JP4796182B2 - ウェハ接合装置 - Google Patents
ウェハ接合装置 Download PDFInfo
- Publication number
- JP4796182B2 JP4796182B2 JP2009502368A JP2009502368A JP4796182B2 JP 4796182 B2 JP4796182 B2 JP 4796182B2 JP 2009502368 A JP2009502368 A JP 2009502368A JP 2009502368 A JP2009502368 A JP 2009502368A JP 4796182 B2 JP4796182 B2 JP 4796182B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- sample stage
- substrate
- load
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 61
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 description 23
- 150000002500 ions Chemical class 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000007664 blowing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- -1 Argon ions Chemical class 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/068—Drive connections, e.g. pivotal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (4)
- 第1基板を保持する第1試料台と、
前記第1基板に対向する第2基板を保持する第2試料台と、
前記第1試料台の周縁部に接合され、前記第1試料台を第1ステージに支持する荷重伝達部と、
前記第1ステージに対して前記第2試料台を駆動することにより、前記第1基板と前記第2基板とを圧接する駆動装置と、
前記第1試料台の向きを変更可能に、前記荷重伝達部を介して前記第1試料台を第1ステージに支持する角度調整機構とを具備し、
前記角度調整機構は、
前記第1試料台に固定される球フランジと、
前記第1ステージに固定される球座と、
前記球フランジをかしめることにより前記球フランジを前記球座に固定する固定フランジとを備える
ウェハ接合装置。 - 請求項1において、
前記荷重伝達部は、前記角度調整機構と前記荷重伝達部とが線接触して、前記角度調整機構に支持される
ウェハ接合装置。 - 請求項1において、
前記荷重伝達部は、複数の柱から形成され、
前記複数の柱は、それぞれ、一端が前記第1試料台の周縁部に接合され、他端が前記角度調整機構に接合される
ウェハ接合装置。 - 請求項1において、
前記荷重伝達部は、複数の柱から形成され、
前記第1基板と前記第2基板とは、圧接されるときに、前記第1基板と前記第2基板とが密着するように、前記複数の柱がそれぞれ弾性変形する
ウェハ接合装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/071232 WO2010058481A1 (ja) | 2008-11-21 | 2008-11-21 | ウェハ接合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4796182B2 true JP4796182B2 (ja) | 2011-10-19 |
JPWO2010058481A1 JPWO2010058481A1 (ja) | 2012-04-12 |
Family
ID=42197928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009502368A Active JP4796182B2 (ja) | 2008-11-21 | 2008-11-21 | ウェハ接合装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8578993B2 (ja) |
EP (1) | EP2357056B1 (ja) |
JP (1) | JP4796182B2 (ja) |
KR (1) | KR101118322B1 (ja) |
CN (1) | CN101965241B (ja) |
CA (1) | CA2735202C (ja) |
WO (1) | WO2010058481A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
DE102010048043A1 (de) * | 2010-10-15 | 2012-04-19 | Ev Group Gmbh | Vorrichtung und Verfahren zur Prozessierung von Wafern |
JP6148532B2 (ja) * | 2013-05-08 | 2017-06-14 | 東京応化工業株式会社 | 貼付装置及び貼付方法 |
US11721596B2 (en) * | 2018-08-29 | 2023-08-08 | Tokyo Electron Limited | Parameter adjustment method of bonding apparatus and bonding system |
KR102191516B1 (ko) * | 2018-11-27 | 2020-12-15 | 코스텍시스템(주) | 기판 접합장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004268113A (ja) * | 2003-03-11 | 2004-09-30 | Fujitsu Ltd | 基板貼合せ装置及び基板貼合せ方法 |
JP2005052841A (ja) * | 2003-08-01 | 2005-03-03 | Meisho Kiko Kk | 高精度プレス機 |
JP2005268766A (ja) * | 2004-02-16 | 2005-09-29 | Bondotekku:Kk | 個別洗浄方法及び装置 |
JP2006222436A (ja) * | 2004-01-22 | 2006-08-24 | Bondotekku:Kk | 接合方法およびこの方法により作成されるデバイス並びに接合装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5645785A (en) * | 1993-08-09 | 1997-07-08 | Saint Gobain Vitrage | Device for extruding a polymer frame onto a plate-shaped object |
JPH09321097A (ja) | 1996-06-03 | 1997-12-12 | Matsushita Electric Ind Co Ltd | バンプ付きワークの押圧装置 |
JP3601401B2 (ja) * | 2000-02-17 | 2004-12-15 | 松下電器産業株式会社 | 電子部品のボンディング装置 |
US6495397B2 (en) * | 2001-03-28 | 2002-12-17 | Intel Corporation | Fluxless flip chip interconnection |
JP2006134899A (ja) | 2002-11-28 | 2006-05-25 | Toray Eng Co Ltd | 接合方法および装置 |
CN100368135C (zh) * | 2005-03-23 | 2008-02-13 | 西北工业大学 | 真空扩散焊机加压方法 |
JP4781902B2 (ja) * | 2006-05-10 | 2011-09-28 | パナソニック株式会社 | 加圧接合装置 |
-
2008
- 2008-11-21 CN CN200880127924.0A patent/CN101965241B/zh active Active
- 2008-11-21 WO PCT/JP2008/071232 patent/WO2010058481A1/ja active Application Filing
- 2008-11-21 JP JP2009502368A patent/JP4796182B2/ja active Active
- 2008-11-21 EP EP08878278.4A patent/EP2357056B1/en active Active
- 2008-11-21 US US12/921,653 patent/US8578993B2/en active Active
- 2008-11-21 CA CA2735202A patent/CA2735202C/en active Active
- 2008-11-21 KR KR1020107020123A patent/KR101118322B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004268113A (ja) * | 2003-03-11 | 2004-09-30 | Fujitsu Ltd | 基板貼合せ装置及び基板貼合せ方法 |
JP2005052841A (ja) * | 2003-08-01 | 2005-03-03 | Meisho Kiko Kk | 高精度プレス機 |
JP2006222436A (ja) * | 2004-01-22 | 2006-08-24 | Bondotekku:Kk | 接合方法およびこの方法により作成されるデバイス並びに接合装置 |
JP2005268766A (ja) * | 2004-02-16 | 2005-09-29 | Bondotekku:Kk | 個別洗浄方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101965241A (zh) | 2011-02-02 |
US20110209832A1 (en) | 2011-09-01 |
CA2735202A1 (en) | 2010-05-27 |
JPWO2010058481A1 (ja) | 2012-04-12 |
WO2010058481A1 (ja) | 2010-05-27 |
KR101118322B1 (ko) | 2012-03-09 |
EP2357056B1 (en) | 2019-04-10 |
EP2357056A1 (en) | 2011-08-17 |
US8578993B2 (en) | 2013-11-12 |
KR20100119566A (ko) | 2010-11-09 |
CN101965241B (zh) | 2015-04-22 |
CA2735202C (en) | 2014-07-29 |
EP2357056A4 (en) | 2012-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4796182B2 (ja) | ウェハ接合装置 | |
JP4209457B1 (ja) | 常温接合装置 | |
JP4548239B2 (ja) | 基板接合方法および基板接合装置 | |
WO2012043054A1 (ja) | 常温接合装置および常温接合方法 | |
JP4859895B2 (ja) | 常温接合装置 | |
WO2010098234A1 (ja) | ウェハ接合装置およびウェハ接合方法 | |
TWI423364B (zh) | 晶圓接合裝置 | |
JP4875678B2 (ja) | 常温接合装置 | |
WO2010067656A1 (ja) | 常温接合装置 | |
JP4875677B2 (ja) | 常温接合装置 | |
JP4875676B2 (ja) | 常温接合装置 | |
JP3433207B2 (ja) | ゲートバルブ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110705 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110728 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4796182 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140805 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |