JP4761207B2 - ウェーハ収納方法 - Google Patents
ウェーハ収納方法 Download PDFInfo
- Publication number
- JP4761207B2 JP4761207B2 JP2006199615A JP2006199615A JP4761207B2 JP 4761207 B2 JP4761207 B2 JP 4761207B2 JP 2006199615 A JP2006199615 A JP 2006199615A JP 2006199615 A JP2006199615 A JP 2006199615A JP 4761207 B2 JP4761207 B2 JP 4761207B2
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- JP
- Japan
- Prior art keywords
- wafer
- cassette
- dicing apparatus
- stored
- modified layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Description
Claims (4)
- ダイシング装置のブレードによりダイシングされて切削溝が形成された、またはレーザーダイシング装置のレーザー光により内部に改質層が形成されたウェーハを、前記切削溝、または前記改質層の形成されている方向より所定の角度回転させ、前記ウェーハを収納するカセットへ前記ウェーハを収納することを特徴とするウェーハ収納方法。
- 前記ウェーハを回転させる角度は40度から50度であることを特徴とする請求項1に記載のウェーハ収納方法。
- 前記ウェーハは、シリコンにより形成され、円形形状であることを特徴とする請求項1または請求項2に記載のウェーハ収納方法。
- 前記カセットは、対向した内壁に複数の対になる桟を有し、前記ウェーハを一対の前記桟に架けて水平に収納することを特徴とする請求項1、2、または3のいずれか1項に記載のウェーハ収納方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006199615A JP4761207B2 (ja) | 2006-07-21 | 2006-07-21 | ウェーハ収納方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006199615A JP4761207B2 (ja) | 2006-07-21 | 2006-07-21 | ウェーハ収納方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008028183A JP2008028183A (ja) | 2008-02-07 |
JP4761207B2 true JP4761207B2 (ja) | 2011-08-31 |
Family
ID=39118504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006199615A Expired - Fee Related JP4761207B2 (ja) | 2006-07-21 | 2006-07-21 | ウェーハ収納方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4761207B2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US9062830B2 (en) | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
JP2013211364A (ja) * | 2012-03-30 | 2013-10-10 | Disco Abrasive Syst Ltd | ウェーハの収容方法 |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10261701A (ja) * | 1997-03-19 | 1998-09-29 | Oki Electric Ind Co Ltd | 薄板形状の半導体装置の包装用部材及び包装方法 |
JP2001110756A (ja) * | 1999-10-05 | 2001-04-20 | Disco Abrasive Syst Ltd | 切削装置 |
JP2004165570A (ja) * | 2002-11-15 | 2004-06-10 | Nitto Denko Corp | 半導体ウエハからの保護テープ除去方法およびその装置 |
JP4314868B2 (ja) * | 2003-04-10 | 2009-08-19 | パナソニック株式会社 | 半導体チップのピックアップ装置およびピックアップ方法ならびに吸着剥離ツール |
JP2005175384A (ja) * | 2003-12-15 | 2005-06-30 | Nitto Denko Corp | 保護テープの貼付方法及び剥離方法 |
JP2005332868A (ja) * | 2004-05-18 | 2005-12-02 | Tokyo Seimitsu Co Ltd | ワーク収納カセット |
JP4689972B2 (ja) * | 2004-05-26 | 2011-06-01 | リンテック株式会社 | ウエハ処理装置及びウエハ処理方法 |
JP2006100413A (ja) * | 2004-09-28 | 2006-04-13 | Tokyo Seimitsu Co Ltd | フィルム貼付方法およびフィルム貼付装置 |
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2006
- 2006-07-21 JP JP2006199615A patent/JP4761207B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2008028183A (ja) | 2008-02-07 |
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