JP4715149B2 - 薄膜半導体装置の製造方法 - Google Patents

薄膜半導体装置の製造方法 Download PDF

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Publication number
JP4715149B2
JP4715149B2 JP2004286325A JP2004286325A JP4715149B2 JP 4715149 B2 JP4715149 B2 JP 4715149B2 JP 2004286325 A JP2004286325 A JP 2004286325A JP 2004286325 A JP2004286325 A JP 2004286325A JP 4715149 B2 JP4715149 B2 JP 4715149B2
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thin film
semiconductor thin
irradiation
semiconductor
laser beam
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JP2004286325A
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Japanese (ja)
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JP2006100662A5 (https=
JP2006100662A (ja
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暁夫 町田
裕隆 赤尾
隆広 亀井
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Sony Corp
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Sony Corp
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  • Recrystallisation Techniques (AREA)
JP2004286325A 2004-09-30 2004-09-30 薄膜半導体装置の製造方法 Expired - Lifetime JP4715149B2 (ja)

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JP2004286325A JP4715149B2 (ja) 2004-09-30 2004-09-30 薄膜半導体装置の製造方法

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JP2004286325A JP4715149B2 (ja) 2004-09-30 2004-09-30 薄膜半導体装置の製造方法

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JP2006100662A JP2006100662A (ja) 2006-04-13
JP2006100662A5 JP2006100662A5 (https=) 2007-11-15
JP4715149B2 true JP4715149B2 (ja) 2011-07-06

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JP2004286325A Expired - Lifetime JP4715149B2 (ja) 2004-09-30 2004-09-30 薄膜半導体装置の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424499B (zh) 2006-06-30 2014-01-21 半導體能源研究所股份有限公司 製造半導體裝置的方法
US7678701B2 (en) * 2006-07-31 2010-03-16 Eastman Kodak Company Flexible substrate with electronic devices formed thereon

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936376A (ja) * 1995-07-19 1997-02-07 Sony Corp 薄膜半導体装置の製造方法
JPH1012882A (ja) * 1996-06-20 1998-01-16 Toshiba Corp 薄膜トランジスタ及びその製造方法
JP4566503B2 (ja) * 2001-07-30 2010-10-20 株式会社半導体エネルギー研究所 レーザー処理装置並びに半導体装置の作製方法

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