JP4757442B2 - チップ体製造用粘着シート - Google Patents

チップ体製造用粘着シート Download PDF

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Publication number
JP4757442B2
JP4757442B2 JP2003418496A JP2003418496A JP4757442B2 JP 4757442 B2 JP4757442 B2 JP 4757442B2 JP 2003418496 A JP2003418496 A JP 2003418496A JP 2003418496 A JP2003418496 A JP 2003418496A JP 4757442 B2 JP4757442 B2 JP 4757442B2
Authority
JP
Japan
Prior art keywords
film
pressure
sensitive adhesive
chip body
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003418496A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004119992A (ja
JP2004119992A5 (enExample
Inventor
勇人 野口
和義 江部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2003418496A priority Critical patent/JP4757442B2/ja
Publication of JP2004119992A publication Critical patent/JP2004119992A/ja
Publication of JP2004119992A5 publication Critical patent/JP2004119992A5/ja
Application granted granted Critical
Publication of JP4757442B2 publication Critical patent/JP4757442B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2003418496A 1997-02-10 2003-12-16 チップ体製造用粘着シート Expired - Lifetime JP4757442B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003418496A JP4757442B2 (ja) 1997-02-10 2003-12-16 チップ体製造用粘着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1997026571 1997-02-10
JP2657197 1997-02-10
JP2003418496A JP4757442B2 (ja) 1997-02-10 2003-12-16 チップ体製造用粘着シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP02865398A Division JP3535968B2 (ja) 1997-02-10 1998-02-10 チップ体の製造方法およびチップ体製造用粘着シート

Publications (3)

Publication Number Publication Date
JP2004119992A JP2004119992A (ja) 2004-04-15
JP2004119992A5 JP2004119992A5 (enExample) 2005-07-14
JP4757442B2 true JP4757442B2 (ja) 2011-08-24

Family

ID=32299867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003418496A Expired - Lifetime JP4757442B2 (ja) 1997-02-10 2003-12-16 チップ体製造用粘着シート

Country Status (1)

Country Link
JP (1) JP4757442B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319233A (ja) * 2005-05-16 2006-11-24 Lintec Corp 脆質部材の処理装置
JP2007294748A (ja) * 2006-04-26 2007-11-08 Tokyo Seimitsu Co Ltd ウェーハ搬送方法
EP1921120B1 (en) 2006-11-10 2011-04-20 Nitto Denko Corporation Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet
JP5323779B2 (ja) * 2010-07-26 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ
JP5636266B2 (ja) * 2010-11-16 2014-12-03 株式会社ディスコ ワークの加工方法及びダイシングテープ
JP5554351B2 (ja) * 2012-01-25 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
KR102799377B1 (ko) * 2018-03-07 2025-04-22 린텍 가부시키가이샤 익스팬드 방법, 반도체 장치의 제조 방법, 및 점착 시트
JP6535119B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
MY187307A (en) * 2018-03-28 2021-09-21 Furukawa Electric Co Ltd Tape for semiconductor processing
JP6535118B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535117B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
SG11201906507PA (en) * 2018-03-28 2019-11-28 Furukawa Electric Co Ltd Tape for semiconductor processing
KR102351045B1 (ko) * 2019-12-19 2022-01-14 한국기계연구원 마이크로 소자의 간격 조절 전사방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181652A (ja) * 1984-09-28 1986-04-25 Shin Etsu Polymer Co Ltd ダイシングフイルム
JP2521459B2 (ja) * 1987-02-23 1996-08-07 日東電工株式会社 半導体チツプの製造方法
JPH01116606A (ja) * 1987-10-30 1989-05-09 Nec Corp 調光機能を有する受光モジュール
JPH07273173A (ja) * 1994-03-28 1995-10-20 Furukawa Electric Co Ltd:The 半導体ウエハ固定用粘着テープ
JPH08302293A (ja) * 1995-05-10 1996-11-19 Lintec Corp 熱収縮型表面保護シート
JP3408894B2 (ja) * 1995-05-17 2003-05-19 日東電工株式会社 半導体チップの製造方法

Also Published As

Publication number Publication date
JP2004119992A (ja) 2004-04-15

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