JP4772367B2 - ウェーハの研磨方法 - Google Patents
ウェーハの研磨方法 Download PDFInfo
- Publication number
- JP4772367B2 JP4772367B2 JP2005122242A JP2005122242A JP4772367B2 JP 4772367 B2 JP4772367 B2 JP 4772367B2 JP 2005122242 A JP2005122242 A JP 2005122242A JP 2005122242 A JP2005122242 A JP 2005122242A JP 4772367 B2 JP4772367 B2 JP 4772367B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- load
- pressing load
- pressure
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims description 100
- 238000000034 method Methods 0.000 title claims description 7
- 238000013459 approach Methods 0.000 claims description 3
- 230000001965 increasing effect Effects 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
2:チャックテーブル
3:研磨手段
30:スピンドル 31:研磨工具 32:モータ
4:研磨送り手段
40:壁部 41:ガイドレール 42:ボールネジ 43:昇降部材
44:パルスモータ 45:支持部
5:カウンタバランス
50:エアシリンダ 51:ピストン 52:連結部 53:圧力計
54:圧力調整部 55:加圧手段 56:カウンタ荷重算出手段
57:実効押圧荷重算出手段 58:自重記憶手段 59:比較制御手段
60:所望押圧荷重記憶手段
7:オペレーションパネル
Claims (1)
- ウェーハを保持するチャックテーブルと、該チャックテーブルに保持されたウェーハを研磨する研磨工具を有する研磨手段と、該研磨手段を該ウェーハに対して接近及び離反させる方向に駆動する加工送り手段と、該研磨手段に連結されるピストンと該ピストンを駆動するエアシリンダと該エアシリンダに供給されるエアの圧力を調整する圧力調整部とを備え該研磨手段の自重による該加工送り手段への負担を軽減するカウンタバランスと、所望の押圧荷重を記憶する所望押圧荷重記憶手段と、該研磨手段の自重と該カウンタバランスの荷重との差をウェーハに対する実効押圧荷重として算出する実効押圧荷重算出手段と、該所望押圧荷重記憶手段に記憶された所望の押圧荷重と該実効押圧荷重算出手段によって求めた該実効押圧荷重との比較結果に基づいて該圧力調整部を制御する比較制御手段とを備えた研磨装置を用いたウェーハの研磨方法であって、
該比較制御手段は、該所望の押圧荷重と該実効押圧荷重とが等しくなるように該圧力調整部を制御し、
該研磨工具が交換され所望の押圧荷重が変更される場合は、該変更された所望の押圧荷重の値を該所望押圧荷重記憶手段に記憶させる
研磨方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005122242A JP4772367B2 (ja) | 2005-04-20 | 2005-04-20 | ウェーハの研磨方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005122242A JP4772367B2 (ja) | 2005-04-20 | 2005-04-20 | ウェーハの研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006303161A JP2006303161A (ja) | 2006-11-02 |
JP4772367B2 true JP4772367B2 (ja) | 2011-09-14 |
Family
ID=37471097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005122242A Active JP4772367B2 (ja) | 2005-04-20 | 2005-04-20 | ウェーハの研磨方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4772367B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010023163A (ja) * | 2008-07-17 | 2010-02-04 | Disco Abrasive Syst Ltd | 加工装置 |
JP2014104562A (ja) * | 2012-11-29 | 2014-06-09 | Disco Abrasive Syst Ltd | 加工装置及びその加工装置の動作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0938856A (ja) * | 1995-07-26 | 1997-02-10 | Sumitomo Electric Ind Ltd | 表面研磨装置および表面研磨方法 |
JPH10277920A (ja) * | 1997-04-04 | 1998-10-20 | Toshiba Mach Co Ltd | ラップ加工用ワーク保持装置およびラップ盤 |
JPH10296617A (ja) * | 1997-04-25 | 1998-11-10 | Sony Corp | 研磨装置および研磨方法 |
-
2005
- 2005-04-20 JP JP2005122242A patent/JP4772367B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2006303161A (ja) | 2006-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6734670B2 (ja) | 研削装置 | |
JP2572577B2 (ja) | 半導体ウエハを研摩するための方法および装置 | |
US7413499B2 (en) | Grinding process and apparatus with arrangement for grinding with constant grinding load | |
US6428389B2 (en) | Polishing apparatus | |
JP2020196100A (ja) | 圧電アクチュエータで構成したチャックテーブル傾き調整機構 | |
JP4772367B2 (ja) | ウェーハの研磨方法 | |
JP2017047504A (ja) | 加工装置 | |
JP7128635B2 (ja) | 研削盤 | |
JP4885548B2 (ja) | ウェーハの研磨方法 | |
JP2011083864A (ja) | 加工装置 | |
JP7291056B2 (ja) | ウェーハの研磨方法 | |
KR100982457B1 (ko) | 그라인딩, 래핑 및 폴리싱 가공이 가능한 다기능 연마장비 | |
JP2004055705A (ja) | 電子部品圧着装置および電子部品圧着方法 | |
KR101546017B1 (ko) | 공작기계용 스핀들유닛 | |
JP5939935B2 (ja) | 研削装置 | |
CN112775834B (zh) | 缓进给磨削方法和磨削装置 | |
JP7359713B2 (ja) | 加工装置 | |
JP2024013432A (ja) | 研磨装置 | |
JP7099757B1 (ja) | 半導体ウェハーの研磨装置 | |
JP2011031338A (ja) | 横型工作機械のバランス装置 | |
JP2021186903A (ja) | 加工装置 | |
JP2003071680A (ja) | 加工液コントロールシステム | |
JP2024111968A (ja) | 板状ワークの研削装置及び研削方法 | |
JPH0650131Y2 (ja) | 研摩装置 | |
JP3128369B2 (ja) | 精密平面ラップ盤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080326 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110317 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110513 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110602 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110622 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140701 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4772367 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140701 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |