JP4728535B2 - Copper-based alloy sheet for wiring components for electronic and electrical equipment - Google Patents
Copper-based alloy sheet for wiring components for electronic and electrical equipment Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は、自動車内機器に使用される端子やコネクタ、一般に使用される電子電気機器用配線部品（スイッチやリレー）、ＩＣリードフレームなどに適した銅基合金に関する。
【０００２】
【従来の技術】
近年、ナビゲーションシステム、エアバック、アンチロックブレーキシステムなど自動車に搭載される機器や安全装置などは確実に増加してきており、それに伴い車内スペースを最大限に利用するため、搭載機器類をコンパクトにパッケージ化することが重視され、機器類の小型化が、以前にも増して強く要求されるようになった。また重要な機器であっても車内ではなく温度が上昇し易いエンジンルームなどに設置されるようになった。
このため自動車内機器に使用される端子やコネクタには、小型化のための強度向上、高温下での使用に耐える耐応力緩和特性の向上、さらには自己の抵抗発熱を抑制するために導電率の向上が求められている。
このような特性向上は、高密度集積化が進む電子電気機器用配線部品、ＩＣリードフレームなどにも求められている。
【０００３】
【発明が解決しようとする課題】
ところで、前記自動車内機器用端子やコネクタ、電子電気機器用配線部品、ＩＣリードフレームなどには、Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｒ系合金、Ｃｕ−Ｚｒ系合金などが使用されているが、Ｃｕ−Ｎｉ−Ｓｉ系合金は導電率が低く、Ｃｕ−Ｃｒ系合金およびＣｕ−Ｚｒ系合金は強度が低く、いずれも前記近年の厳しい特性要求に十分対応できないものである。
【０００４】
このようなことから、本発明者らは、自動車内機器用端子やコネクタ、電子電気機器用配線部品、ＩＣリードフレームなどに適した銅基合金について研究を行い、Ｃｕ−Ｍｎ−Ｎｉ−Ｐ系合金は機械的性質、導電率、耐応力緩和特性などに優れることを見いだし、さらに研究を進めて本発明を完成させるに至った。
本発明の目的は、機械的性質、導電率、耐応力緩和特性などに優れ、近年の厳しい特性要求にも十分対応し得る、自動車内機器用端子やコネクタ、電子電気機器用配線部品、ＩＣリードフレームなどに適した銅基合金を提供することにある。
【０００５】
【課題を解決するための手段】
請求項１記載の発明は、Ｍｎを０．２〜０．８ｍａｓｓ％、Ｎｉを０．２〜０．８ｍａｓｓ％、Ｐを０．１〜０．５ｍａｓｓ％含み、残部がＣｕおよび不可避不純物からなり、添加元素の化合物が銅マトリックス中に析出し、引張強さが５４０Ｎ／ｍｍ ２ 以上、伸びが５％以上、導電率が５５％ＩＡＣＳ以上、日本電子材料工業会標準規格（ＥＭＡＳ−３００３）の片持ちブロック式で表面最大応力を４００Ｎ／ｍｍ ２ とし、１５０℃で１０００時間後の耐応力緩和特性が５０以下であることを特徴とする電子電気機器用配線部品用の銅基合金板材である。
【０００６】
請求項２記載の発明は、〔Ｍｎ＋Ｎｉ〕のＰに対する質量（ｍａｓｓ％）比（〔Ｍｎ＋Ｎｉ〕／Ｐ）が２．０〜７．０であることを特徴とする請求項１記載の電子電気機器用配線部品用の銅基合金板材である。
【０００７】
請求項３記載の発明は、Ｍｎを０．２〜０．８ｍａｓｓ％、Ｎｉを０．２〜０．８ｍａｓｓ％、Ｐを０．１〜０．５ｍａｓｓ％含み、さらにＳｎ０．０５〜０．５ｍａｓｓ％、Ｚｎ０．０５〜１．０ｍａｓｓ％のいずれか１種または２種を含み、残部がＣｕおよび不可避不純物からなり、添加元素の化合物が銅マトリックス中に析出し、引張強さが５４０Ｎ／ｍｍ ２ 以上、伸びが５％以上、導電率が５５％ＩＡＣＳ以上、日本電子材料工業会標準規格（ＥＭＡＳ−３００３）の片持ちブロック式で表面最大応力を４００Ｎ／ｍｍ ２ とし、１５０℃で１０００時間後の耐応力緩和特性が５０以下であることを特徴とする電子電気機器用配線部品用の銅基合金板材である。
【０００８】
請求項４記載の発明は、〔Ｍｎ＋Ｎｉ〕のＰに対する質量（ｍａｓｓ％）比（〔Ｍｎ＋Ｎｉ〕／Ｐ）が２．０〜７．０であることを特徴とする請求項３記載の電子電気機器用配線部品用の銅基合金板材である。
【０００９】
【発明の実施の形態】
請求項１記載発明において、Ｍｎ、Ｎｉ、Ｐの合金元素は、相互に反応して種々の化合物を生成して銅マトリックス中に析出し、または一部が固溶して、銅基合金の機械的性質、導電率、耐応力緩和特性を向上させる。
一方、前記端子やコネクタは接触抵抗を低減させるため、通常メッキが施され、その耐熱剥離性が良好なこと また製品形状への曲げ加工性が良好なことが求められるが、前記合金元素は、前記メッキ耐熱剥離性や曲げ加工性を損なうことがない。
【００１０】
この発明において、Ｍｎ、Ｎｉの含有量をそれぞれ０．２〜０．８mass％、０．２〜０．８mass％に規定する理由は、いずれが下限値未満でも前記自動車内機器用端子やコネクタ、電子電気機器用配線部品、ＩＣリードフレームなどに必要な機械的性質、耐応力緩和特性などが十分に得られなくなり、上限値を超えると導電率および曲げ加工性が低下するためである。
またＰの含有量を０．１〜０．５mass％に規定する理由は、下限値未満ではＭｎとＮｉがＰと化合物を形成できずに固溶するため、導電率を始め、引張強さおよび耐応力緩和特性が低下し、上限値を超えると鋳造性および熱間加工性が低下するためである。
【００１１】
前記合金元素のＭｎ、ＮｉおよびＰの効果は、〔Ｍｎ＋Ｎｉ〕のＰに対する質量（mass％）比（〔Ｍｎ＋Ｎｉ〕／Ｐ）が２．０〜７．０のとき最も安定して発現される。〔Ｍｎ＋Ｎｉ〕／Ｐが２．０未満のときは導電率が若干低下し、７．０を超えると強度が若干低下する。前記質量比は２．０〜５．０が最適である。
【００１２】
請求項３記載の発明は、前記銅基合金（Ｃｕ−Ｍｎ−Ｎｉ−Ｐ合金）にＳｎまたは／およびＺｎを適量含有させたものであり、これら元素は機械的性質を改善し、さらにＳｎは耐応力緩和特性を高め、Ｚｎはメッキの耐熱剥離性を高める作用も有する。
前記Ｓｎの含有量を０．０５〜０．５mass％に、前記Ｚｎの含有量を０．０５〜１．０mass％にそれぞれ規定する理由は、いずれも下限値未満ではその効果が十分に得られず、いずれが上限値を超えても導電率が低下するためである。
【００１３】
本発明では、前記合金元素の他、必要に応じてＣｒ、Ｓｉ、Ｍｇ、Ａｇ、Ｃｏ、Ｆｅ、Ｚｒ、Ｔｉ、Ｖ、Ｐｂ、Ｂｉ、Ａｌ、Ｔｉなどの元素を、前記銅基合金の基本的特性を低下させない範囲で添加することができる。
【００１４】
【実施例】
以下に本発明を実施例により詳細に説明する。
（実施例１）
表１に示す本請求項１記載発明で規定する組成の銅基合金（Ｎｏ．１〜８）を高周波溶解炉にて溶解し、これをＤＣ法により厚さ３０ｍｍ、幅１００ｍｍ、長さ１５０ｍｍの鋳塊に鋳造し、この鋳塊を９００℃で６０分間加熱して均質化処理を施したのち、その温度でそのまま熱間圧延を開始し、熱間圧延後、直ちに冷却して厚さ１２ｍｍの熱延材とし、この熱延材の両面を各１．５ｍｍ切削して酸化被膜を除去したのち、冷間圧延して厚さ０．３６ｍｍの冷延材とし、この冷延材に８００℃で１５秒間加熱後、直ちに１５℃／秒以上の冷却速度で冷却する熱処理と、４７５℃で２時間加熱する熱処理をこの順に施し、次いで、厚さ０．２５ｍｍに冷間圧延したのち、３５０℃で２時間低温焼鈍して銅基合金板材を製造した。前記冷延材の２回の熱処理、および低温焼鈍はいずれも不活性ガス雰囲気中で行った。
【００１５】
（実施例２）
表１に示す本請求項３記載発明の組成の銅基合金（Ｎｏ．９〜１２）を用いた他は、実施例１と同じ方法により銅基合金板材を製造した。
【００１６】
（比較例１）
表１に示す本発明規定外組成の銅基合金（Ｎｏ．１３〜１６）を用いた他は、実施例１と同じ方法により銅基合金板材を製造した。
【００１７】
実施例１、２および比較例１で製造した各々の銅基合金板材について、機械的性質（引張強さ、伸び）、導電率、耐応力緩和特性、曲げ加工性およびメッキ耐熱剥離性を調べた。また従来の銅基合金板材（表１のＮｏ．１７〜１９）についても同様の調査を行った。
（１）機械的性質はＪＩＳ Ｚ ２２０１で規定する５号試験片を用い、ＪＩＳ Ｚ ２２４１に準拠して調べた。
（２）導電率は、ＪＩＳ Ｈ ０５０５に準拠して調べた。
（３）耐応力緩和特性は、日本電子材料工業会標準規格（ＥＭＡＳ−３００３）の片持ちブロック式を採用し、表面最大応力を４００Ｎ／ｍｍ2 に設定して１５０℃の恒温槽に保持し、１０００時間保持後の応力緩和率（Ｓ．Ｒ．Ｒ．）を調べた。
（４）曲げ加工性は、内側曲げ半径が０．１ｍｍの１８０゜曲げを行い、曲げ部にクラックが生じないものは良好（○）、クラックが生じたものは不良（×）と判定した。
（５）メッキの耐熱剥離性は、試験片に厚さ３μｍの光沢Ｓｎメッキを施し、これを大気中１５０℃で１０００時間加熱したのち、９０°の曲げおよび曲げ戻し試験を行い、曲げ部分のＳｎメッキの密着状況を目視観察した。メッキが剥離しなかった場合は密着性良好（○）、剥離した場合は密着性不良（×）と判定した。結果を表１に併記する。
【００１８】
【表１】
表１から明らかなように、本請求項１記載発明のＮｏ．１〜８は、いずれも、前記自動車内機器用端子やコネクタ、電子機器用配線部品、ＩＣリードフレームなどに要求されている、引張強さ５４０Ｎ／ｍｍ2以上、伸び５％以上、導電率５５％ＩＡＣＳ以上、耐応力緩和特性５０以下の当面の目標値を満足し、さらに曲げ加工性、メッキ耐熱剥離性にも優れた特性を示した。
特に〔Ｍｎ＋Ｎｉ〕／Ｐの質量比が２．０〜７．０のＮｏ．１、２、４、５、７、８は引張強さおよび導電率が優れた。
本請求項３記載発明のＮｏ．９〜１２も優れた特性を示し、特にＳｎを添加したＮｏ．９、１０は耐応力緩和特性が、Ｚｎを添加したＮｏ．１１はメッキ耐熱剥離性が、ＳｎとＺｎを添加したＮｏ．１２は耐応力緩和特性とメッキ耐熱剥離性がそれぞれ大幅に向上した。
比較例のＮｏ．１３はＭｎが少ないため引張強さと耐応力緩和特性が低く、Ｎｏ．１４はＰが少ないため引張強さ、導電率および耐応力緩和特性が低く、Ｎｏ．１５はＰが多いため熱間加工中に割れが生じて正常に製造することができず、Ｎｏ．１６はＮｉが多いため導電率および曲げ加工性が低下した。
従来の銅基合金板材のＮｏ．１７（Ｃｕ−Ｎｉ−Ｓｉ合金）は導電率が、Ｎｏ．１８（Ｃｕ−Ｍｇ合金）は引張強さが、Ｎｏ．１９（Ｃｕ−Ｓｎ−Ｆｅ合金）は導電率および曲げ加工性がそれぞれ低下した。
【００２０】
【発明の効果】
以上に述べたように、本発明の銅基合金は、機械的性質、導電率および耐応力緩和特性に優れ、曲げ加工性およびメッキ密着性も良好であり、従って、厳しい特性が要求されている自動車内機器用端子やコネクタ、電子電気機器用配線部品、ＩＣリードフレームなどにも十分使用でき、工業上顕著な効果を奏する。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a copper-based alloy suitable for terminals and connectors used in in-vehicle equipment, wiring parts for electronic and electrical equipment (switches and relays) generally used, IC lead frames, and the like.
[0002]
[Prior art]
In recent years, navigation systems, airbags, anti-lock brake systems and other equipment and safety devices mounted on automobiles have been steadily increasing, and in order to make maximum use of the space in the car, the on-board equipment is packaged compactly. As a result, the downsizing of equipment has become more demanding than ever before. Even important equipment is installed not in the car but in the engine room where the temperature tends to rise.
For this reason, terminals and connectors used in in-car devices have improved strength for miniaturization, improved stress relaxation resistance to withstand use at high temperatures, and conductivity to suppress their own resistance heat generation. Improvement is demanded.
Such improvement in characteristics is also required for wiring components for electronic and electrical equipment, IC lead frames, and the like that are becoming increasingly densely integrated.
[0003]
[Problems to be solved by the invention]
By the way, Cu—Ni—Si based alloys, Cu—Cr based alloys, Cu—Zr based alloys and the like are used for the terminals and connectors for in-car devices, wiring parts for electronic and electrical devices, IC lead frames and the like. However, the Cu—Ni—Si based alloy has low electrical conductivity, and the Cu—Cr based alloy and Cu—Zr based alloy have low strength, and none of them can sufficiently meet the recent severe characteristic requirements.
[0004]
For these reasons, the present inventors have studied copper-based alloys suitable for terminals and connectors for in-vehicle equipment, wiring parts for electronic and electrical equipment, IC lead frames, etc., and Cu-Mn-Ni-P series. The alloy was found to be excellent in mechanical properties, electrical conductivity, stress relaxation resistance, etc., and further research was made to complete the present invention.
The object of the present invention is excellent in mechanical properties, electrical conductivity, stress relaxation resistance, etc., and can sufficiently meet recent severe characteristics demands. Terminals and connectors for automobile equipment, wiring parts for electronic and electrical equipment, IC leads The object is to provide a copper-based alloy suitable for a frame or the like.
[0005]
[Means for Solving the Problems]
The invention of claim 1 includes 0.2 to 0.8 mass% of Mn, 0.2 to 0.8 mass% of Ni, 0.1 to 0.5 mass% of P, and the balance is made of Cu and inevitable impurities. The compound of the additive element is precipitated in the copper matrix, the tensile strength is 540 N / mm 2 or more, the elongation is 5% or more, the conductivity is 55% IACS or more, Japan Electronic Materials Association Standard (EMAS-3003) A copper-based alloy sheet for wiring parts for electronic and electrical equipment , characterized by a cantilever block type having a maximum surface stress of 400 N / mm 2 and a stress relaxation resistance after 1000 hours at 150 ° C. of 50 or less. is there.
[0006]
According to a second aspect of the invention, electrical and electronic devices according to claim 1, wherein the [Mn + Ni] mass with respect to P of (mass%) ratio ([Mn + Ni] / P) is 2.0 to 7.0 This is a copper-based alloy plate material for wiring parts .
[0007]
The invention of claim 3 includes 0.2 to 0.8 mass% of Mn, 0.2 to 0.8 mass% of Ni, 0.1 to 0.5 mass% of P, and further 0.05 to 0.5 mass of Sn. %, include one or two of Zn0.05～1.0Mass%, balance Ri Do Cu and inevitable impurities, the compound of the additive element is precipitated in the copper matrix, a tensile strength of 540N / mm 2 or more, elongation of 5% or more, conductivity of 55% IACS or more, the maximum surface stress and 400 N / mm 2 in a cantilever block expression of Japan electronic materials Manufacturers Association standard (EMAS-3003), 1000 hours at 0.99 ° C. A copper-based alloy sheet for wiring parts for electronic and electrical equipment , characterized by having a later stress relaxation resistance of 50 or less .
[0008]
According to a fourth aspect of the present invention, there is provided the electronic and electrical apparatus according to the third aspect, wherein the ratio ([Mn + Ni] / P) of [Mn + Ni] to P is 2.0 to 7.0. This is a copper-based alloy plate material for wiring parts .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
In claim 1, the alloy elements of Mn, Ni, and P react with each other to form various compounds and precipitate in the copper matrix, or a part of the alloy elements dissolves in the machine of the copper-based alloy. Improve mechanical properties, electrical conductivity, and stress relaxation resistance.
On the other hand, in order to reduce the contact resistance, the terminal and the connector are usually plated and have good heat-resistant peelability and good bending workability into the product shape. The plating heat-resistant peelability and bending workability are not impaired.
[0010]
In this invention, the reason for prescribing the contents of Mn and Ni to 0.2 to 0.8 mass% and 0.2 to 0.8 mass%, respectively, is that the terminal or connector for in-vehicle equipment, even if either is less than the lower limit, This is because sufficient mechanical properties, stress relaxation resistance, and the like necessary for wiring parts for electronic and electrical equipment, IC lead frames, etc. cannot be obtained, and when the upper limit is exceeded, conductivity and bending workability are reduced.
Moreover, the reason for prescribing the content of P to 0.1 to 0.5 mass% is that Mn and Ni cannot form a compound with P if they are less than the lower limit value, so that solid solution is formed. This is because the stress relaxation resistance is lowered, and if the upper limit is exceeded, castability and hot workability are lowered.
[0011]
The effects of Mn, Ni, and P of the alloy elements are most stably expressed when the mass (mass%) ratio of [Mn + Ni] to P ([Mn + Ni] / P) is 2.0 to 7.0. When [Mn + Ni] / P is less than 2.0, the conductivity is slightly lowered, and when it exceeds 7.0, the strength is slightly lowered. The mass ratio is optimally 2.0 to 5.0.
[0012]
The invention according to claim 3 is the copper base alloy (Cu—Mn—Ni—P alloy) containing an appropriate amount of Sn or / and Zn, and these elements improve the mechanical properties, and further Sn is Zn has the effect of enhancing the stress relaxation resistance and enhancing the heat-resistant peelability of the plating.
The reason for defining the Sn content to be 0.05 to 0.5 mass% and the Zn content to be 0.05 to 1.0 mass%, respectively, is sufficient if the lower limit is satisfied. This is because the electrical conductivity is lowered even if any exceeds the upper limit.
[0013]
In the present invention, in addition to the alloy elements, elements such as Cr, Si, Mg, Ag, Co, Fe, Zr, Ti, V, Pb, Bi, Al, and Ti are added to the basic of the copper-based alloy as necessary. It can be added within a range not deteriorating the mechanical characteristics.
[0014]
【Example】
Hereinafter, the present invention will be described in detail with reference to examples.
Example 1
The copper base alloys (Nos. 1 to 8) having the composition specified in the invention of claim 1 shown in Table 1 were melted in a high frequency melting furnace, and this was melted by a DC method with a thickness of 30 mm, a width of 100 mm, and a length of 150 mm After casting into an ingot, this ingot was heated at 900 ° C. for 60 minutes for homogenization, and then hot rolling was started at that temperature. After hot rolling, the ingot was immediately cooled to a thickness of 12 mm. A hot-rolled material was cut off on both sides of the hot-rolled material by 1.5 mm to remove the oxide film, and then cold-rolled to obtain a cold-rolled material having a thickness of 0.36 mm. After heating for 15 seconds, heat treatment immediately cooling at a cooling rate of 15 ° C./second or more and heat treatment heating at 475 ° C. for 2 hours are performed in this order, then cold-rolled to a thickness of 0.25 mm, and then 350 ° C. A copper-based alloy sheet was produced by low-temperature annealing for 2 hours. Both the heat treatment and low temperature annealing of the cold-rolled material were performed in an inert gas atmosphere.
[0015]
(Example 2)
A copper-based alloy sheet was produced in the same manner as in Example 1 except that the copper-based alloy (Nos. 9 to 12) having the composition of the invention of claim 3 shown in Table 1 was used.
[0016]
(Comparative Example 1)
A copper-based alloy sheet was produced in the same manner as in Example 1 except that the copper-based alloy (Nos. 13 to 16) having a composition outside the scope of the present invention shown in Table 1 was used.
[0017]
For each copper-based alloy sheet produced in Examples 1 and 2 and Comparative Example 1, mechanical properties (tensile strength, elongation), electrical conductivity, stress relaxation resistance, bending workability, and plating heat resistance peelability were examined. . The same investigation was conducted on conventional copper-based alloy sheet materials (Nos. 17 to 19 in Table 1).
(1) The mechanical properties were examined in accordance with JIS Z 2241 using a No. 5 test piece specified in JIS Z 2201.
(2) The conductivity was examined according to JIS H 0505.
(3) The stress relaxation resistance adopts a cantilever block type of the Japan Electronic Materials Industry Standard (EMAS-3003), and the maximum surface stress is set to 400 N / mm 2 and held in a thermostatic chamber at 150 ° C. The stress relaxation rate (SR) after 1000 hours was examined.
(4) As for the bending workability, 180 ° bending with an inner bending radius of 0.1 mm was performed, and it was determined that a crack did not occur in a bent portion was good (◯), and a crack was determined as poor (×).
(5) The heat-resistant peelability of the plating was determined by applying a glossy Sn plating with a thickness of 3 μm to the test piece, heating it in the atmosphere at 150 ° C. for 1000 hours, performing a 90 ° bending and unbending test, The adhesion state of Sn plating was visually observed. When the plating did not peel, it was determined that the adhesion was good (◯), and when the plating was peeled, the adhesion was poor (x). The results are also shown in Table 1.
[0018]
[Table 1]
As is apparent from Table 1, the No. 1 of the invention described in claim 1 is used. 1-8 are both the automobile the instrument terminals and connectors for electronic apparatus wiring parts, etc. are required IC lead frame, tensile strength 5 4 0N / mm 2 or more, elongation more than 5%, conductive It satisfies the current target values of 55% IACS or higher and stress relaxation resistance of 50 or lower, and also exhibits excellent characteristics in bending workability and plating heat resistance peelability.
In particular, the [Mn + Ni] / P mass ratio is 2.0 to 7.0. 1, 2, 4, 5, 7, and 8 were excellent in tensile strength and electrical conductivity.
No. 3 of the present invention. Nos. 9 to 12 also showed excellent characteristics, especially No. Nos. 9 and 10 have the stress relaxation resistance No. 1 with Zn added. No. 11 is a plating heat-resistant peelable No. 11 with Sn and Zn added. No. 12 significantly improved both the stress relaxation resistance and the plating heat release resistance.
Comparative Example No. No. 13 has low Mn, so its tensile strength and stress relaxation resistance are low. No. 14 has low P, so its tensile strength, conductivity and stress relaxation resistance are low. No. 15 has a large amount of P, and thus cracks occur during hot working and cannot be manufactured normally. No. 16 had a large amount of Ni, so the conductivity and bending workability were reduced.
The conventional copper base alloy sheet No. 17 (Cu—Ni—Si alloy) has a conductivity of No. No. 18 (Cu-Mg alloy) has a tensile strength of No.18. 19 (Cu—Sn—Fe alloy) decreased in electrical conductivity and bending workability.
[0020]
【The invention's effect】
As described above, the copper-based alloy of the present invention is excellent in mechanical properties, electrical conductivity and stress relaxation resistance, has good bending workability and plating adhesion, and therefore requires severe characteristics. It can be used well for terminals and connectors for in-car devices, wiring parts for electronic and electrical devices, IC lead frames, etc., and has a remarkable industrial effect.
Claims (4)
添加元素の化合物が銅マトリックス中に析出し、引張強さが５４０Ｎ／ｍｍ ２ 以上、伸びが５％以上、導電率が５５％ＩＡＣＳ以上、日本電子材料工業会標準規格（ＥＭＡＳ−３００３）の片持ちブロック式で表面最大応力を４００Ｎ／ｍｍ ２ とし、１５０℃で１０００時間後の耐応力緩和特性が５０以下であることを特徴とする電子電気機器用配線部品用の銅基合金板材。Mn of 0.2~0.8mass%, Ni of 0.2～0.8Mass%, a P containing 0.1 to 0.5 mass%, Ri Do a balance of Cu and inevitable impurities,
Compound of additive element precipitates in copper matrix, tensile strength is 540 N / mm 2 or more, elongation is 5% or more, conductivity is 55% IACS or more, Japan Electronic Materials Association Standard (EMAS-3003) fragment A copper-based alloy sheet for wiring parts for electronic and electrical equipment , characterized in that the maximum stress on the surface is 400 N / mm 2 and the stress relaxation resistance after 1000 hours at 150 ° C. is 50 or less .
添加元素の化合物が銅マトリックス中に析出し、引張強さが５４０Ｎ／ｍｍ ２ 以上、伸びが５％以上、導電率が５５％ＩＡＣＳ以上、日本電子材料工業会標準規格（ＥＭＡＳ−３００３）の片持ちブロック式で表面最大応力を４００Ｎ／ｍｍ ２ とし、１５０℃で１０００時間後の耐応力緩和特性が５０以下であることを特徴とする電子電気機器用配線部品用の銅基合金板材。It contains 0.2 to 0.8 mass% of Mn, 0.2 to 0.8 mass% of Ni, 0.1 to 0.5 mass% of P, Sn 0.05 to 0.5 mass%, Zn 0.05 to 1. include one or two of 0Mass%, Ri Do the balance is Cu and inevitable impurities,
Compound of additive element precipitates in copper matrix, tensile strength is 540 N / mm 2 or more, elongation is 5% or more, conductivity is 55% IACS or more, Japan Electronic Materials Association Standard (EMAS-3003) fragment A copper-based alloy sheet for wiring parts for electronic and electrical equipment , characterized in that the maximum stress on the surface is 400 N / mm 2 and the stress relaxation resistance after 1000 hours at 150 ° C. is 50 or less .
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| Application Number | Priority Date | Filing Date | Title |
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| JP2001275702A JP4728535B2 (en) | 2001-09-11 | 2001-09-11 | Copper-based alloy sheet for wiring components for electronic and electrical equipment |
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| JP2001275702A JP4728535B2 (en) | 2001-09-11 | 2001-09-11 | Copper-based alloy sheet for wiring components for electronic and electrical equipment |
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| JP4728535B2 true JP4728535B2 (en) | 2011-07-20 |
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| MY143219A (en) | 2004-02-27 | 2011-03-31 | Furukawa Electric Co Ltd | Copper alloy |
| DE102013014500A1 (en) * | 2013-09-02 | 2015-03-05 | Kme Germany Gmbh & Co. Kg | copper alloy |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
| JPS6379929A (en) * | 1987-08-26 | 1988-04-09 | Nippon Telegr & Teleph Corp <Ntt> | Copper-nickel-tin alloy for integrated circuit conductor and its production |
| JPH11189834A (en) * | 1997-10-23 | 1999-07-13 | Furukawa Electric Co Ltd:The | High strength trolley wire and its manufacture |
-
2001
- 2001-09-11 JP JP2001275702A patent/JP4728535B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
| JPS6379929A (en) * | 1987-08-26 | 1988-04-09 | Nippon Telegr & Teleph Corp <Ntt> | Copper-nickel-tin alloy for integrated circuit conductor and its production |
| JPH11189834A (en) * | 1997-10-23 | 1999-07-13 | Furukawa Electric Co Ltd:The | High strength trolley wire and its manufacture |
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