906.2 1999-07-19
GB9916906A GB2352209A (en) 1999-07-19 1999-07-19 Improvements relating to screen printing
PCT/GB2000/002781 WO2001005592A1 (en) 1999-07-19 2000-07-19 Improvements relating to screen printing

Publications (3)

Publication Number Publication Date
JP2003504249A JP2003504249A (ja) 2003-02-04
JP2003504249A5 JP2003504249A5 (cg-RX-API-DMAC7.html) 2011-02-03
JP4831904B2 true JP4831904B2 (ja) 2011-12-07

Family

ID=10857510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001510661A Expired - Fee Related JP4831904B2 (ja) 1999-07-19 2000-07-19 スクリーンプリントに関する改善

Country Status (8)

Country Link
US (1) US6746710B1 (cg-RX-API-DMAC7.html)
EP (1) EP1202862B1 (cg-RX-API-DMAC7.html)
JP (1) JP4831904B2 (cg-RX-API-DMAC7.html)
AT (1) ATE267702T1 (cg-RX-API-DMAC7.html)
CA (1) CA2379904A1 (cg-RX-API-DMAC7.html)
DE (1) DE60011091T2 (cg-RX-API-DMAC7.html)
GB (1) GB2352209A (cg-RX-API-DMAC7.html)
WO (1) WO2001005592A1 (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3646603B2 (ja) 2000-02-17 2005-05-11 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP4156227B2 (ja) * 2001-11-02 2008-09-24 松下電器産業株式会社 スクリーン印刷装置
FR2881077B1 (fr) 2005-01-27 2007-06-29 Novatec Sa Sa Soc Dispositif de transfert par serigraphie
GB2437070B (en) 2006-04-10 2011-12-14 Dek Int Gmbh Screen printing head and system
ES2341739T3 (es) * 2006-10-24 2010-06-25 Commissariat A L'energie Atomique Dispositivo y procedimiento de metalizacion.
KR100861611B1 (ko) * 2006-11-14 2008-10-07 삼성전기주식회사 인쇄 장치
US7980445B2 (en) * 2008-01-23 2011-07-19 International Business Machines Corporation Fill head for full-field solder coverage with a rotatable member
GB2458313B (en) 2008-03-13 2012-05-23 Dek Int Gmbh Print head assembly, screen printing system and method
DE102008041423B4 (de) * 2008-08-21 2015-04-16 Fmp Technology Gmbh Fluid Measurements & Projects Beschichtungswerkzeug zum Auftragen eines Flüssigkeitsfilms auf ein Substrat
CN103109589A (zh) * 2011-04-27 2013-05-15 松下电器产业株式会社 布线基板的制造方法
JP4973796B1 (ja) 2011-04-27 2012-07-11 パナソニック株式会社 配線基板の製造方法
EP2590488A4 (en) * 2011-07-27 2013-10-23 Panasonic Corp METHOD FOR PRODUCING A REUSABLE PASTE, REUSABLE PASTE AND METHOD FOR PRODUCING A WELDING SUBSTRATE WITH THE REUSABLE PASTE
KR20130022184A (ko) * 2011-08-25 2013-03-06 삼성전자주식회사 스퀴즈장치
JP6251012B2 (ja) * 2013-11-18 2017-12-20 株式会社ケー・アイ・エス パターン形成装置
TWI558574B (zh) * 2014-12-05 2016-11-21 Metal Ind Res & Dev Ct Slit Scraper Structure
CN110421965A (zh) * 2019-08-14 2019-11-08 协鑫集成科技股份有限公司 刮刀装置和太阳能电池片丝网印刷机
EP3988312A1 (en) 2020-10-23 2022-04-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Device and method of filling grooves

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557870A (ja) * 1991-09-02 1993-03-09 Matsushita Electric Ind Co Ltd 流動体塗布方法および装置
WO1996020088A1 (en) * 1994-12-27 1996-07-04 Ford Motor Company Method and apparatus for dispensing viscous material
JP2000202988A (ja) * 1999-01-14 2000-07-25 Ricoh Microelectronics Co Ltd 印刷剤充填装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1009740A (en) * 1963-07-19 1965-11-10 Bradford Dyers Ass Ltd Stencil-printing machines
NL7403192A (nl) 1974-03-08 1975-09-10 Stork Brabant Bv Verftoevoerelement voor een rotatie zeefdruk machine.
DE3238084A1 (de) * 1982-10-14 1984-04-26 Mathias 4815 Schloss Holte Mitter Vorrichtung zum gleichmaessigen zufuehren, verteilen und auftragen einer verschaeumten auftragsflotte auf eine vorzugsweise textile warenbahn od.dgl.
US4622239A (en) 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
JPH0675747U (ja) * 1993-04-09 1994-10-25 オリンパス光学工業株式会社 ハンダ印刷用スキージ
US5824155A (en) * 1995-11-08 1998-10-20 Ford Motor Company Method and apparatus for dispensing viscous material
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557870A (ja) * 1991-09-02 1993-03-09 Matsushita Electric Ind Co Ltd 流動体塗布方法および装置
WO1996020088A1 (en) * 1994-12-27 1996-07-04 Ford Motor Company Method and apparatus for dispensing viscous material
JP2000202988A (ja) * 1999-01-14 2000-07-25 Ricoh Microelectronics Co Ltd 印刷剤充填装置

Also Published As

Publication number Publication date
US6746710B1 (en) 2004-06-08
WO2001005592A1 (en) 2001-01-25
EP1202862A1 (en) 2002-05-08
DE60011091D1 (de) 2004-07-01
EP1202862B1 (en) 2004-05-26
GB2352209A (en) 2001-01-24
JP2003504249A (ja) 2003-02-04
GB9916906D0 (en) 1999-09-22
ATE267702T1 (de) 2004-06-15
DE60011091T2 (de) 2005-05-25
CA2379904A1 (en) 2001-01-25

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