JP4755213B2 - エッジライト式発光ダイオードバックライトモジュール - Google Patents
エッジライト式発光ダイオードバックライトモジュール Download PDFInfo
- Publication number
- JP4755213B2 JP4755213B2 JP2008037051A JP2008037051A JP4755213B2 JP 4755213 B2 JP4755213 B2 JP 4755213B2 JP 2008037051 A JP2008037051 A JP 2008037051A JP 2008037051 A JP2008037051 A JP 2008037051A JP 4755213 B2 JP4755213 B2 JP 4755213B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- backlight module
- heat
- light type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 7
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims description 6
- 229920002959 polymer blend Polymers 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/918—Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Description
110 エッジライト式発光ユニット
111 ベース
112 放熱基板
112a 結合内面
112b チップ固着面
112c 結合外面
114 発光ダイオードチップ
116 反射凹部
118 電源ピン
120 熱伝導部
130 回路基板
132 導電ワイヤ
140 台座
Claims (7)
- 台座と、
前記台座上に配置された熱伝導部と、
複数の導電ワイヤが配置された上表面と、前記熱伝導部に接触された下表面とを有する回路基板と、
複数のエッジライト式発光ユニットと、を備え、
前記エッジライト式発光ユニットは、
ベースと、
前記ベースに係合された結合内面と、該結合内面と表裏の関係にあるチップ固着面と、前記ベースの外側に配置され、前記熱伝導部に接触された結合外面と、を有する放熱基板と、
前記放熱基板のチップ固着面に配置され、内部空間を有する反射凹部と、
前記内部空間中に配置され、前記チップ固着面上に固定された発光ダイオードチップと、
前記ベースの外側に配置され、前記ベースから延出し、前記回路基板の各前記導電ワイヤとそれぞれ接続された複数の電源ピンと、を備え、
前記熱伝導部は、銀、銅、銅合金、銅銀合金、アルミニウム、アルミニウム合金、金メッキ層を有する金属および銀メッキ層を有する金属を含むことを特徴とする、エッジライト式発光ダイオードバックライトモジュール。 - 前記台座は、熱伝導が可能な金属材料またはセラミック材料を含むことを特徴とする、請求項1に記載のエッジライト式発光ダイオードバックライトモジュール。
- 前記ベースは、金属、非金属および高分子の混合物を含む材料からなることを特徴とする、請求項1に記載のエッジライト式発光ダイオードバックライトモジュール。
- 前記放熱基板は、銀、銅、銅合金、銅銀合金、アルミニウムまたはアルミニウム合金、セラミック材料および高分子混合物を含んだ材料からなることを特徴とする、請求項1に記載のエッジライト式発光ダイオードバックライトモジュール。
- 前記放熱基板上を覆う反射メッキ層をさらに備えることを特徴とする、請求項1に記載のエッジライト式発光ダイオードバックライトモジュール。
- 前記反射凹部は、金属、非金属および高分子混合物を含む材料からなることを特徴とする、請求項1に記載のエッジライト式発光ダイオードバックライトモジュール。
- 前記反射凹部上を覆う反射メッキ層をさらに備えることを特徴とする、請求項1に記載のエッジライト式発光ダイオードバックライトモジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096150590 | 2007-12-27 | ||
TW096150590A TWI372918B (en) | 2007-12-27 | 2007-12-27 | Edge lighting light-emitting diode backlight module |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009158451A JP2009158451A (ja) | 2009-07-16 |
JP4755213B2 true JP4755213B2 (ja) | 2011-08-24 |
Family
ID=40962210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008037051A Expired - Fee Related JP4755213B2 (ja) | 2007-12-27 | 2008-02-19 | エッジライト式発光ダイオードバックライトモジュール |
Country Status (3)
Country | Link |
---|---|
US (2) | US7919789B2 (ja) |
JP (1) | JP4755213B2 (ja) |
TW (1) | TWI372918B (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0519478A2 (pt) | 2004-12-27 | 2009-02-03 | Quantum Paper Inc | display emissivo endereÇÁvel e imprimÍvel |
US8846457B2 (en) | 2007-05-31 | 2014-09-30 | Nthdegree Technologies Worldwide Inc | Printable composition of a liquid or gel suspension of diodes |
US9419179B2 (en) | 2007-05-31 | 2016-08-16 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
US8889216B2 (en) | 2007-05-31 | 2014-11-18 | Nthdegree Technologies Worldwide Inc | Method of manufacturing addressable and static electronic displays |
US8674593B2 (en) | 2007-05-31 | 2014-03-18 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
US9018833B2 (en) | 2007-05-31 | 2015-04-28 | Nthdegree Technologies Worldwide Inc | Apparatus with light emitting or absorbing diodes |
US8852467B2 (en) | 2007-05-31 | 2014-10-07 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a printable composition of a liquid or gel suspension of diodes |
US8415879B2 (en) | 2007-05-31 | 2013-04-09 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
US9425357B2 (en) | 2007-05-31 | 2016-08-23 | Nthdegree Technologies Worldwide Inc. | Diode for a printable composition |
US8133768B2 (en) | 2007-05-31 | 2012-03-13 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system |
US9343593B2 (en) | 2007-05-31 | 2016-05-17 | Nthdegree Technologies Worldwide Inc | Printable composition of a liquid or gel suspension of diodes |
US8877101B2 (en) | 2007-05-31 | 2014-11-04 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a light emitting, power generating or other electronic apparatus |
US9534772B2 (en) | 2007-05-31 | 2017-01-03 | Nthdegree Technologies Worldwide Inc | Apparatus with light emitting diodes |
US8384630B2 (en) | 2007-05-31 | 2013-02-26 | Nthdegree Technologies Worldwide Inc | Light emitting, photovoltaic or other electronic apparatus and system |
US8809126B2 (en) | 2007-05-31 | 2014-08-19 | Nthdegree Technologies Worldwide Inc | Printable composition of a liquid or gel suspension of diodes |
TWI372918B (en) * | 2007-12-27 | 2012-09-21 | Everlight Electronics Co Ltd | Edge lighting light-emitting diode backlight module |
US8127477B2 (en) | 2008-05-13 | 2012-03-06 | Nthdegree Technologies Worldwide Inc | Illuminating display systems |
US7992332B2 (en) | 2008-05-13 | 2011-08-09 | Nthdegree Technologies Worldwide Inc. | Apparatuses for providing power for illumination of a display object |
JP2011054736A (ja) * | 2009-09-01 | 2011-03-17 | Sharp Corp | 発光装置、平面光源および液晶表示装置 |
TWI435144B (zh) | 2010-04-12 | 2014-04-21 | Young Lighting Technology Corp | 背光模組 |
CN102377079B (zh) * | 2010-08-10 | 2014-05-07 | 富士康(昆山)电脑接插件有限公司 | 电连接器组件及其制造方法 |
KR101779205B1 (ko) * | 2010-10-06 | 2017-09-26 | 엘지이노텍 주식회사 | 방열회로기판 및 이를 포함하는 발열소자 패키지 |
TWI428533B (zh) * | 2011-03-14 | 2014-03-01 | Young Lighting Technology Corp | 發光二極體燈具 |
US8879139B2 (en) * | 2012-04-24 | 2014-11-04 | Gentex Corporation | Display mirror assembly |
AU2014326772B2 (en) | 2013-09-24 | 2017-07-20 | Gentex Corporation | Display mirror assembly |
JP6526243B2 (ja) | 2015-05-18 | 2019-06-05 | ジェンテックス コーポレイション | 全画面表示バックミラー装置 |
US10295165B2 (en) | 2015-07-30 | 2019-05-21 | Heliohex, Llc | Lighting device, assembly and method |
TW201721906A (zh) * | 2015-12-14 | 2017-06-16 | 億光電子工業股份有限公司 | 發光二極體封裝結構及其製造方法 |
CN108039402B (zh) * | 2017-12-19 | 2019-12-27 | 深圳市瑞丰光电子股份有限公司 | Led灯丝基板、led封装结构及led灯具 |
WO2019119639A1 (zh) * | 2017-12-19 | 2019-06-27 | 深圳市瑞丰光电子股份有限公司 | Led灯丝基板、led封装结构及led灯具 |
WO2020083762A1 (en) * | 2018-10-26 | 2020-04-30 | Lumileds Holding B.V. | Led light source |
CN114863834A (zh) * | 2022-05-27 | 2022-08-05 | 深圳市艾比森光电股份有限公司 | Led显示模组及其制备方法与应用 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005513815A (ja) * | 2001-12-29 | 2005-05-12 | 杭州富陽新穎電子有限公司 | 発光ダイオード及び発光ダイオード・ランプ |
CN1442910A (zh) | 2002-03-06 | 2003-09-17 | 徐继兴 | 液冷式发光二极管及其封装方法 |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
JP2007095555A (ja) * | 2005-09-29 | 2007-04-12 | Nippon Seiki Co Ltd | 発光装置 |
TWI301922B (en) * | 2006-01-19 | 2008-10-11 | Everlight Electronics Co Ltd | Backlight module of light emitting diode |
US7638814B2 (en) * | 2007-06-19 | 2009-12-29 | Philips Lumileds Lighting Company, Llc | Solderless integrated package connector and heat sink for LED |
TWI372918B (en) * | 2007-12-27 | 2012-09-21 | Everlight Electronics Co Ltd | Edge lighting light-emitting diode backlight module |
-
2007
- 2007-12-27 TW TW096150590A patent/TWI372918B/zh not_active IP Right Cessation
-
2008
- 2008-02-19 JP JP2008037051A patent/JP4755213B2/ja not_active Expired - Fee Related
- 2008-12-24 US US12/344,108 patent/US7919789B2/en not_active Expired - Fee Related
-
2011
- 2011-02-24 US US13/033,856 patent/US8168992B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI372918B (en) | 2012-09-21 |
US8168992B2 (en) | 2012-05-01 |
US7919789B2 (en) | 2011-04-05 |
TW200928512A (en) | 2009-07-01 |
JP2009158451A (ja) | 2009-07-16 |
US20110140157A1 (en) | 2011-06-16 |
US20090168403A1 (en) | 2009-07-02 |
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