JP4762374B1 - 感光性組成物及びプリント配線板 - Google Patents

感光性組成物及びプリント配線板 Download PDF

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Publication number
JP4762374B1
JP4762374B1 JP2011074888A JP2011074888A JP4762374B1 JP 4762374 B1 JP4762374 B1 JP 4762374B1 JP 2011074888 A JP2011074888 A JP 2011074888A JP 2011074888 A JP2011074888 A JP 2011074888A JP 4762374 B1 JP4762374 B1 JP 4762374B1
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Japan
Prior art keywords
photosensitive composition
weight
silica
less
resist film
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Active
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JP2011074888A
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English (en)
Japanese (ja)
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JP2012184389A (ja
Inventor
秀 中村
倫久 上田
崇至 鹿毛
駿夫 ▲高▼橋
貴志 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2011074888A priority Critical patent/JP4762374B1/ja
Priority to PCT/JP2011/064778 priority patent/WO2012111183A1/ja
Priority to CN201180000962.1A priority patent/CN102754027B/zh
Priority to TW100123688A priority patent/TWI418936B/zh
Application granted granted Critical
Publication of JP4762374B1 publication Critical patent/JP4762374B1/ja
Publication of JP2012184389A publication Critical patent/JP2012184389A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011074888A 2011-02-14 2011-03-30 感光性組成物及びプリント配線板 Active JP4762374B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011074888A JP4762374B1 (ja) 2011-02-14 2011-03-30 感光性組成物及びプリント配線板
PCT/JP2011/064778 WO2012111183A1 (ja) 2011-02-14 2011-06-28 感光性組成物及びプリント配線板
CN201180000962.1A CN102754027B (zh) 2011-02-14 2011-06-28 感光性组合物及印刷配线板
TW100123688A TWI418936B (zh) 2011-02-14 2011-07-05 Photosensitive compositions and printed circuit boards

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011028925 2011-02-14
JP2011028925 2011-02-14
JP2011074888A JP4762374B1 (ja) 2011-02-14 2011-03-30 感光性組成物及びプリント配線板

Publications (2)

Publication Number Publication Date
JP4762374B1 true JP4762374B1 (ja) 2011-08-31
JP2012184389A JP2012184389A (ja) 2012-09-27

Family

ID=44597216

Family Applications (2)

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JP2011074888A Active JP4762374B1 (ja) 2011-02-14 2011-03-30 感光性組成物及びプリント配線板
JP2011074889A Withdrawn JP2012185463A (ja) 2011-02-14 2011-03-30 感光性組成物の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011074889A Withdrawn JP2012185463A (ja) 2011-02-14 2011-03-30 感光性組成物の製造方法

Country Status (4)

Country Link
JP (2) JP4762374B1 (zh)
CN (1) CN102754027B (zh)
TW (1) TWI418936B (zh)
WO (1) WO2012111183A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093386A (ja) * 2011-10-24 2013-05-16 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6947492B2 (ja) * 2015-03-25 2021-10-13 積水化学工業株式会社 ２液混合型の第１，第２の液及びプリント配線板の製造方法
KR20160115718A (ko) * 2015-03-25 2016-10-06 세키스이가가쿠 고교가부시키가이샤 2액 혼합형의 제1, 제2 액 및 프린트 배선판의 제조 방법
JP6618829B2 (ja) * 2015-03-25 2019-12-11 積水化学工業株式会社 ２液混合型の第１，第２の液及びプリント配線板の製造方法
KR102625987B1 (ko) * 2015-03-25 2024-01-18 다이요 홀딩스 가부시키가이샤 2액 혼합형의 제1, 제2 액 및 프린트 배선판의 제조 방법
WO2017159190A1 (ja) * 2016-03-14 2017-09-21 富士フイルム株式会社 組成物、膜、硬化膜、光学センサおよび膜の製造方法
US11304291B2 (en) * 2017-06-29 2022-04-12 Kyocera Corporation Circuit board and light emitting device including circuit board
JP7405803B2 (ja) * 2021-08-27 2023-12-26 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物の光硬化物及び感光性樹脂組成物を塗布したプリント配線板
JP7545447B2 (ja) * 2021-09-24 2024-09-04 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物の光硬化物及び感光性樹脂組成物を塗布したプリント配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008015285A (ja) * 2006-07-06 2008-01-24 Toyo Ink Mfg Co Ltd 感光性熱硬化性樹脂組成物
JP2009031693A (ja) * 2007-07-30 2009-02-12 Jsr Corp 無機粉体含有樹脂組成物、パターン形成方法およびフラットパネルディスプレイ用電極の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
JP2746031B2 (ja) * 1992-12-14 1998-04-28 松下電工株式会社 液状レジスト組成物
CN101016402A (zh) * 2003-01-07 2007-08-15 积水化学工业株式会社 固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体
CN101367982B (zh) * 2003-06-04 2013-06-12 积水化学工业株式会社 固化性树脂组合物、液晶显示元件用密封剂和液晶显示元件
US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
JP2007199491A (ja) * 2006-01-27 2007-08-09 Showa Denko Kk ソルダーレジストインキ組成物、その組成物を硬化してなるソルダーレジスト及びそのソルダーレジストの製造方法
JP2007310201A (ja) * 2006-05-19 2007-11-29 Kaneka Corp 感光性ドライフィルムレジスト及びこれを用いたプリント配線板
JP4340272B2 (ja) * 2006-05-30 2009-10-07 太陽インキ製造株式会社 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板
TW200906886A (en) * 2007-06-15 2009-02-16 Sekisui Chemical Co Ltd Sealing agent for optical semiconductor element, and optical semiconductor element
JP5352340B2 (ja) * 2009-05-13 2013-11-27 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008015285A (ja) * 2006-07-06 2008-01-24 Toyo Ink Mfg Co Ltd 感光性熱硬化性樹脂組成物
JP2009031693A (ja) * 2007-07-30 2009-02-12 Jsr Corp 無機粉体含有樹脂組成物、パターン形成方法およびフラットパネルディスプレイ用電極の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093386A (ja) * 2011-10-24 2013-05-16 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
US9257354B2 (en) 2011-10-24 2016-02-09 Shinko Electric Industries Co., Ltd. Wiring substrate, light emitting device, and method for manufacturing wiring substrate

Also Published As

Publication number Publication date
JP2012185463A (ja) 2012-09-27
CN102754027B (zh) 2014-06-25
WO2012111183A1 (ja) 2012-08-23
TWI418936B (zh) 2013-12-11
JP2012184389A (ja) 2012-09-27
TW201205195A (en) 2012-02-01
CN102754027A (zh) 2012-10-24

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