JP4777616B2 - 電子部品用パッケージの製造方法 - Google Patents
電子部品用パッケージの製造方法 Download PDFInfo
- Publication number
- JP4777616B2 JP4777616B2 JP2004017357A JP2004017357A JP4777616B2 JP 4777616 B2 JP4777616 B2 JP 4777616B2 JP 2004017357 A JP2004017357 A JP 2004017357A JP 2004017357 A JP2004017357 A JP 2004017357A JP 4777616 B2 JP4777616 B2 JP 4777616B2
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- JP
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- Prior art keywords
- frame
- ceramic
- package
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000919 ceramic Substances 0.000 claims description 62
- 238000000034 method Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000010304 firing Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 description 38
- 238000003860 storage Methods 0.000 description 16
- 230000005284 excitation Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
本発明の実施例について、圧電振動デバイスとして水晶発振器を例にとり、図面を参照して説明する。図1は水晶発振器の開蓋状態の平面図、図2は図1において閉蓋した状態のA−A断面図、図3は同じく図1において閉蓋した状態のB−B断面図である。また図4、図5は電子部品用パッケージの製造方法を示す図である。
11 第1層シート
12 第2層シート
13 第3層シート
14 第4層シート
15 シールリング
13a 段差部
13b,13c 電極パッド
2 集積回路素子
3 水晶振動板
31,32 励振電極
31a,32a 引出電極
31b,32b 接続電極
4 リッド
Claims (1)
- シート状のセラミックグリーンシートに、複数の下枠体が連結状態に形成された第1の枠体セラミックグリーンシートを積層し、当該第1の枠体セラミックグリーンシート上に前記下枠体に対応した上枠体を形成した第2枠体セラミックグリーンシートを積層し、当該積層したシートを一体的に焼成成形した後、小割切断することにより、上部が開口した積層セラミックからなる直方体形状の電子部品用パッケージを製造する方法であって、
前記上枠体の幅は下枠体の幅よりも小さく、かつ上枠体の内枠サイズは下枠体のサイズより大きくすることにより幅寸法差を形成し、前記幅寸法差は前記枠体の長辺部分全体と短辺部分全体に形成した構成であり、かつ前記幅寸法差がセラミック積層ズレの規格値以上とし、さらに相互に隣接する上枠体の中間部分に小割用溝が形成され、前記焼成成形後当該小割用溝に従って各電子部品用パッケージに小割することを特徴とする電子部品用パッケージの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004017357A JP4777616B2 (ja) | 2004-01-26 | 2004-01-26 | 電子部品用パッケージの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004017357A JP4777616B2 (ja) | 2004-01-26 | 2004-01-26 | 電子部品用パッケージの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005210619A JP2005210619A (ja) | 2005-08-04 |
JP4777616B2 true JP4777616B2 (ja) | 2011-09-21 |
Family
ID=34902218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004017357A Expired - Lifetime JP4777616B2 (ja) | 2004-01-26 | 2004-01-26 | 電子部品用パッケージの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4777616B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4512186B2 (ja) * | 2004-06-30 | 2010-07-28 | 京セラキンセキ株式会社 | 圧電振動子の製造方法 |
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2004
- 2004-01-26 JP JP2004017357A patent/JP4777616B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005210619A (ja) | 2005-08-04 |
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