JP4719337B2 - 可動シールド機構を備えたエッチングチャンバー - Google Patents
可動シールド機構を備えたエッチングチャンバー Download PDFInfo
- Publication number
- JP4719337B2 JP4719337B2 JP2000203765A JP2000203765A JP4719337B2 JP 4719337 B2 JP4719337 B2 JP 4719337B2 JP 2000203765 A JP2000203765 A JP 2000203765A JP 2000203765 A JP2000203765 A JP 2000203765A JP 4719337 B2 JP4719337 B2 JP 4719337B2
- Authority
- JP
- Japan
- Prior art keywords
- shield part
- etching
- etching chamber
- movable shield
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000203765A JP4719337B2 (ja) | 2000-07-05 | 2000-07-05 | 可動シールド機構を備えたエッチングチャンバー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000203765A JP4719337B2 (ja) | 2000-07-05 | 2000-07-05 | 可動シールド機構を備えたエッチングチャンバー |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010047323A Division JP4918147B2 (ja) | 2010-03-04 | 2010-03-04 | エッチング方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002025983A JP2002025983A (ja) | 2002-01-25 |
| JP2002025983A5 JP2002025983A5 (enExample) | 2007-07-12 |
| JP4719337B2 true JP4719337B2 (ja) | 2011-07-06 |
Family
ID=18701133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000203765A Expired - Lifetime JP4719337B2 (ja) | 2000-07-05 | 2000-07-05 | 可動シールド機構を備えたエッチングチャンバー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4719337B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9184072B2 (en) * | 2007-07-27 | 2015-11-10 | Mattson Technology, Inc. | Advanced multi-workpiece processing chamber |
| US10319982B2 (en) | 2013-02-01 | 2019-06-11 | Encell Technology, Inc. | Coated iron electrode and method of making same |
| CN109314034B (zh) | 2016-06-15 | 2021-11-16 | 瑞士艾发科技 | 真空处理室及制造真空处理的板形基底的方法 |
| US12354847B2 (en) | 2020-03-12 | 2025-07-08 | Applied Materials, Inc. | Methods and apparatus for conductance liners in semiconductor process chambers |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3210207B2 (ja) * | 1994-04-20 | 2001-09-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JPH0820879A (ja) * | 1994-07-08 | 1996-01-23 | Nissin Electric Co Ltd | プラズマ処理装置 |
| JP3453223B2 (ja) * | 1994-08-19 | 2003-10-06 | 東京エレクトロン株式会社 | 処理装置 |
| JPH10107009A (ja) * | 1996-09-27 | 1998-04-24 | Nec Corp | ドライエッチング装置 |
| JPH11111679A (ja) * | 1997-10-07 | 1999-04-23 | Mitsui Chem Inc | 反応性イオンエッチング装置および反応性イオンエッチング方法 |
-
2000
- 2000-07-05 JP JP2000203765A patent/JP4719337B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002025983A (ja) | 2002-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6433298B1 (en) | Plasma processing apparatus | |
| US6017396A (en) | Plasma film forming apparatus that prevents substantial irradiation damage to the substrate | |
| KR101369131B1 (ko) | 웨이퍼의 베벨 에지 및 이면상의 필름들을 제거하는 장치 및 방법들 | |
| US8778813B2 (en) | Confined process volume PECVD chamber | |
| US7270715B2 (en) | Chemical vapor deposition apparatus | |
| KR101289770B1 (ko) | 플라즈마 처리 장치 | |
| CN101273430B (zh) | 去除晶片的斜面边缘和背部上的膜的装置和方法 | |
| JP2001148378A (ja) | プラズマ処理装置、クラスターツールおよびプラズマ制御方法 | |
| TW200931570A (en) | Method and apparatus for sealing an opening of a processing chamber | |
| US6320154B1 (en) | Plasma processing method | |
| CN118571795A (zh) | 晶圆镀膜、刻蚀一体腔 | |
| JP4719337B2 (ja) | 可動シールド機構を備えたエッチングチャンバー | |
| JP4575998B2 (ja) | 薄膜形成装置および薄膜形成方法 | |
| CN213212104U (zh) | 等离子体处理装置 | |
| JP4918147B2 (ja) | エッチング方法 | |
| EP1156516A1 (en) | Method and apparatus for plasma processing | |
| JPH04271122A (ja) | プラズマ処理装置 | |
| JP4381526B2 (ja) | プラズマエッチング方法 | |
| JP4364335B2 (ja) | スパッタリング装置 | |
| JP2864141B2 (ja) | 半導体装置の製造方法 | |
| JP2007012663A (ja) | 減圧処理装置及び減圧処理方法 | |
| JP6671034B2 (ja) | プラズマ処理装置およびプラズマ処理方法 | |
| JPH05217920A (ja) | Ecrプラズマ処理装置 | |
| KR102217925B1 (ko) | 게이트 밸브의 제어 방법 | |
| CN223206222U (zh) | 等离子体处理装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20041130 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20041130 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20041130 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20041130 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070425 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070507 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070907 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100119 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100304 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100803 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110208 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110404 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4719337 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140408 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |