ATE267702T1 - Siebdruckvorrichtung - Google Patents

Siebdruckvorrichtung

Info

Publication number
ATE267702T1
ATE267702T1 AT00946159T AT00946159T ATE267702T1 AT E267702 T1 ATE267702 T1 AT E267702T1 AT 00946159 T AT00946159 T AT 00946159T AT 00946159 T AT00946159 T AT 00946159T AT E267702 T1 ATE267702 T1 AT E267702T1
Authority
AT
Austria
Prior art keywords
chamber
pasty product
printing screen
main body
printing
Prior art date
Application number
AT00946159T
Other languages
German (de)
English (en)
Inventor
Philip John Lambert
Original Assignee
Dek Int Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dek Int Gmbh filed Critical Dek Int Gmbh
Application granted granted Critical
Publication of ATE267702T1 publication Critical patent/ATE267702T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paper (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT00946159T 1999-07-19 2000-07-19 Siebdruckvorrichtung ATE267702T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9916906A GB2352209A (en) 1999-07-19 1999-07-19 Improvements relating to screen printing
PCT/GB2000/002781 WO2001005592A1 (en) 1999-07-19 2000-07-19 Improvements relating to screen printing

Publications (1)

Publication Number Publication Date
ATE267702T1 true ATE267702T1 (de) 2004-06-15

Family

ID=10857510

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00946159T ATE267702T1 (de) 1999-07-19 2000-07-19 Siebdruckvorrichtung

Country Status (8)

Country Link
US (1) US6746710B1 (cg-RX-API-DMAC7.html)
EP (1) EP1202862B1 (cg-RX-API-DMAC7.html)
JP (1) JP4831904B2 (cg-RX-API-DMAC7.html)
AT (1) ATE267702T1 (cg-RX-API-DMAC7.html)
CA (1) CA2379904A1 (cg-RX-API-DMAC7.html)
DE (1) DE60011091T2 (cg-RX-API-DMAC7.html)
GB (1) GB2352209A (cg-RX-API-DMAC7.html)
WO (1) WO2001005592A1 (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3646603B2 (ja) 2000-02-17 2005-05-11 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP4156227B2 (ja) * 2001-11-02 2008-09-24 松下電器産業株式会社 スクリーン印刷装置
FR2881077B1 (fr) 2005-01-27 2007-06-29 Novatec Sa Sa Soc Dispositif de transfert par serigraphie
GB2437070B (en) 2006-04-10 2011-12-14 Dek Int Gmbh Screen printing head and system
ES2341739T3 (es) * 2006-10-24 2010-06-25 Commissariat A L'energie Atomique Dispositivo y procedimiento de metalizacion.
KR100861611B1 (ko) * 2006-11-14 2008-10-07 삼성전기주식회사 인쇄 장치
US7980445B2 (en) * 2008-01-23 2011-07-19 International Business Machines Corporation Fill head for full-field solder coverage with a rotatable member
GB2458313B (en) 2008-03-13 2012-05-23 Dek Int Gmbh Print head assembly, screen printing system and method
DE102008041423B4 (de) * 2008-08-21 2015-04-16 Fmp Technology Gmbh Fluid Measurements & Projects Beschichtungswerkzeug zum Auftragen eines Flüssigkeitsfilms auf ein Substrat
CN103109589A (zh) * 2011-04-27 2013-05-15 松下电器产业株式会社 布线基板的制造方法
JP4973796B1 (ja) 2011-04-27 2012-07-11 パナソニック株式会社 配線基板の製造方法
EP2590488A4 (en) * 2011-07-27 2013-10-23 Panasonic Corp METHOD FOR PRODUCING A REUSABLE PASTE, REUSABLE PASTE AND METHOD FOR PRODUCING A WELDING SUBSTRATE WITH THE REUSABLE PASTE
KR20130022184A (ko) * 2011-08-25 2013-03-06 삼성전자주식회사 스퀴즈장치
JP6251012B2 (ja) * 2013-11-18 2017-12-20 株式会社ケー・アイ・エス パターン形成装置
TWI558574B (zh) * 2014-12-05 2016-11-21 Metal Ind Res & Dev Ct Slit Scraper Structure
CN110421965A (zh) * 2019-08-14 2019-11-08 协鑫集成科技股份有限公司 刮刀装置和太阳能电池片丝网印刷机
EP3988312A1 (en) 2020-10-23 2022-04-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Device and method of filling grooves

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1009740A (en) * 1963-07-19 1965-11-10 Bradford Dyers Ass Ltd Stencil-printing machines
NL7403192A (nl) 1974-03-08 1975-09-10 Stork Brabant Bv Verftoevoerelement voor een rotatie zeefdruk machine.
DE3238084A1 (de) * 1982-10-14 1984-04-26 Mathias 4815 Schloss Holte Mitter Vorrichtung zum gleichmaessigen zufuehren, verteilen und auftragen einer verschaeumten auftragsflotte auf eine vorzugsweise textile warenbahn od.dgl.
US4622239A (en) 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
JP3099447B2 (ja) * 1991-09-02 2000-10-16 松下電器産業株式会社 塗布装置及び方法並びに印刷装置及び方法
JPH0675747U (ja) * 1993-04-09 1994-10-25 オリンパス光学工業株式会社 ハンダ印刷用スキージ
WO1996020088A1 (en) * 1994-12-27 1996-07-04 Ford Motor Company Method and apparatus for dispensing viscous material
US5824155A (en) * 1995-11-08 1998-10-20 Ford Motor Company Method and apparatus for dispensing viscous material
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
JP2000202988A (ja) * 1999-01-14 2000-07-25 Ricoh Microelectronics Co Ltd 印刷剤充填装置

Also Published As

Publication number Publication date
JP4831904B2 (ja) 2011-12-07
US6746710B1 (en) 2004-06-08
WO2001005592A1 (en) 2001-01-25
EP1202862A1 (en) 2002-05-08
DE60011091D1 (de) 2004-07-01
EP1202862B1 (en) 2004-05-26
GB2352209A (en) 2001-01-24
JP2003504249A (ja) 2003-02-04
GB9916906D0 (en) 1999-09-22
DE60011091T2 (de) 2005-05-25
CA2379904A1 (en) 2001-01-25

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties