JP4805258B2 - カセット搬送システム - Google Patents

カセット搬送システム Download PDF

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Publication number
JP4805258B2
JP4805258B2 JP2007514640A JP2007514640A JP4805258B2 JP 4805258 B2 JP4805258 B2 JP 4805258B2 JP 2007514640 A JP2007514640 A JP 2007514640A JP 2007514640 A JP2007514640 A JP 2007514640A JP 4805258 B2 JP4805258 B2 JP 4805258B2
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JP
Japan
Prior art keywords
cassette
transfer
transport
arm
transfer arm
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Active
Application number
JP2007514640A
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English (en)
Japanese (ja)
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JPWO2006115157A1 (ja
Inventor
文雄 崎谷
勝則 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rorze Corp
Original Assignee
Rorze Corp
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Filing date
Publication date
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Priority to JP2007514640A priority Critical patent/JP4805258B2/ja
Publication of JPWO2006115157A1 publication Critical patent/JPWO2006115157A1/ja
Application granted granted Critical
Publication of JP4805258B2 publication Critical patent/JP4805258B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007514640A 2005-04-22 2006-04-20 カセット搬送システム Active JP4805258B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007514640A JP4805258B2 (ja) 2005-04-22 2006-04-20 カセット搬送システム

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005125765 2005-04-22
JP2005125765 2005-04-22
JP2005178630 2005-06-17
JP2005178630 2005-06-17
PCT/JP2006/308280 WO2006115157A1 (ja) 2005-04-22 2006-04-20 カセット搬送システム
JP2007514640A JP4805258B2 (ja) 2005-04-22 2006-04-20 カセット搬送システム

Publications (2)

Publication Number Publication Date
JPWO2006115157A1 JPWO2006115157A1 (ja) 2008-12-18
JP4805258B2 true JP4805258B2 (ja) 2011-11-02

Family

ID=37214775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007514640A Active JP4805258B2 (ja) 2005-04-22 2006-04-20 カセット搬送システム

Country Status (4)

Country Link
JP (1) JP4805258B2 (zh)
KR (1) KR100945983B1 (zh)
TW (1) TWI392049B (zh)
WO (1) WO2006115157A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101586694B1 (ko) * 2014-05-20 2016-01-19 주식회사 에스에프에이 카세트 이송 시스템
KR101736351B1 (ko) * 2016-08-16 2017-05-16 오세덕 웨이퍼 이송용 로드포트

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251348A (ja) * 2012-05-30 2013-12-12 Tokyo Ohka Kogyo Co Ltd 基板保持装置及び基板処理装置
CN108615332A (zh) * 2016-12-13 2018-10-02 海太半导体（无锡）有限公司 贴片设备基板位置传感器感应和报警系统
JP7436197B2 (ja) 2019-12-16 2024-02-21 ファナック株式会社 物品搬送システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163052A (ja) * 1985-01-11 1986-07-23 Mitsubishi Heavy Ind Ltd 空気浮上運搬装置
JPS61273421A (ja) * 1985-05-27 1986-12-03 Toshiba Corp 搬送装置
JPH04186652A (ja) * 1990-11-16 1992-07-03 Hitachi Kiden Kogyo Ltd クリーンルーム用搬送システム
JPH0498591U (zh) * 1991-01-31 1992-08-26
US5820679A (en) * 1993-07-15 1998-10-13 Hitachi, Ltd. Fabrication system and method having inter-apparatus transporter
US20030185655A1 (en) * 2002-03-26 2003-10-02 Yoichi Uchimaki Method and apparatus for transferring substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1137555A (en) * 1965-10-22 1968-12-27 Pilkington Brothers Ltd Improvements in or relating to the transporting of sheet materials
US4627362A (en) * 1983-06-28 1986-12-09 Kabushiki Kaisha Myotoku Air sliding device for work pallets or the like
JPH06206149A (ja) * 1992-12-02 1994-07-26 Hitachi Ltd 生産ライン
US6364593B1 (en) * 2000-06-06 2002-04-02 Brooks Automation Material transport system
JP2004292086A (ja) * 2003-03-26 2004-10-21 Hitachi Kiden Kogyo Ltd エヤー浮上式搬送車

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163052A (ja) * 1985-01-11 1986-07-23 Mitsubishi Heavy Ind Ltd 空気浮上運搬装置
JPS61273421A (ja) * 1985-05-27 1986-12-03 Toshiba Corp 搬送装置
JPH04186652A (ja) * 1990-11-16 1992-07-03 Hitachi Kiden Kogyo Ltd クリーンルーム用搬送システム
JPH0498591U (zh) * 1991-01-31 1992-08-26
US5820679A (en) * 1993-07-15 1998-10-13 Hitachi, Ltd. Fabrication system and method having inter-apparatus transporter
US20030185655A1 (en) * 2002-03-26 2003-10-02 Yoichi Uchimaki Method and apparatus for transferring substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101586694B1 (ko) * 2014-05-20 2016-01-19 주식회사 에스에프에이 카세트 이송 시스템
KR101736351B1 (ko) * 2016-08-16 2017-05-16 오세덕 웨이퍼 이송용 로드포트

Also Published As

Publication number Publication date
KR20080004619A (ko) 2008-01-09
JPWO2006115157A1 (ja) 2008-12-18
KR100945983B1 (ko) 2010-03-09
TWI392049B (zh) 2013-04-01
WO2006115157A1 (ja) 2006-11-02
TW200703544A (en) 2007-01-16

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