DE10246282B4 - Prober zum Testen von Substraten bei tiefen Temperaturen - Google Patents

Prober zum Testen von Substraten bei tiefen Temperaturen Download PDF

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Publication number
DE10246282B4
DE10246282B4 DE2002146282 DE10246282A DE10246282B4 DE 10246282 B4 DE10246282 B4 DE 10246282B4 DE 2002146282 DE2002146282 DE 2002146282 DE 10246282 A DE10246282 A DE 10246282A DE 10246282 B4 DE10246282 B4 DE 10246282B4
Authority
DE
Germany
Prior art keywords
chuck
heat radiation
test substrate
prober according
prober
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE2002146282
Other languages
German (de)
English (en)
Other versions
DE10246282A1 (de
Inventor
Stefan Dr. Schneidewind
Claus Dr.-Ing. Dietrich
Jörg Dr.-Ing. Kiesewetter
Frank-Michael Werner
Axel Schmidt
Matthias Zieger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Beaverton Inc
Original Assignee
SUSS MicroTec Test Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUSS MicroTec Test Systems GmbH filed Critical SUSS MicroTec Test Systems GmbH
Priority to DE2002146282 priority Critical patent/DE10246282B4/de
Priority to JP2003343146A priority patent/JP4820534B2/ja
Priority to US10/677,524 priority patent/US7038441B2/en
Priority to US10/677,178 priority patent/US7046025B2/en
Publication of DE10246282A1 publication Critical patent/DE10246282A1/de
Application granted granted Critical
Publication of DE10246282B4 publication Critical patent/DE10246282B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE2002146282 2002-10-02 2002-10-02 Prober zum Testen von Substraten bei tiefen Temperaturen Expired - Fee Related DE10246282B4 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE2002146282 DE10246282B4 (de) 2002-10-02 2002-10-02 Prober zum Testen von Substraten bei tiefen Temperaturen
JP2003343146A JP4820534B2 (ja) 2002-10-02 2003-10-01 低温時の基板を試験するプローバ
US10/677,524 US7038441B2 (en) 2002-10-02 2003-10-02 Test apparatus with loading device
US10/677,178 US7046025B2 (en) 2002-10-02 2003-10-02 Test apparatus for testing substrates at low temperatures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2002146282 DE10246282B4 (de) 2002-10-02 2002-10-02 Prober zum Testen von Substraten bei tiefen Temperaturen

Publications (2)

Publication Number Publication Date
DE10246282A1 DE10246282A1 (de) 2004-04-15
DE10246282B4 true DE10246282B4 (de) 2005-12-29

Family

ID=32010197

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2002146282 Expired - Fee Related DE10246282B4 (de) 2002-10-02 2002-10-02 Prober zum Testen von Substraten bei tiefen Temperaturen

Country Status (2)

Country Link
JP (1) JP4820534B2 (enrdf_load_stackoverflow)
DE (1) DE10246282B4 (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3945527B2 (ja) 2004-11-30 2007-07-18 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP2007201484A (ja) * 2004-11-30 2007-08-09 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
DE102005015334B4 (de) * 2005-04-01 2017-02-09 Cascade Microtech, Inc. Prober zum Testen von Substraten bei Temperaturen im Bereich der Siedetemperatur von Helium
JP4049172B2 (ja) 2005-07-13 2008-02-20 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP2007227250A (ja) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp 検査装置及び検査装置の予備排気室を真空排気する方法
DE102006038457B4 (de) * 2006-08-16 2014-05-22 Cascade Microtech, Inc. Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente
DE102007058457B4 (de) 2006-12-08 2018-06-07 Cascade Microtech, Inc. Anordnung und Verfahren zur Testung von Halbleitersubstraten unter definierter Atmosphäre
JP2007235171A (ja) * 2007-05-17 2007-09-13 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
US8497693B2 (en) 2007-10-10 2013-07-30 Cascade Microtech, Inc. Method for testing a test substrate under defined thermal conditions and thermally conditionable prober
JP6161327B2 (ja) * 2013-02-28 2017-07-12 株式会社 エイブイシー 四端子抵抗測定装置および四端子測定用プローブ
DE102013215781A1 (de) * 2013-08-09 2015-02-12 Ers Electronic Gmbh Thermische Abschirmvorrichtung für eine Probecard und entsprechende Probecardanordnung
CN107389455B (zh) * 2017-09-05 2023-06-06 中国工程物理研究院流体物理研究所 用于磁驱动斜波压缩中样品初始温度的降温装置及方法
CN108918977B (zh) * 2018-05-02 2024-02-06 沈阳工业大学 一种低温条件下电介质气固界面闪络特性测量装置及方法
EP3734301A1 (en) * 2019-05-03 2020-11-04 Afore Oy Cryogenic wafer prober with movable thermal radiation shield
EP3734303B1 (en) * 2019-05-03 2024-04-03 Afore Oy Cryogenic probe station with loading assembly
CN115165927A (zh) * 2022-07-28 2022-10-11 河北博威集成电路有限公司 一种3d化合物半导体芯片的检测方法
CN116165472B (zh) * 2023-04-22 2023-07-04 深圳市森美协尔科技有限公司 一种低温探针测试设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190737A (ja) * 1986-02-17 1987-08-20 Fujitsu Ltd 低温用オ−トプロ−バ−
JPH01278739A (ja) * 1988-04-30 1989-11-09 Nippon Denshi Zairyo Kk 半導体ウェハー低温試験装置
JPH0685020A (ja) * 1990-05-16 1994-03-25 Fujitsu Ltd 低温領域の気体吸着防止機構
JPH06323955A (ja) * 1993-05-17 1994-11-25 Canon Inc 半導体試験装置
JPH0982785A (ja) * 1995-09-18 1997-03-28 Nec Corp 半導体ウェハ温度制御装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers

Also Published As

Publication number Publication date
DE10246282A1 (de) 2004-04-15
JP2004128509A (ja) 2004-04-22
JP4820534B2 (ja) 2011-11-24

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8181 Inventor (new situation)

Inventor name: KIESEWETTER, JOERG, DR.-ING., 01109 DRESDEN, DE

Inventor name: WERNER, FRANK-MICHAEL, 01217 DRESDEN, DE

Inventor name: ZIEGER, MATTHIAS, 01587 RIESA, DE

Inventor name: SCHNEIDEWIND, STEFAN, DR., 01468 REICHENBERG, DE

Inventor name: SCHMIDT, AXEL, 01561 THIENDORF, DE

Inventor name: DIETRICH, CLAUS, DR.-ING., 01561 THIENDORF, DE

8110 Request for examination paragraph 44
8364 No opposition during term of opposition
R082 Change of representative

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

R081 Change of applicant/patentee

Owner name: CASCADE MICROTECH, INC., BEAVERTON, US

Free format text: FORMER OWNER: SUSS MICROTEC TEST SYSTEMS GMBH, 01561 THIENDORF, DE

Effective date: 20140407

Owner name: CASCADE MICROTECH, INC., US

Free format text: FORMER OWNER: SUSS MICROTEC TEST SYSTEMS GMBH, 01561 THIENDORF, DE

Effective date: 20140407

R082 Change of representative

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

Effective date: 20140407

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

Effective date: 20140407

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee