JP4802541B2 - 金属箔張り積層板および多層プリント配線板の製造方法 - Google Patents
金属箔張り積層板および多層プリント配線板の製造方法 Download PDFInfo
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- JP4802541B2 JP4802541B2 JP2005118191A JP2005118191A JP4802541B2 JP 4802541 B2 JP4802541 B2 JP 4802541B2 JP 2005118191 A JP2005118191 A JP 2005118191A JP 2005118191 A JP2005118191 A JP 2005118191A JP 4802541 B2 JP4802541 B2 JP 4802541B2
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- metal foil
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- 229910052751 metal Inorganic materials 0.000 title claims description 41
- 239000002184 metal Substances 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000011888 foil Substances 0.000 claims description 43
- 238000007788 roughening Methods 0.000 claims description 26
- 239000011342 resin composition Substances 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 description 25
- 239000003822 epoxy resin Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002140 halogenating effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- -1 methanol and ethanol Chemical compound 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Description
本発明の請求項2に係る多層板の製造方法は、請求項1記載の金属張積層板を用いた内層回路板を1層は構成材に含むことを特徴とする多層プリント配線板の製造方法。
なお、金属張積層板の製造に用いる熱硬化性樹脂組成物及びプリプレグの製造に用いる熱硬化性樹脂組成物の種類は、同じでもよく異なってもよい。
熱硬化性樹脂組成物として、下記のエポキシ樹脂2種類、硬化剤、硬化促進剤及び溶剤よりなるエポキシ樹脂系樹脂組成物を使用した。
・エポキシ樹脂1:ビスフェノールAノボラック型エポキシ樹脂[大日本インキ化学工業株式会社製、エピクロンN868(商品名)を使用した]50重量部。
・エポキシ樹脂2:ブロム化ビスフェノールA型エポキシ樹脂[住友化学工業株式会社、ESB−400(商品名)を使用した]50重量部。
・硬化剤:ビスフェノールAノボラック樹脂[ジャパンエポキシレジン株式会社製、YLH−129(商品名)]を40重量部。
・硬化促進剤:1−シアノエチル−2−フェニルイミダゾール1重量部。
・溶剤:メチルエチルケトンを90重量部。
35μmの銅箔(リバーストリートメント箔:未処理面(光沢面)をめっき処理にて表面粗さ(Rz)を2.0μm以下に平滑化し、その面に粗化処理粗さ(Rz)が3.4μmの粗化処理品)を配して積層したこと以外は実施例1と同様にして両面銅張積層板を得て、さらに多層板を作成した。
35μmの銅箔(リバーストリートメント箔:未処理面(光沢面)へのめっき処理無し、粗化処理粗さ(Rz)2〜3.5μm)を配して積層したこと以外は実施例1と同様にして両面銅張積層板を得て、さらに多層板を作成した。
35μmの銅箔(リバーストリートメント箔:未処理面(光沢面)へのめっき処理無し、粗化処理粗さ(Rz)1〜2μm)を配して積層したこと以外は実施例1と同様にして両面銅張積層板を得て、多層板を作成した。
35μmの銅箔(リバーストリートメント箔:未処理面(光沢面)へのめっき処理無し、粗化処理粗さ(Rz)5〜6μm)を配して積層したこと以外は実施例1と同様にして両面銅張積層板を得て、多層板を作成した。
多層板の断面より、粗化処理粗さを測定した。
実施例1及び比較例1〜3で得られた多層板について、吸湿処理(PCT1.5hr)後288℃ 10秒フロートのはんだ耐熱試験を行った。
Claims (1)
- 平織りのガラスクロスに熱硬化性樹脂組成物を含浸した後、金属箔と積層し、次いで加熱加圧して作製する、絶縁層厚みが0.06mm以下の金属箔張り積層板の製造方法において、前記金属箔として、その未処理面(光沢面)をめっき処理にて表面粗さ(Rz)を2.0μm以下に平滑化し、その面に表面粗さ(Rz)が2.0〜3.5μmの粗化処理が施されている金属箔を用いることを特徴とする金属箔張り積層板の製造方法。
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JP2005118191A JP4802541B2 (ja) | 2005-04-15 | 2005-04-15 | 金属箔張り積層板および多層プリント配線板の製造方法 |
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JP2005118191A JP4802541B2 (ja) | 2005-04-15 | 2005-04-15 | 金属箔張り積層板および多層プリント配線板の製造方法 |
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JP2006297613A JP2006297613A (ja) | 2006-11-02 |
JP4802541B2 true JP4802541B2 (ja) | 2011-10-26 |
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JP2005118191A Active JP4802541B2 (ja) | 2005-04-15 | 2005-04-15 | 金属箔張り積層板および多層プリント配線板の製造方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5740941B2 (ja) * | 2010-11-30 | 2015-07-01 | 住友ベークライト株式会社 | プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
CN111867241A (zh) * | 2020-05-25 | 2020-10-30 | 鹤山市中富兴业电路有限公司 | 一种耐压pcb电路板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09272994A (ja) * | 1996-04-05 | 1997-10-21 | Furukawa Electric Co Ltd:The | ファインパターン用電解銅箔 |
JPH1158610A (ja) * | 1997-08-26 | 1999-03-02 | Matsushita Electric Works Ltd | 金属箔張り積層板の製造方法 |
JP2003031957A (ja) * | 2001-07-18 | 2003-01-31 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
JP2004238647A (ja) * | 2003-02-04 | 2004-08-26 | Furukawa Techno Research Kk | 平滑化銅箔とその製造方法 |
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