JP4747704B2 - 蛍光体層付き発光装置の製造方法 - Google Patents

蛍光体層付き発光装置の製造方法 Download PDF

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Publication number
JP4747704B2
JP4747704B2 JP2005210623A JP2005210623A JP4747704B2 JP 4747704 B2 JP4747704 B2 JP 4747704B2 JP 2005210623 A JP2005210623 A JP 2005210623A JP 2005210623 A JP2005210623 A JP 2005210623A JP 4747704 B2 JP4747704 B2 JP 4747704B2
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JP
Japan
Prior art keywords
light emitting
phosphor layer
light
sealing member
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005210623A
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English (en)
Japanese (ja)
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JP2007027585A (ja
JP2007027585A5 (enExample
Inventor
好伸 末広
邦博 甚目
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005210623A priority Critical patent/JP4747704B2/ja
Priority to US11/220,903 priority patent/US7842526B2/en
Publication of JP2007027585A publication Critical patent/JP2007027585A/ja
Publication of JP2007027585A5 publication Critical patent/JP2007027585A5/ja
Application granted granted Critical
Publication of JP4747704B2 publication Critical patent/JP4747704B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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JP2005210623A 2004-09-09 2005-07-20 蛍光体層付き発光装置の製造方法 Expired - Fee Related JP4747704B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005210623A JP4747704B2 (ja) 2005-07-20 2005-07-20 蛍光体層付き発光装置の製造方法
US11/220,903 US7842526B2 (en) 2004-09-09 2005-09-08 Light emitting device and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005210623A JP4747704B2 (ja) 2005-07-20 2005-07-20 蛍光体層付き発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2007027585A JP2007027585A (ja) 2007-02-01
JP2007027585A5 JP2007027585A5 (enExample) 2007-11-01
JP4747704B2 true JP4747704B2 (ja) 2011-08-17

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ID=37787915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005210623A Expired - Fee Related JP4747704B2 (ja) 2004-09-09 2005-07-20 蛍光体層付き発光装置の製造方法

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JP (1) JP4747704B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101423929B1 (ko) * 2007-12-26 2014-08-04 삼성전자주식회사 발광다이오드 소자

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5104490B2 (ja) * 2007-04-16 2012-12-19 豊田合成株式会社 発光装置及びその製造方法
DE102008014927A1 (de) 2008-02-22 2009-08-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement
JP5109770B2 (ja) * 2008-04-03 2012-12-26 豊田合成株式会社 発光装置及び発光装置の製造方法
JP5287643B2 (ja) * 2009-09-29 2013-09-11 豊田合成株式会社 光学装置の製造方法及び光学装置
KR101775659B1 (ko) * 2010-12-30 2017-09-06 서울반도체 주식회사 파장변환층을 갖는 발광 소자
KR101875435B1 (ko) * 2011-10-05 2018-07-06 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
US9269873B2 (en) 2012-03-13 2016-02-23 Citizen Holdings Co., Ltd. Semiconductor light emitting device and method for manufacturing same
KR102329719B1 (ko) * 2015-02-23 2021-11-23 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 구비한 라이트 유닛
JP7478657B2 (ja) 2019-12-23 2024-05-07 ガタン インコーポレイテッド 熱伝導層をもつ電子撮像検出器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639999B2 (ja) * 1989-03-10 1997-08-13 三洋電機株式会社 多色発光ｌｅｄ装置
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
JP4081985B2 (ja) * 2001-03-02 2008-04-30 日亜化学工業株式会社 発光装置およびその製造方法
CN101789482B (zh) * 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101423929B1 (ko) * 2007-12-26 2014-08-04 삼성전자주식회사 발광다이오드 소자

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