JP4824929B2 - 統合利用のために改良された検査システム - Google Patents

統合利用のために改良された検査システム Download PDF

Info

Publication number
JP4824929B2
JP4824929B2 JP2004536521A JP2004536521A JP4824929B2 JP 4824929 B2 JP4824929 B2 JP 4824929B2 JP 2004536521 A JP2004536521 A JP 2004536521A JP 2004536521 A JP2004536521 A JP 2004536521A JP 4824929 B2 JP4824929 B2 JP 4824929B2
Authority
JP
Japan
Prior art keywords
radiation
scattered
optical fibers
optical fiber
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004536521A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005539225A5 (enExample
JP2005539225A (ja
Inventor
ヴァエス−イラバニ,メディ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2005539225A publication Critical patent/JP2005539225A/ja
Publication of JP2005539225A5 publication Critical patent/JP2005539225A5/ja
Application granted granted Critical
Publication of JP4824929B2 publication Critical patent/JP4824929B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N21/4738Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G01N21/474Details of optical heads therefor, e.g. using optical fibres
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004536521A 2002-09-13 2003-09-10 統合利用のために改良された検査システム Expired - Fee Related JP4824929B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41071702P 2002-09-13 2002-09-13
US60/410,717 2002-09-13
PCT/US2003/028593 WO2004025848A1 (en) 2002-09-13 2003-09-10 Improved inspection system for integrated applications

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011104180A Division JP5438064B2 (ja) 2002-09-13 2011-05-09 統合利用のために改良された検査システム

Publications (3)

Publication Number Publication Date
JP2005539225A JP2005539225A (ja) 2005-12-22
JP2005539225A5 JP2005539225A5 (enExample) 2006-10-26
JP4824929B2 true JP4824929B2 (ja) 2011-11-30

Family

ID=31994189

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004536521A Expired - Fee Related JP4824929B2 (ja) 2002-09-13 2003-09-10 統合利用のために改良された検査システム
JP2011104180A Expired - Fee Related JP5438064B2 (ja) 2002-09-13 2011-05-09 統合利用のために改良された検査システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011104180A Expired - Fee Related JP5438064B2 (ja) 2002-09-13 2011-05-09 統合利用のために改良された検査システム

Country Status (3)

Country Link
US (1) US7116413B2 (enExample)
JP (2) JP4824929B2 (enExample)
WO (1) WO2004025848A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004031741A2 (en) * 2002-09-30 2004-04-15 Applied Materials Israel, Ltd. Illumination system for optical inspection
US7319229B2 (en) * 2003-12-29 2008-01-15 Kla-Tencor Technologies Corporation Illumination apparatus and methods
US7417722B2 (en) * 2004-12-19 2008-08-26 Kla-Tencor Technologies Corporation System and method for controlling light scattered from a workpiece surface in a surface inspection system
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
US7433033B2 (en) * 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
US20080068593A1 (en) * 2006-09-13 2008-03-20 Hiroyuki Nakano Method and apparatus for detecting defects
JP4876019B2 (ja) * 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US7746459B2 (en) * 2007-08-10 2010-06-29 Kla-Tencor Technologies Corp. Systems configured to inspect a wafer
US7623229B1 (en) 2008-10-07 2009-11-24 Kla-Tencor Corporation Systems and methods for inspecting wafers
US20110242312A1 (en) * 2010-03-30 2011-10-06 Lasertec Corporation Inspection system and inspection method
US8736831B2 (en) 2012-05-15 2014-05-27 Kla-Tencor Corp. Substrate inspection
DE102014103221A1 (de) * 2014-03-11 2015-09-17 Alpma Alpenland Maschinenbau Gmbh Anordnung von optischen Elementen zur Inspektion von Lebensmitteloberflächen
WO2020132961A1 (zh) * 2018-12-26 2020-07-02 合刃科技(深圳)有限公司 外观缺陷检测方法及装置
WO2022270864A1 (ko) * 2021-06-24 2022-12-29 (주)엠텔리 골프공 선별 장치
CN115389624B (zh) * 2022-10-27 2023-02-10 智能网联汽车(山东)协同创新研究院有限公司 一种加工用声波测试系统

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63143831A (ja) * 1986-12-08 1988-06-16 Hitachi Electronics Eng Co Ltd 面板欠陥検出光学装置
JPH0552764A (ja) * 1991-08-26 1993-03-02 Kobe Steel Ltd 表面欠陥検査装置
WO1996028721A1 (en) * 1995-03-10 1996-09-19 Hitachi, Ltd. Inspection method, inspection apparatus and method of production of semiconductor device using them
JPH1164234A (ja) * 1997-08-20 1999-03-05 Advantest Corp 異物検出方法、および異物検出装置
JP2000162141A (ja) * 1998-11-27 2000-06-16 Hitachi Ltd 欠陥検査装置および方法
JP2001255278A (ja) * 2000-03-08 2001-09-21 Hitachi Ltd 表面検査装置およびその方法
JP2002513461A (ja) * 1996-06-04 2002-05-08 ケーエルエー―テンカー コーポレイション 表面検査用光学走査システム
JP2003149159A (ja) * 2001-07-10 2003-05-21 Kla Tencor Technologies Corp 同時のまたは連続的な多重の斜視的な試料欠陥検査のためのシステムおよび方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523841A (en) * 1979-03-15 1985-06-18 Coulter Electronics, Inc. Radiant energy reradiating flow cell system and method
US4314763A (en) * 1979-01-04 1982-02-09 Rca Corporation Defect detection system
JPS56126747A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Inspecting method for flaw, alien substance and the like on surface of sample and device therefor
US4391524A (en) * 1981-03-16 1983-07-05 Rca Corporation Method for determining the quality of light scattering material
US4378159A (en) * 1981-03-30 1983-03-29 Tencor Instruments Scanning contaminant and defect detector
JPS57161640A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for surface
US4479714A (en) * 1981-04-14 1984-10-30 Lehrer Leo K Reflection densitometer with ellipsoid reflection surface
US4598997A (en) * 1982-02-15 1986-07-08 Rca Corporation Apparatus and method for detecting defects and dust on a patterned surface
US4526468A (en) * 1983-06-30 1985-07-02 Rca Corporation Method for determining the phase of phase transformable light scattering material
US4735504A (en) * 1983-10-31 1988-04-05 Technicon Instruments Corporation Method and apparatus for determining the volume & index of refraction of particles
US4744663A (en) * 1984-12-14 1988-05-17 Nippon Kogaku K.K. Pattern position detection apparatus using laser beam
JPS6285449A (ja) 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造
US4893932A (en) * 1986-05-02 1990-01-16 Particle Measuring Systems, Inc. Surface analysis system and method
JPS6314830A (ja) 1986-07-04 1988-01-22 Seiko Epson Corp 耐硫化性硬質銀合金
JPS63140904A (ja) 1986-12-04 1988-06-13 Toshiba Corp 散乱光測定装置
US4794265A (en) * 1987-05-08 1988-12-27 Qc Optics, Inc. Surface pit detection system and method
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
JPH0196537A (ja) * 1987-10-08 1989-04-14 Hitachi Electron Eng Co Ltd ガラスディスク欠陥識別方法および欠陥検出光学装置
US4929845A (en) * 1989-02-27 1990-05-29 At&T Bell Laboratories Method and apparatus for inspection of substrates
CH681495A5 (enExample) * 1990-03-05 1993-03-31 Tet Techno Investment Trust
IL94368A (en) * 1990-05-11 1993-07-08 Orbot Systems Ltd Optic inspection apparatus and illumination system particularly useful therein
US5076692A (en) * 1990-05-31 1991-12-31 Tencor Instruments Particle detection on a patterned or bare wafer surface
JP3323537B2 (ja) * 1991-07-09 2002-09-09 キヤノン株式会社 微細構造評価装置及び微細構造評価法
US5377002A (en) * 1991-07-20 1994-12-27 Tet Techno Trust Investment Settlement Apparatus for surface inspections
US5377001A (en) * 1991-07-20 1994-12-27 Tet Techno Trust Investment Settlement Apparatus for surface inspection
US5189481A (en) * 1991-07-26 1993-02-23 Tencor Instruments Particle detector for rough surfaces
JPH05127050A (ja) * 1991-10-30 1993-05-25 Hitachi Ltd 半導体レーザモジユール
US5798831A (en) * 1991-12-19 1998-08-25 Nikon Corporation Defect inspecting apparatus and defect inspecting method
US5424838A (en) * 1993-03-01 1995-06-13 Siu; Bernard Microelectronics inspection system
US5389794A (en) * 1992-11-25 1995-02-14 Qc Optics, Inc. Surface pit and mound detection and discrimination system and method
JPH06174655A (ja) * 1992-12-08 1994-06-24 Hitachi Electron Eng Co Ltd 膜付きウエハの異物検出方法および異物検査装置
US5406367A (en) * 1993-05-10 1995-04-11 Midwest Research Institute Defect mapping system
US5416594A (en) * 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
US6271916B1 (en) * 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5530550A (en) * 1994-12-21 1996-06-25 Tencor Instruments Optical wafer positioning system
DE4440261C2 (de) 1994-11-11 1997-04-30 Wirth Co Kg Masch Bohr Maschine zum Vortreiben von Strecken, Tunneln od. dgl.
JPH08152430A (ja) * 1994-11-29 1996-06-11 Seiko Instr Inc 位置合わせ機能付き顕微鏡
US6104945A (en) * 1995-08-01 2000-08-15 Medispectra, Inc. Spectral volume microprobe arrays
US5798829A (en) * 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6171174B1 (en) 1998-06-26 2001-01-09 Advanced Micro Devices System and method for controlling a multi-arm polishing tool
US6230069B1 (en) 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
US6366690B1 (en) 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
US6088092A (en) * 1999-06-21 2000-07-11 Phase Metrics, Inc. Glass substrate inspection apparatus
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63143831A (ja) * 1986-12-08 1988-06-16 Hitachi Electronics Eng Co Ltd 面板欠陥検出光学装置
JPH0552764A (ja) * 1991-08-26 1993-03-02 Kobe Steel Ltd 表面欠陥検査装置
WO1996028721A1 (en) * 1995-03-10 1996-09-19 Hitachi, Ltd. Inspection method, inspection apparatus and method of production of semiconductor device using them
JP2002513461A (ja) * 1996-06-04 2002-05-08 ケーエルエー―テンカー コーポレイション 表面検査用光学走査システム
JPH1164234A (ja) * 1997-08-20 1999-03-05 Advantest Corp 異物検出方法、および異物検出装置
JP2000162141A (ja) * 1998-11-27 2000-06-16 Hitachi Ltd 欠陥検査装置および方法
JP2001255278A (ja) * 2000-03-08 2001-09-21 Hitachi Ltd 表面検査装置およびその方法
JP2003149159A (ja) * 2001-07-10 2003-05-21 Kla Tencor Technologies Corp 同時のまたは連続的な多重の斜視的な試料欠陥検査のためのシステムおよび方法

Also Published As

Publication number Publication date
WO2004025848A9 (en) 2004-11-11
JP2005539225A (ja) 2005-12-22
US20040125368A1 (en) 2004-07-01
JP5438064B2 (ja) 2014-03-12
WO2004025848A1 (en) 2004-03-25
US7116413B2 (en) 2006-10-03
JP2011215150A (ja) 2011-10-27

Similar Documents

Publication Publication Date Title
JP5438064B2 (ja) 統合利用のために改良された検査システム
JP5425494B2 (ja) 不良検出システムの改良
US7369233B2 (en) Optical system for measuring samples using short wavelength radiation
US5189481A (en) Particle detector for rough surfaces
US6538730B2 (en) Defect detection system
US8804109B2 (en) Defect inspection system
US6956644B2 (en) Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US5748305A (en) Method and apparatus for particle inspection
CA2153774C (en) Particle detection system with reflective line-to-spot collector
US20070229833A1 (en) High-sensitivity surface detection system and method
EP0178037B1 (en) Compact laser scanning system
US20020054704A1 (en) Pixel based machine for patterned wafers
US20080068593A1 (en) Method and apparatus for detecting defects
JP2007526444A (ja) パターン化ウェハまたは非パターン化ウェハおよびその他の検体の検査システム
JP2006098154A (ja) 欠陥検査方法およびその装置
JP2008096430A (ja) 欠陥検査方法およびその装置
US6208750B1 (en) Method for detecting particles using illumination with several wavelengths
JPH02140742A (ja) レティクル点検方法および装置
US7061598B1 (en) Darkfield inspection system having photodetector array
JP2005539225A5 (enExample)
JP2008014848A (ja) 表面検査方法及び表面検査装置
JPH07128244A (ja) 非破壊表面検査方法及びその装置
US6236056B1 (en) Defect evaluation apparatus for evaluating defects and shape information thereof in an object or on the surface of an object
JPH06294752A (ja) ウエーハ表面検査装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060908

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090616

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090916

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090928

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091015

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091022

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091116

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100309

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100607

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100614

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100708

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100715

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100806

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100813

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101109

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110127

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110506

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110816

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110909

R150 Certificate of patent or registration of utility model

Ref document number: 4824929

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140916

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees