JP4715464B2 - 異方性導電シート、その製造方法、接続方法および検査方法 - Google Patents
異方性導電シート、その製造方法、接続方法および検査方法 Download PDFInfo
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- JP4715464B2 JP4715464B2 JP2005336053A JP2005336053A JP4715464B2 JP 4715464 B2 JP4715464 B2 JP 4715464B2 JP 2005336053 A JP2005336053 A JP 2005336053A JP 2005336053 A JP2005336053 A JP 2005336053A JP 4715464 B2 JP4715464 B2 JP 4715464B2
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- conductive sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Metallurgy (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Insulated Conductors (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
本発明の異方性導電シートは、図1(a)に示すように、厚さ方向に導電性を有する異方性導電シート8であって、合成樹脂からなる電気絶縁性の膜を基膜1とし、基膜は、厚さ方向に形成された複数の空孔3を有する。空孔3は、基膜の一方の主面の方向に開口し、他方の主面の方向は閉口し、空孔3の閉口部分2aと空孔3の内壁2bに金属が付着している。この異方性導電シート8に半導体ウェハ9を実装した状態を図1(b)に示す。図1(b)に示すように、半導体ウェハ9の電極7を空孔3の閉口部分2aに外部から接触することにより、空孔3の閉口部分2aおよび内壁2bに付着している金属を介して、空孔3が開口する主面と、接触する電極7とを電気的に導通することができる。
実施の形態1
本発明の異方性導電シートの製造方法は、シンクロトロン放射のX線またはレーザ光を照射することにより、厚さ方向に空孔を形成することを特徴とする。製造方法の工程図を図3に例示する。まず、図3(a)に示すように、たとえば、厚さ600μmのPTFEシートを基膜31bとし、基膜31bの2つの主面上に、犠牲層31a,31cを形成する。犠牲層31a,31cは、基膜31bとの密着性と剥離性を高める点で、同材料であるPTFEからなるものが好ましい。犠牲層31a,31cは、各々厚さ100μm程度のものを熱融着などにより形成することができる。
本発明の異方性導電シートの製造方法の他の態様は、ドリルにより厚さ方向に空孔を形成することを特徴とする。製造方法の工程図を図4に示す。まず、図4(a)に示すように、厚さ1mmのPTFEシートからなる基膜41bの2つの主面上に、各々厚さ100μmのPTFEからなる犠牲層41a,41cを形成する。
Claims (6)
- 厚さ方向に導電性を有する異方性導電シートであって、合成樹脂からなる電気絶縁性の多孔質膜を基膜とし、該基膜は、厚さ方向に形成された複数の空孔を有し、該空孔は、基膜の一方の主面の方向に開口し、他方の主面の方向は閉口し、基膜の一部であって、空孔の前記閉口部分の全体とこれに連続する空孔の内壁を含む領域に金属が付着しており、空孔の閉口部分に外部から電極を接触することにより、前記金属を介して、空孔が開口する主面と、接触する電極とが電気的に導通することを特徴とする異方性導電シート。
- 前記合成樹脂は、延伸ポリテトラフルオロエチレンであることを特徴とする請求項1に記載の異方性導電シート。
- 請求項1または2に記載の異方性導電シートの製造方法であって、シンクロトロン放射のX線またはレーザ光を照射することにより厚さ方向に空孔を形成することを特徴とする異方性導電シートの製造方法。
- 請求項1または2に記載の異方性導電シートの製造方法であって、ドリルにより厚さ方向に空孔を形成することを特徴とする異方性導電シートの製造方法。
- 請求項1または2に記載の異方性導電シートの空孔の閉口部分に半導体チップまたは回路基板の電極を接触して行なうことを特徴とする接続方法。
- 半導体チップまたは回路基板の電気検査において、請求項1または2に記載の異方性導電シートの空孔の閉口部分に被検査物の電極を接触して行なうことを特徴とする検査方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005336053A JP4715464B2 (ja) | 2005-11-21 | 2005-11-21 | 異方性導電シート、その製造方法、接続方法および検査方法 |
EP06823175A EP1953870A4 (en) | 2005-11-21 | 2006-11-08 | ANISOTROPIC CONDUCTIVE SHEET, METHOD OF MANUFACTURING THEREOF, COMPOUND PROCESS AND INSPECTION METHOD |
US12/093,232 US7667480B2 (en) | 2005-11-21 | 2006-11-08 | Anisotropic conductive sheet, its production method, connection method and inspection method |
CA002628772A CA2628772A1 (en) | 2005-11-21 | 2006-11-08 | Anisotropic conductive sheet, its production method, connection method and inspection method |
CN2006800434555A CN101313438B (zh) | 2005-11-21 | 2006-11-08 | 各向异性导电片及其制造方法、连接方法和检查方法 |
KR1020087008186A KR20080077087A (ko) | 2005-11-21 | 2006-11-08 | 이방성 도전 시트, 그 제조 방법, 접속 방법 및, 검사 방법 |
PCT/JP2006/322271 WO2007058101A1 (ja) | 2005-11-21 | 2006-11-08 | 異方性導電シート、その製造方法、接続方法および検査方法 |
TW095142744A TWI374579B (en) | 2005-11-21 | 2006-11-20 | Anisotropic conductive sheet, manufacturing method, connecting method, and examinating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005336053A JP4715464B2 (ja) | 2005-11-21 | 2005-11-21 | 異方性導電シート、その製造方法、接続方法および検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007141731A JP2007141731A (ja) | 2007-06-07 |
JP4715464B2 true JP4715464B2 (ja) | 2011-07-06 |
Family
ID=38048488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005336053A Expired - Fee Related JP4715464B2 (ja) | 2005-11-21 | 2005-11-21 | 異方性導電シート、その製造方法、接続方法および検査方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7667480B2 (ja) |
EP (1) | EP1953870A4 (ja) |
JP (1) | JP4715464B2 (ja) |
KR (1) | KR20080077087A (ja) |
CN (1) | CN101313438B (ja) |
CA (1) | CA2628772A1 (ja) |
TW (1) | TWI374579B (ja) |
WO (1) | WO2007058101A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
US9442133B1 (en) * | 2011-08-21 | 2016-09-13 | Bruker Nano Inc. | Edge electrode for characterization of semiconductor wafers |
WO2015107568A1 (ja) * | 2014-01-20 | 2015-07-23 | 株式会社Leap | コネクタの製造方法 |
JP2016076299A (ja) * | 2014-10-02 | 2016-05-12 | ポリマテック・ジャパン株式会社 | 異方導電体 |
JP6459739B2 (ja) * | 2015-04-13 | 2019-01-30 | オムロン株式会社 | 端子の接続構造およびこれを用いた電磁継電器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0817498A (ja) * | 1994-06-30 | 1996-01-19 | Ind Technol Res Inst | 複合バンプ接合 |
JPH10247575A (ja) * | 1997-03-03 | 1998-09-14 | Toho Kasei Kk | Ic用ソケット |
JP2002075489A (ja) * | 2000-08-30 | 2002-03-15 | Japan Aviation Electronics Industry Ltd | 異方性導電シートおよびその製造方法 |
JP2003533863A (ja) * | 2000-05-15 | 2003-11-11 | モレックス インコーポレーテッド | エラストマー電気コネクタ |
JP2005294131A (ja) * | 2004-04-02 | 2005-10-20 | Sumitomo Electric Ind Ltd | 異方性導電シート |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
JP3233867B2 (ja) | 1997-01-31 | 2001-12-04 | 富士通株式会社 | 試験用基板及びこれを用いた試験方法 |
US5926029A (en) * | 1997-05-27 | 1999-07-20 | International Business Machines Corporation | Ultra fine probe contacts |
JP2001077495A (ja) * | 1999-09-02 | 2001-03-23 | Fujitsu Ltd | 電子部品用コンタクタ及び電子部品の試験方法 |
JP2005142111A (ja) | 2003-11-10 | 2005-06-02 | Sumitomo Electric Ind Ltd | 異方性導電シート |
JP2006209400A (ja) | 2005-01-27 | 2006-08-10 | Techno System Kk | 医療情報提供システム |
JP2006269400A (ja) * | 2005-02-28 | 2006-10-05 | Sumitomo Electric Ind Ltd | 異方性導電シート、その製造方法、接続方法および検査方法 |
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2005
- 2005-11-21 JP JP2005336053A patent/JP4715464B2/ja not_active Expired - Fee Related
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2006
- 2006-11-08 CN CN2006800434555A patent/CN101313438B/zh not_active Expired - Fee Related
- 2006-11-08 KR KR1020087008186A patent/KR20080077087A/ko not_active Application Discontinuation
- 2006-11-08 EP EP06823175A patent/EP1953870A4/en not_active Withdrawn
- 2006-11-08 US US12/093,232 patent/US7667480B2/en not_active Expired - Fee Related
- 2006-11-08 WO PCT/JP2006/322271 patent/WO2007058101A1/ja active Application Filing
- 2006-11-08 CA CA002628772A patent/CA2628772A1/en not_active Abandoned
- 2006-11-20 TW TW095142744A patent/TWI374579B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0817498A (ja) * | 1994-06-30 | 1996-01-19 | Ind Technol Res Inst | 複合バンプ接合 |
JPH10247575A (ja) * | 1997-03-03 | 1998-09-14 | Toho Kasei Kk | Ic用ソケット |
JP2003533863A (ja) * | 2000-05-15 | 2003-11-11 | モレックス インコーポレーテッド | エラストマー電気コネクタ |
JP2002075489A (ja) * | 2000-08-30 | 2002-03-15 | Japan Aviation Electronics Industry Ltd | 異方性導電シートおよびその製造方法 |
JP2005294131A (ja) * | 2004-04-02 | 2005-10-20 | Sumitomo Electric Ind Ltd | 異方性導電シート |
Also Published As
Publication number | Publication date |
---|---|
TWI374579B (en) | 2012-10-11 |
WO2007058101A1 (ja) | 2007-05-24 |
CN101313438A (zh) | 2008-11-26 |
CA2628772A1 (en) | 2007-05-24 |
CN101313438B (zh) | 2010-12-08 |
JP2007141731A (ja) | 2007-06-07 |
EP1953870A1 (en) | 2008-08-06 |
US20090115444A1 (en) | 2009-05-07 |
US7667480B2 (en) | 2010-02-23 |
KR20080077087A (ko) | 2008-08-21 |
EP1953870A4 (en) | 2012-07-11 |
TW200733485A (en) | 2007-09-01 |
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