JP4731919B2 - フィルム状物品 - Google Patents

フィルム状物品 Download PDF

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Publication number
JP4731919B2
JP4731919B2 JP2005011376A JP2005011376A JP4731919B2 JP 4731919 B2 JP4731919 B2 JP 4731919B2 JP 2005011376 A JP2005011376 A JP 2005011376A JP 2005011376 A JP2005011376 A JP 2005011376A JP 4731919 B2 JP4731919 B2 JP 4731919B2
Authority
JP
Japan
Prior art keywords
antenna
substrate
film
thin film
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005011376A
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English (en)
Japanese (ja)
Other versions
JP2005252236A (ja
JP2005252236A5 (https=
Inventor
康行 荒井
麻衣 秋葉
洋平 神野
祐子 舘村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005011376A priority Critical patent/JP4731919B2/ja
Publication of JP2005252236A publication Critical patent/JP2005252236A/ja
Publication of JP2005252236A5 publication Critical patent/JP2005252236A5/ja
Application granted granted Critical
Publication of JP4731919B2 publication Critical patent/JP4731919B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs

Landscapes

  • Wire Bonding (AREA)
  • Thin Film Transistor (AREA)
  • Credit Cards Or The Like (AREA)
JP2005011376A 2004-01-23 2005-01-19 フィルム状物品 Expired - Fee Related JP4731919B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005011376A JP4731919B2 (ja) 2004-01-23 2005-01-19 フィルム状物品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004015537 2004-01-23
JP2004015537 2004-01-23
JP2005011376A JP4731919B2 (ja) 2004-01-23 2005-01-19 フィルム状物品

Publications (3)

Publication Number Publication Date
JP2005252236A JP2005252236A (ja) 2005-09-15
JP2005252236A5 JP2005252236A5 (https=) 2008-01-17
JP4731919B2 true JP4731919B2 (ja) 2011-07-27

Family

ID=35032385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005011376A Expired - Fee Related JP4731919B2 (ja) 2004-01-23 2005-01-19 フィルム状物品

Country Status (1)

Country Link
JP (1) JP4731919B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4761779B2 (ja) * 2004-01-23 2011-08-31 株式会社半導体エネルギー研究所 Ｉｄラベル、ｉｄカード、ｉｄタグ、及び物品
WO2005071608A1 (en) 2004-01-23 2005-08-04 Semiconductor Energy Laboratory Co., Ltd. Id label, id card, and id tag
KR101150996B1 (ko) * 2004-09-24 2012-06-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 제조방법
JP2008242970A (ja) * 2007-03-28 2008-10-09 Brother Ind Ltd 情報読み取り機能付き情報端末装置及び情報システム
JP5096855B2 (ja) * 2007-09-27 2012-12-12 新光電気工業株式会社 配線基板の製造方法及び配線基板
JP5552635B2 (ja) * 2010-05-28 2014-07-16 国立大学法人京都大学 中性子ミラーの製造方法及び中性子ミラー
ITUD20130063A1 (it) * 2013-05-09 2014-11-10 Rotas Italia S R L Apparato e procedimento per la realizzazione di biglietti da visita
JP6685781B2 (ja) * 2016-03-14 2020-04-22 株式会社東芝 発券機

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62248692A (ja) * 1986-04-23 1987-10-29 日立マイクロコンピユ−タエンジニアリング株式会社 カ−ド状半導体装置
JPH0664379A (ja) * 1992-08-12 1994-03-08 Oki Electric Ind Co Ltd Ｉｃカードおよびその製造方法
JPH07202147A (ja) * 1993-12-28 1995-08-04 Canon Inc 半導体装置
JP3392325B2 (ja) * 1997-08-29 2003-03-31 シャープ株式会社 液晶表示装置
JP2000132657A (ja) * 1998-10-28 2000-05-12 Dainippon Printing Co Ltd Ｉｃカードおよびその製造方法
JP4528421B2 (ja) * 2000-06-20 2010-08-18 株式会社東芝 無線券発行機
JP2002183693A (ja) * 2000-12-14 2002-06-28 Dainippon Printing Co Ltd 非接触ｉｃタグ付き名刺およびそれを用いた情報自動発信システム
JP2002243929A (ja) * 2001-02-16 2002-08-28 Fuji Xerox Co Ltd 光電着法および光触媒法によるカラーフィルターの製造方法、カラーフィルター、液晶表示装置およびカラーフィルターの製造装置
JP4040311B2 (ja) * 2002-01-25 2008-01-30 株式会社ウェルキャット 無線認識データキャリアラベルの製造装置

Also Published As

Publication number Publication date
JP2005252236A (ja) 2005-09-15

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