JP4825171B2 - ボンディング装置用撮像装置及び撮像方法 - Google Patents

ボンディング装置用撮像装置及び撮像方法 Download PDF

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Publication number
JP4825171B2
JP4825171B2 JP2007152641A JP2007152641A JP4825171B2 JP 4825171 B2 JP4825171 B2 JP 4825171B2 JP 2007152641 A JP2007152641 A JP 2007152641A JP 2007152641 A JP2007152641 A JP 2007152641A JP 4825171 B2 JP4825171 B2 JP 4825171B2
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Japan
Prior art keywords
imaging
lens
optical system
image
lead frame
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Expired - Fee Related
Application number
JP2007152641A
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English (en)
Japanese (ja)
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JP2008306039A (ja
Inventor
滋 早田
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Shinkawa Ltd
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Shinkawa Ltd
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Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2007152641A priority Critical patent/JP4825171B2/ja
Priority to TW096139980A priority patent/TW200848693A/zh
Priority to KR1020070128130A priority patent/KR100955626B1/ko
Priority to CN2008101089695A priority patent/CN101320703B/zh
Priority to US12/157,025 priority patent/US7848022B2/en
Publication of JP2008306039A publication Critical patent/JP2008306039A/ja
Application granted granted Critical
Publication of JP4825171B2 publication Critical patent/JP4825171B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/18—Arrangements with more than one light path, e.g. for comparing two specimens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)
  • Die Bonding (AREA)
JP2007152641A 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法 Expired - Fee Related JP4825171B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007152641A JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法
TW096139980A TW200848693A (en) 2007-06-08 2007-10-25 Photography apparatus and method thereof for chip bonding device
KR1020070128130A KR100955626B1 (ko) 2007-06-08 2007-12-11 본딩 장치용 촬상 장치 및 촬상 방법
CN2008101089695A CN101320703B (zh) 2007-06-08 2008-06-05 焊接装置用摄像装置及摄像方法
US12/157,025 US7848022B2 (en) 2007-06-08 2008-06-06 Imaging device and method for a bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152641A JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Publications (2)

Publication Number Publication Date
JP2008306039A JP2008306039A (ja) 2008-12-18
JP4825171B2 true JP4825171B2 (ja) 2011-11-30

Family

ID=40180674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007152641A Expired - Fee Related JP4825171B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Country Status (5)

Country Link
US (1) US7848022B2 (enExample)
JP (1) JP4825171B2 (enExample)
KR (1) KR100955626B1 (enExample)
CN (1) CN101320703B (enExample)
TW (1) TW200848693A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825172B2 (ja) * 2007-06-08 2011-11-30 株式会社新川 ボンディング装置用撮像装置及び撮像方法
JP5452973B2 (ja) * 2009-04-28 2014-03-26 富士機械製造株式会社 撮像装置及びその撮像装置を備える切削機械
KR101245530B1 (ko) * 2011-05-26 2013-03-21 주식회사 탑 엔지니어링 광학검사장치 및 이를 구비하는 어레이 테스트 장치
JP5838757B2 (ja) * 2011-11-22 2016-01-06 セイコーエプソン株式会社 棒状ワーク撮像装置および棒状ワークの先端同心判定装置
CN104502360A (zh) * 2014-12-25 2015-04-08 中国科学院半导体研究所 一种芯片外观缺陷检测系统
DE102018211951A1 (de) * 2017-07-20 2019-01-24 Robert Bosch Gmbh Kameravorrichtung für ein Fahrzeug zur Fahrerbeobachtung
JP6821218B2 (ja) * 2017-10-26 2021-01-27 株式会社新川 ボンディング装置
JP7112341B2 (ja) * 2019-01-23 2022-08-03 東レエンジニアリング株式会社 実装装置および実装方法
JP7114537B2 (ja) * 2019-09-13 2022-08-08 株式会社東芝 半導体検査装置及び半導体装置の検査方法
CN111505819B (zh) * 2020-05-21 2022-04-05 杨星瑶 显微仪器和利用数字序列图像进行重复定位与测量的方法
CN115836383B (zh) * 2020-07-13 2026-08-11 东丽工程株式会社 安装装置及安装方法
WO2022208624A1 (ja) * 2021-03-29 2022-10-06 平田機工株式会社 ワイヤボンディング装置
CN114289886A (zh) * 2022-01-17 2022-04-08 苏州德龙激光股份有限公司 组合式振镜三维激光刻蚀设备及其方法
CN116931236B (zh) * 2023-09-14 2023-11-28 长春长光智欧科技有限公司 一种基于探针对准晶圆的双倍率光学系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301148A (ja) 1989-05-16 1990-12-13 Nec Corp ワイヤーボンディング装置用カメラ
JPH04240740A (ja) * 1991-01-25 1992-08-28 Nec Corp ボンディング装置
JPH05332739A (ja) * 1992-05-28 1993-12-14 Fujitsu Ltd 外観検査装置
JPH0750329A (ja) * 1992-06-24 1995-02-21 Nippon Steel Corp 半導体用ボンディングワイヤの形状測定方法および装置
JPH07270716A (ja) * 1994-03-31 1995-10-20 Ntn Corp 光学装置
JPH08285539A (ja) * 1995-04-18 1996-11-01 Hitachi Ltd パターン計測方法及びその装置
JPH09155786A (ja) * 1995-12-11 1997-06-17 Copal Co Ltd 電子部品の撮像装置
JP3272640B2 (ja) 1997-07-11 2002-04-08 株式会社カイジョー ボンディング装置
JP3626141B2 (ja) * 2001-08-10 2005-03-02 株式会社ソキア 撮像装置を備えた自動視準測量機
JP3857934B2 (ja) 2002-03-08 2006-12-13 株式会社堀場製作所 半導体測定装置
JP2006134917A (ja) * 2004-11-02 2006-05-25 Apic Yamada Corp 樹脂封止方法

Also Published As

Publication number Publication date
US20090124028A1 (en) 2009-05-14
CN101320703B (zh) 2011-03-30
TW200848693A (en) 2008-12-16
KR20080107973A (ko) 2008-12-11
US7848022B2 (en) 2010-12-07
TWI340231B (enExample) 2011-04-11
KR100955626B1 (ko) 2010-05-03
CN101320703A (zh) 2008-12-10
JP2008306039A (ja) 2008-12-18

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