JP4799850B2 - 発光体 - Google Patents
発光体 Download PDFInfo
- Publication number
- JP4799850B2 JP4799850B2 JP2004330758A JP2004330758A JP4799850B2 JP 4799850 B2 JP4799850 B2 JP 4799850B2 JP 2004330758 A JP2004330758 A JP 2004330758A JP 2004330758 A JP2004330758 A JP 2004330758A JP 4799850 B2 JP4799850 B2 JP 4799850B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- light emitting
- lead
- leads
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Description
2・・・発光素子(LEDチップ)
3・・・モールド部
3a・・・底面
41、42・・・リード
5・・・基板
Claims (4)
- 発光素子と、その発光素子を保持する樹脂製モールド部と、前記発光素子の正極及び負極にそれぞれ接続されて前記モールド部の底面から突出する一対のリードとを備え、平板状の基板に対しモールド部の底面を接触乃至近接させて半田付けされる直付けタイプのものであって、
前記底面におけるリードの突出部位及びその周囲の所定領域を、当該底面の周縁部に比べ凹ませて、前記底面の周縁部の全てが、前記基板の表面に当接するようにしていることを特徴とする発光体。 - 前記一対のリードが左右に並ぶ方向から見た場合に、前記底面の中央縦断面輪郭形状が中央において最も凹むアーチ型をなすように構成している請求項1記載の発光体。
- 前記モールド部が砲弾型のものである請求項1又は2記載の発光体。
- 前記発光素子がLEDチップである請求項1、2又は3記載の発光体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004330758A JP4799850B2 (ja) | 2004-11-15 | 2004-11-15 | 発光体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004330758A JP4799850B2 (ja) | 2004-11-15 | 2004-11-15 | 発光体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006140407A JP2006140407A (ja) | 2006-06-01 |
JP4799850B2 true JP4799850B2 (ja) | 2011-10-26 |
Family
ID=36621000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004330758A Expired - Fee Related JP4799850B2 (ja) | 2004-11-15 | 2004-11-15 | 発光体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4799850B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2010119830A1 (ja) | 2009-04-13 | 2012-10-22 | パナソニック株式会社 | 発光ダイオード |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3126210B2 (ja) * | 1992-02-27 | 2001-01-22 | ローム株式会社 | 発光ダイオード装置の製造方法 |
JP2003204086A (ja) * | 2001-10-23 | 2003-07-18 | Sharp Corp | 発光ダイオードランプ及びその製造方法 |
-
2004
- 2004-11-15 JP JP2004330758A patent/JP4799850B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006140407A (ja) | 2006-06-01 |
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