JP4772649B2 - 半導体記憶素子の製造方法 - Google Patents
半導体記憶素子の製造方法 Download PDFInfo
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- JP4772649B2 JP4772649B2 JP2006324445A JP2006324445A JP4772649B2 JP 4772649 B2 JP4772649 B2 JP 4772649B2 JP 2006324445 A JP2006324445 A JP 2006324445A JP 2006324445 A JP2006324445 A JP 2006324445A JP 4772649 B2 JP4772649 B2 JP 4772649B2
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- 239000004065 semiconductor Substances 0.000 title claims description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 239000002096 quantum dot Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 11
- 239000012535 impurity Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 27
- 229910021417 amorphous silicon Inorganic materials 0.000 description 17
- 238000005530 etching Methods 0.000 description 17
- 150000004767 nitrides Chemical class 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 230000003647 oxidation Effects 0.000 description 13
- 238000007254 oxidation reaction Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000001459 lithography Methods 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- AYHOQSGNVUZKJA-UHFFFAOYSA-N [B+3].[B+3].[B+3].[B+3].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] Chemical compound [B+3].[B+3].[B+3].[B+3].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] AYHOQSGNVUZKJA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004460 silage Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/936—Specified use of nanostructure for electronic or optoelectronic application in a transistor or 3-terminal device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/943—Information storage or retrieval using nanostructure
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Description
第一の半導体層が形成された半導体基板上に第一の絶縁膜と第二の半導体層とを順次に形成する工程と、
前記第二の半導体層上に、第一の方向を長手方向とする第1のラインパターンを形成する工程と、
前記第1のラインパターンに第一の側壁膜を形成する工程と、
前記第一の側壁膜をマスクとして前記第二の半導体層および前記第一の絶縁膜を選択的に除去して積層体パターンを形成する工程と、
前記積層体パターン上に、前記第一の方向に直交する第二の方向を長手方向とする第二のラインパターンを形成する工程と、
前記第二のラインパターンに第二の側壁膜を形成する工程と、
前記第二の側壁膜をマスクとして前記積層体パターンおよび前記第一の半導体層を選択的に除去することにより、前記積層体パターンと前記第二の側壁膜との交差部分に電荷蓄積層となる量子ドットとトンネル絶縁膜とを形成するとともに、チャネル領域となる半導体細線パターンを形成する工程と、
を備える半導体記憶素子の製造方法が提供される。
41,43:ゲート電極(制御電極)
52a〜52d:シリコンパターン
63:多結晶シリコンの細線(第一の枠体)
64〜67:量子ドット
LB2:積層体(第二の枠体)
Claims (2)
- 第一の半導体層が形成された半導体基板上に第一の絶縁膜と第二の半導体層とを順次に形成する工程と、
前記第二の半導体層上に、第一の方向を長手方向とする第1のラインパターンを形成する工程と、
前記第1のラインパターンに第一の側壁膜を形成する工程と、
前記第一の側壁膜をマスクとして前記第二の半導体層および前記第一の絶縁膜を選択的に除去して積層体パターンを形成する工程と、
前記積層体パターン上に、前記第一の方向に直交する第二の方向を長手方向とする第二のラインパターンを形成する工程と、
前記第二のラインパターンに第二の側壁膜を形成する工程と、
前記第二の側壁膜をマスクとして前記積層体パターンおよび前記第一の半導体層を選択的に除去することにより、前記積層体パターンと前記第二の側壁膜との交差部分に電荷蓄積層となる量子ドットとトンネル絶縁膜とを形成するとともに、チャネル領域となる半導体細線パターンを形成する工程と、
を備える半導体記憶素子の製造方法。 - 前記量子ドットの領域を間に挟むように、前記チャネル領域に不純物拡散層を形成する工程と、
前記量子ドット上に第二の絶縁膜を介して制御電極を形成する工程と、
をさらに備えることを特徴とする請求項1に記載の半導体記憶素子の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006324445A JP4772649B2 (ja) | 2006-11-30 | 2006-11-30 | 半導体記憶素子の製造方法 |
US11/947,428 US7910977B2 (en) | 2006-11-30 | 2007-11-29 | Semiconductor storage element and manufacturing method thereof |
US12/929,843 US8062939B2 (en) | 2006-11-30 | 2011-02-18 | Semiconductor storage element and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006324445A JP4772649B2 (ja) | 2006-11-30 | 2006-11-30 | 半導体記憶素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008140910A JP2008140910A (ja) | 2008-06-19 |
JP4772649B2 true JP4772649B2 (ja) | 2011-09-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006324445A Expired - Fee Related JP4772649B2 (ja) | 2006-11-30 | 2006-11-30 | 半導体記憶素子の製造方法 |
Country Status (2)
Country | Link |
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US (2) | US7910977B2 (ja) |
JP (1) | JP4772649B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4929300B2 (ja) * | 2009-02-25 | 2012-05-09 | 株式会社東芝 | マルチドットフラッシュメモリ及びその製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19526011C1 (de) * | 1995-07-17 | 1996-11-28 | Siemens Ag | Verfahren zur Herstellung von sublithographischen Ätzmasken |
KR100271211B1 (ko) * | 1998-07-15 | 2000-12-01 | 윤덕용 | 나노결정을 이용한 비휘발성 기억소자 형성방법 |
JP3748726B2 (ja) * | 1999-01-28 | 2006-02-22 | シャープ株式会社 | 量子細線の製造方法 |
US6391753B1 (en) * | 2000-06-20 | 2002-05-21 | Advanced Micro Devices, Inc. | Process for forming gate conductors |
US6596593B2 (en) * | 2000-12-05 | 2003-07-22 | Seiko Instruments Inc. | Method of manufacturing semiconductor device employing oxygen implantation |
KR100408520B1 (ko) * | 2001-05-10 | 2003-12-06 | 삼성전자주식회사 | 게이트 전극과 단전자 저장 요소 사이에 양자점을구비하는 단전자 메모리 소자 및 그 제조 방법 |
KR100459895B1 (ko) * | 2002-02-09 | 2004-12-04 | 삼성전자주식회사 | 퀀텀 도트를 가지는 메모리 소자 및 그 제조방법 |
US6812491B2 (en) * | 2002-03-22 | 2004-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory cell and semiconductor memory device |
KR100634162B1 (ko) * | 2002-05-15 | 2006-10-17 | 삼성전자주식회사 | 스플리트 게이트 메모리 장치 및 그 제조방법 |
TW550797B (en) * | 2002-07-04 | 2003-09-01 | Nat Science Council | Single electron transistor structure with self-aligned polysilicon spacer gate and its manufacturing method |
KR100602084B1 (ko) * | 2003-12-31 | 2006-07-19 | 동부일렉트로닉스 주식회사 | 실리콘 양자점의 형성 방법 및 이를 이용한 반도체 메모리소자의 제조 방법 |
US7042044B2 (en) * | 2004-02-18 | 2006-05-09 | Koucheng Wu | Nor-type channel-program channel-erase contactless flash memory on SOI |
JP2004343128A (ja) | 2004-06-01 | 2004-12-02 | Hitachi Ltd | 半導体記憶素子、半導体記憶装置とその制御方法 |
JP2006086206A (ja) * | 2004-09-14 | 2006-03-30 | Foundation For The Promotion Of Industrial Science | 不揮発性メモリ |
US7355238B2 (en) * | 2004-12-06 | 2008-04-08 | Asahi Glass Company, Limited | Nonvolatile semiconductor memory device having nanoparticles for charge retention |
US7144773B1 (en) * | 2005-06-01 | 2006-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for preventing trenching in fabricating split gate flash devices |
-
2006
- 2006-11-30 JP JP2006324445A patent/JP4772649B2/ja not_active Expired - Fee Related
-
2007
- 2007-11-29 US US11/947,428 patent/US7910977B2/en active Active
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2011
- 2011-02-18 US US12/929,843 patent/US8062939B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008140910A (ja) | 2008-06-19 |
US20080272425A1 (en) | 2008-11-06 |
US20110143503A1 (en) | 2011-06-16 |
US7910977B2 (en) | 2011-03-22 |
US8062939B2 (en) | 2011-11-22 |
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