JP4790970B2 - 放射線誘起表面汚染の軽減 - Google Patents
放射線誘起表面汚染の軽減 Download PDFInfo
- Publication number
- JP4790970B2 JP4790970B2 JP2002553187A JP2002553187A JP4790970B2 JP 4790970 B2 JP4790970 B2 JP 4790970B2 JP 2002553187 A JP2002553187 A JP 2002553187A JP 2002553187 A JP2002553187 A JP 2002553187A JP 4790970 B2 JP4790970 B2 JP 4790970B2
- Authority
- JP
- Japan
- Prior art keywords
- hydrocarbon
- gas
- water vapor
- radiation
- carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 42
- 238000011109 contamination Methods 0.000 title claims abstract description 22
- 230000009467 reduction Effects 0.000 title description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 34
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 27
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 27
- 239000007789 gas Substances 0.000 claims abstract description 25
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000000356 contaminant Substances 0.000 claims abstract description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 32
- 230000003647 oxidation Effects 0.000 claims description 16
- 238000007254 oxidation reaction Methods 0.000 claims description 16
- 230000008021 deposition Effects 0.000 claims description 12
- 238000001459 lithography Methods 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 7
- 239000003642 reactive oxygen metabolite Substances 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 150000003573 thiols Chemical class 0.000 claims description 4
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 150000001299 aldehydes Chemical class 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 239000000809 air pollutant Substances 0.000 claims description 2
- 231100001243 air pollutant Toxicity 0.000 claims description 2
- 239000003344 environmental pollutant Substances 0.000 claims description 2
- 231100000719 pollutant Toxicity 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 9
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 238000006731 degradation reaction Methods 0.000 abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 230000000116 mitigating effect Effects 0.000 abstract description 2
- 230000001419 dependent effect Effects 0.000 abstract 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 6
- 238000002310 reflectometry Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- 229910001882 dioxygen Inorganic materials 0.000 description 4
- 238000010494 dissociation reaction Methods 0.000 description 4
- 230000005593 dissociations Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 ethane Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002164 ion-beam lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
- Radiation-Therapy Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2000/035394 WO2002052347A1 (en) | 2000-12-21 | 2000-12-21 | Mitigation of radiation induced surface contamination |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004537157A JP2004537157A (ja) | 2004-12-09 |
| JP2004537157A5 JP2004537157A5 (enExample) | 2005-12-22 |
| JP4790970B2 true JP4790970B2 (ja) | 2011-10-12 |
Family
ID=21742108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002553187A Expired - Lifetime JP4790970B2 (ja) | 2000-12-21 | 2000-12-21 | 放射線誘起表面汚染の軽減 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1344110B1 (enExample) |
| JP (1) | JP4790970B2 (enExample) |
| AT (1) | ATE460688T1 (enExample) |
| DE (1) | DE60043998D1 (enExample) |
| WO (1) | WO2002052347A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6724460B2 (en) * | 2001-11-19 | 2004-04-20 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method, device manufactured thereby, cleaning unit and method of cleaning contaminated objects |
| TWI254839B (en) * | 2002-09-30 | 2006-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| EP1403715A3 (en) * | 2002-09-30 | 2006-01-18 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1431830A3 (en) * | 2002-12-20 | 2004-10-20 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| SG139554A1 (en) | 2002-12-20 | 2008-02-29 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| TWI299505B (en) * | 2003-04-08 | 2008-08-01 | Cymer Inc | Systems and methods for removal of debris on a reflecting surface of an euv collector in an euv light source |
| GB0408543D0 (en) * | 2004-04-16 | 2004-05-19 | Boc Group Plc | Cleaning of multi-layer mirrors |
| US20060196525A1 (en) * | 2005-03-03 | 2006-09-07 | Vrtis Raymond N | Method for removing a residue from a chamber |
| JP4599342B2 (ja) * | 2005-12-27 | 2010-12-15 | エーエスエムエル ネザーランズ ビー.ブイ. | 光学装置、リソグラフィ装置、および、デバイス製造方法 |
| EP2157584A3 (en) * | 2008-08-14 | 2011-07-13 | ASML Netherlands B.V. | Radiation source, lithographic apparatus and device manufacturing method |
| JP5381607B2 (ja) * | 2009-10-19 | 2014-01-08 | 富士通セミコンダクター株式会社 | 極端紫外光利用装置 |
| JP6564451B2 (ja) * | 2015-03-27 | 2019-08-21 | ギガフォトン株式会社 | 極端紫外光生成装置及びその設計方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075991A (ja) * | 1996-08-14 | 1998-03-24 | Commiss Energ Atom | 紫外線レーザビームによって物体を清掃または汚染除去するための方法および装置 |
| JPH11224839A (ja) * | 1998-02-04 | 1999-08-17 | Canon Inc | 露光装置とデバイス製造方法、ならびに該露光装置の光学素子クリーニング方法 |
| JP2000091207A (ja) * | 1998-09-14 | 2000-03-31 | Nikon Corp | 投影露光装置及び投影光学系の洗浄方法 |
| JP2002110539A (ja) * | 2000-09-04 | 2002-04-12 | Asm Lithography Bv | リソグラフィ投影装置、デバイス製造方法、およびそれらによって製造されたデバイス |
-
2000
- 2000-12-21 AT AT00988384T patent/ATE460688T1/de not_active IP Right Cessation
- 2000-12-21 JP JP2002553187A patent/JP4790970B2/ja not_active Expired - Lifetime
- 2000-12-21 WO PCT/US2000/035394 patent/WO2002052347A1/en not_active Ceased
- 2000-12-21 EP EP00988384A patent/EP1344110B1/en not_active Expired - Lifetime
- 2000-12-21 DE DE60043998T patent/DE60043998D1/de not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075991A (ja) * | 1996-08-14 | 1998-03-24 | Commiss Energ Atom | 紫外線レーザビームによって物体を清掃または汚染除去するための方法および装置 |
| JPH11224839A (ja) * | 1998-02-04 | 1999-08-17 | Canon Inc | 露光装置とデバイス製造方法、ならびに該露光装置の光学素子クリーニング方法 |
| JP2000091207A (ja) * | 1998-09-14 | 2000-03-31 | Nikon Corp | 投影露光装置及び投影光学系の洗浄方法 |
| JP2002110539A (ja) * | 2000-09-04 | 2002-04-12 | Asm Lithography Bv | リソグラフィ投影装置、デバイス製造方法、およびそれらによって製造されたデバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004537157A (ja) | 2004-12-09 |
| EP1344110B1 (en) | 2010-03-10 |
| EP1344110A1 (en) | 2003-09-17 |
| WO2002052347A1 (en) | 2002-07-04 |
| ATE460688T1 (de) | 2010-03-15 |
| DE60043998D1 (de) | 2010-04-22 |
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