JP4748606B2 - 滑らかなマイクロスケールの形状の印刷方法 - Google Patents

滑らかなマイクロスケールの形状の印刷方法 Download PDF

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Publication number
JP4748606B2
JP4748606B2 JP2007321888A JP2007321888A JP4748606B2 JP 4748606 B2 JP4748606 B2 JP 4748606B2 JP 2007321888 A JP2007321888 A JP 2007321888A JP 2007321888 A JP2007321888 A JP 2007321888A JP 4748606 B2 JP4748606 B2 JP 4748606B2
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Japan
Prior art keywords
droplets
printing
substrate
droplet
printed
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Expired - Fee Related
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JP2007321888A
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English (en)
Japanese (ja)
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JP2008160105A (ja
JP2008160105A5 (OSRAM
Inventor
スリニヴァサン ウマ
スティーブン ホワイト ディヴィッド
ジェイ シュレイダー エリック
イー レディー スティーヴン
ジェイ リム スコット
Original Assignee
パロ アルト リサーチ センター インコーポレイテッド
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Publication of JP2008160105A publication Critical patent/JP2008160105A/ja
Publication of JP2008160105A5 publication Critical patent/JP2008160105A5/ja
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Publication of JP4748606B2 publication Critical patent/JP4748606B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ink Jet (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2007321888A 2006-12-20 2007-12-13 滑らかなマイクロスケールの形状の印刷方法 Expired - Fee Related JP4748606B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/642,146 2006-12-20
US11/642,146 US7524015B2 (en) 2006-12-20 2006-12-20 Method of printing smooth micro-scale features

Publications (3)

Publication Number Publication Date
JP2008160105A JP2008160105A (ja) 2008-07-10
JP2008160105A5 JP2008160105A5 (OSRAM) 2011-01-27
JP4748606B2 true JP4748606B2 (ja) 2011-08-17

Family

ID=39146883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007321888A Expired - Fee Related JP4748606B2 (ja) 2006-12-20 2007-12-13 滑らかなマイクロスケールの形状の印刷方法

Country Status (6)

Country Link
US (1) US7524015B2 (OSRAM)
EP (1) EP1937045B1 (OSRAM)
JP (1) JP4748606B2 (OSRAM)
CN (1) CN101204890B (OSRAM)
DE (1) DE602007010891D1 (OSRAM)
TW (1) TWI397360B (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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US8968985B2 (en) * 2007-03-30 2015-03-03 Palo Alto Research Center Incorporated Method and system for patterning a mask layer
US8551556B2 (en) * 2007-11-20 2013-10-08 Palo Alto Research Center Incorporated Method for obtaining controlled sidewall profile in print-patterned structures
US8251476B2 (en) 2010-02-03 2012-08-28 Xerox Corporation Ink drop position correction in the process direction based on ink drop position history
US8262190B2 (en) 2010-05-14 2012-09-11 Xerox Corporation Method and system for measuring and compensating for process direction artifacts in an optical imaging system in an inkjet printer
US8721026B2 (en) 2010-05-17 2014-05-13 Xerox Corporation Method for identifying and verifying dash structures as candidates for test patterns and replacement patterns in an inkjet printer
CN102186309B (zh) * 2011-03-22 2013-03-20 鞍山市正发电路有限公司 激光直接成像全印刷电路
US20140060144A1 (en) * 2012-08-30 2014-03-06 Illnois Tool Works Inc. Method and apparatus for calibrating dispensed deposits
US8840223B2 (en) 2012-11-19 2014-09-23 Xerox Corporation Compensation for alignment errors in an optical sensor
US8764149B1 (en) 2013-01-17 2014-07-01 Xerox Corporation System and method for process direction registration of inkjets in a printer operating with a high speed image receiving surface
US9144818B2 (en) 2013-03-13 2015-09-29 Illinois Tool Works Inc. Method and apparatus for dispensing a viscous material on a substrate
US9374905B2 (en) 2013-09-30 2016-06-21 Illinois Tool Works Inc. Method and apparatus for automatically adjusting dispensing units of a dispenser
US9357686B2 (en) 2013-11-14 2016-05-31 Illinois Tool Works Inc. Dispensing apparatus having substrate inverter system and clamping system, and method for dispensing a viscous material on a substrate
US9662675B2 (en) 2014-07-31 2017-05-30 Illinois Tool Works Inc. External inverter system for variable substrate thickness and method for rotating a substrate
WO2018136037A1 (en) 2017-01-17 2018-07-26 Hewlett-Packard Development Company, L.P. Assessing print quality using intensity histograms and perimeter lengths
GB2566112B (en) * 2017-09-05 2022-10-12 Arrayjet Ltd Method and device for producing printed microarrays
CN112970337B (zh) 2019-02-14 2022-05-24 奥宝科技有限公司 用于制备具有高度密集导体的pcb产品的方法及设备
TWI746320B (zh) 2020-12-18 2021-11-11 財團法人工業技術研究院 產生及更新定位分布圖的方法及其系統
WO2023058227A1 (ja) * 2021-10-08 2023-04-13 株式会社Fuji 配線形成方法、および情報処理装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01200693A (ja) * 1988-02-05 1989-08-11 Juki Corp 厚膜回路形成装置を校正する方法及び装置
JPH01261886A (ja) 1988-04-12 1989-10-18 Matsushita Electric Ind Co Ltd 厚膜描画方法
JPH0210884A (ja) * 1988-06-29 1990-01-16 Matsushita Electric Ind Co Ltd 厚膜描画方法
JPH0632361B2 (ja) * 1988-07-30 1994-04-27 ジューキ株式会社 回路形成装置における描画ピッチ設定装置
US5843847A (en) * 1996-04-29 1998-12-01 Applied Materials, Inc. Method for etching dielectric layers with high selectivity and low microloading
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
JP4040161B2 (ja) * 1998-04-03 2008-01-30 キヤノン株式会社 プリント位置合わせ方法およびプリント装置
DE60004798T3 (de) 1999-05-27 2007-08-16 Patterning Technologies Ltd. Verfahren zur erzeugung einer maske auf einer oberfläche
US6247787B1 (en) 2000-04-29 2001-06-19 Hewlett-Packard Company Print mode for improved leading and trailing edges and text print quality
JP3797265B2 (ja) * 2002-04-17 2006-07-12 ノーリツ鋼機株式会社 画像形成装置
US6972261B2 (en) 2002-06-27 2005-12-06 Xerox Corporation Method for fabricating fine features by jet-printing and surface treatment
US6890050B2 (en) 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
JP2005118672A (ja) * 2003-10-16 2005-05-12 Seiko Epson Corp 描画装置の動作評価方法および描画装置、並びに電気光学装置の製造方法、電気光学装置、電子機器
JP2005136223A (ja) * 2003-10-30 2005-05-26 Fuji Photo Film Co Ltd プリント配線板の製造方法
US7316791B2 (en) * 2003-12-30 2008-01-08 E.I. Du Pont De Nemours And Company Polyimide based substrate comprising doped polyaniline
CN1561158A (zh) * 2004-03-08 2005-01-05 叶建乐 印制电路板制造工艺流程
US20060158478A1 (en) 2005-01-14 2006-07-20 Howarth James J Circuit modeling and selective deposition
JP2007313499A (ja) * 2006-04-27 2007-12-06 Seiko Epson Corp パターン形成方法、液滴吐出装置及び回路モジュール

Also Published As

Publication number Publication date
CN101204890A (zh) 2008-06-25
CN101204890B (zh) 2011-11-23
US20080150989A1 (en) 2008-06-26
JP2008160105A (ja) 2008-07-10
EP1937045B1 (en) 2010-12-01
TWI397360B (zh) 2013-05-21
TW200908835A (en) 2009-02-16
EP1937045A1 (en) 2008-06-25
US7524015B2 (en) 2009-04-28
DE602007010891D1 (de) 2011-01-13

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