JP4776225B2 - 高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置 - Google Patents

高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置 Download PDF

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Publication number
JP4776225B2
JP4776225B2 JP2004373177A JP2004373177A JP4776225B2 JP 4776225 B2 JP4776225 B2 JP 4776225B2 JP 2004373177 A JP2004373177 A JP 2004373177A JP 2004373177 A JP2004373177 A JP 2004373177A JP 4776225 B2 JP4776225 B2 JP 4776225B2
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JP
Japan
Prior art keywords
frequency
transmission line
line
frequency signal
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004373177A
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English (en)
Japanese (ja)
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JP2006180337A (ja
JP2006180337A5 (enExample
Inventor
信樹 平松
裕司 岸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2004373177A priority Critical patent/JP4776225B2/ja
Publication of JP2006180337A publication Critical patent/JP2006180337A/ja
Publication of JP2006180337A5 publication Critical patent/JP2006180337A5/ja
Application granted granted Critical
Publication of JP4776225B2 publication Critical patent/JP4776225B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Radar Systems Or Details Thereof (AREA)
JP2004373177A 2004-12-24 2004-12-24 高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置 Expired - Fee Related JP4776225B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004373177A JP4776225B2 (ja) 2004-12-24 2004-12-24 高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004373177A JP4776225B2 (ja) 2004-12-24 2004-12-24 高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008142176A Division JP4776657B2 (ja) 2008-05-30 2008-05-30 高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置

Publications (3)

Publication Number Publication Date
JP2006180337A JP2006180337A (ja) 2006-07-06
JP2006180337A5 JP2006180337A5 (enExample) 2007-05-10
JP4776225B2 true JP4776225B2 (ja) 2011-09-21

Family

ID=36733995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004373177A Expired - Fee Related JP4776225B2 (ja) 2004-12-24 2004-12-24 高周波用伝送線路およびそれを用いた高周波送受信器ならびにレーダ装置

Country Status (1)

Country Link
JP (1) JP4776225B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8022793B2 (en) * 2008-11-25 2011-09-20 The Boeing Company Sandwich vehicle structure having integrated electromagnetic radiation pathways
JP5287390B2 (ja) * 2009-03-16 2013-09-11 ソニー株式会社 半導体装置、伝送システム、半導体装置の製造方法及び伝送システムの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08171985A (ja) * 1994-12-19 1996-07-02 Hitachi Ltd マイクロ波加熱装置
JP2002016405A (ja) * 2000-06-30 2002-01-18 Kyocera Corp 非放射性誘電体線路およびミリ波送受信器
JPWO2004075336A1 (ja) * 2003-02-21 2006-06-01 松下電器産業株式会社 高周波回路

Also Published As

Publication number Publication date
JP2006180337A (ja) 2006-07-06

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