JP4820534B2 - 低温時の基板を試験するプローバ - Google Patents

低温時の基板を試験するプローバ Download PDF

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Publication number
JP4820534B2
JP4820534B2 JP2003343146A JP2003343146A JP4820534B2 JP 4820534 B2 JP4820534 B2 JP 4820534B2 JP 2003343146 A JP2003343146 A JP 2003343146A JP 2003343146 A JP2003343146 A JP 2003343146A JP 4820534 B2 JP4820534 B2 JP 4820534B2
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Japan
Prior art keywords
chuck
prober
test substrate
radiation shield
cooled
Prior art date
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Expired - Fee Related
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JP2003343146A
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English (en)
Japanese (ja)
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JP2004128509A (ja
JP2004128509A5 (enrdf_load_stackoverflow
Inventor
シュテファン・シュナイデヴィント
クラウス・ディートリッヒ
イエルク・キーゼヴェッター
ハンス−ミヒャエル・ヴェルナー
アクセル・シュミット
マティアス・ツィーガー
Original Assignee
カスケード・マイクロテク・ドレスデン・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
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Publication of JP2004128509A publication Critical patent/JP2004128509A/ja
Publication of JP2004128509A5 publication Critical patent/JP2004128509A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2003343146A 2002-10-02 2003-10-01 低温時の基板を試験するプローバ Expired - Fee Related JP4820534B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002146282 DE10246282B4 (de) 2002-10-02 2002-10-02 Prober zum Testen von Substraten bei tiefen Temperaturen
DE10246282.8 2002-10-02

Publications (3)

Publication Number Publication Date
JP2004128509A JP2004128509A (ja) 2004-04-22
JP2004128509A5 JP2004128509A5 (enrdf_load_stackoverflow) 2006-10-05
JP4820534B2 true JP4820534B2 (ja) 2011-11-24

Family

ID=32010197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003343146A Expired - Fee Related JP4820534B2 (ja) 2002-10-02 2003-10-01 低温時の基板を試験するプローバ

Country Status (2)

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JP (1) JP4820534B2 (enrdf_load_stackoverflow)
DE (1) DE10246282B4 (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3945527B2 (ja) 2004-11-30 2007-07-18 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP2007201484A (ja) * 2004-11-30 2007-08-09 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
DE102005015334B4 (de) * 2005-04-01 2017-02-09 Cascade Microtech, Inc. Prober zum Testen von Substraten bei Temperaturen im Bereich der Siedetemperatur von Helium
JP4049172B2 (ja) 2005-07-13 2008-02-20 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP2007227250A (ja) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp 検査装置及び検査装置の予備排気室を真空排気する方法
DE102006038457B4 (de) * 2006-08-16 2014-05-22 Cascade Microtech, Inc. Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente
DE102007058457B4 (de) 2006-12-08 2018-06-07 Cascade Microtech, Inc. Anordnung und Verfahren zur Testung von Halbleitersubstraten unter definierter Atmosphäre
JP2007235171A (ja) * 2007-05-17 2007-09-13 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
US8497693B2 (en) 2007-10-10 2013-07-30 Cascade Microtech, Inc. Method for testing a test substrate under defined thermal conditions and thermally conditionable prober
JP6161327B2 (ja) * 2013-02-28 2017-07-12 株式会社 エイブイシー 四端子抵抗測定装置および四端子測定用プローブ
DE102013215781A1 (de) * 2013-08-09 2015-02-12 Ers Electronic Gmbh Thermische Abschirmvorrichtung für eine Probecard und entsprechende Probecardanordnung
CN107389455B (zh) * 2017-09-05 2023-06-06 中国工程物理研究院流体物理研究所 用于磁驱动斜波压缩中样品初始温度的降温装置及方法
CN108918977B (zh) * 2018-05-02 2024-02-06 沈阳工业大学 一种低温条件下电介质气固界面闪络特性测量装置及方法
EP3734301A1 (en) * 2019-05-03 2020-11-04 Afore Oy Cryogenic wafer prober with movable thermal radiation shield
EP3734303B1 (en) * 2019-05-03 2024-04-03 Afore Oy Cryogenic probe station with loading assembly
CN115165927A (zh) * 2022-07-28 2022-10-11 河北博威集成电路有限公司 一种3d化合物半导体芯片的检测方法
CN116165472B (zh) * 2023-04-22 2023-07-04 深圳市森美协尔科技有限公司 一种低温探针测试设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190737A (ja) * 1986-02-17 1987-08-20 Fujitsu Ltd 低温用オ−トプロ−バ−
JPH01278739A (ja) * 1988-04-30 1989-11-09 Nippon Denshi Zairyo Kk 半導体ウェハー低温試験装置
JPH0685020A (ja) * 1990-05-16 1994-03-25 Fujitsu Ltd 低温領域の気体吸着防止機構
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers
JPH06323955A (ja) * 1993-05-17 1994-11-25 Canon Inc 半導体試験装置
JPH0982785A (ja) * 1995-09-18 1997-03-28 Nec Corp 半導体ウェハ温度制御装置

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Publication number Publication date
DE10246282A1 (de) 2004-04-15
DE10246282B4 (de) 2005-12-29
JP2004128509A (ja) 2004-04-22

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