JP4712474B2 - 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置 - Google Patents

半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置 Download PDF

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Publication number
JP4712474B2
JP4712474B2 JP2005221691A JP2005221691A JP4712474B2 JP 4712474 B2 JP4712474 B2 JP 4712474B2 JP 2005221691 A JP2005221691 A JP 2005221691A JP 2005221691 A JP2005221691 A JP 2005221691A JP 4712474 B2 JP4712474 B2 JP 4712474B2
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Japan
Prior art keywords
unit
semiconductor device
adjustment
test
pads
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Expired - Fee Related
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JP2005221691A
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Japanese (ja)
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JP2007040704A (ja
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直樹 池内
正巳 八壁
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005221691A priority Critical patent/JP4712474B2/ja
Priority to PCT/JP2006/314957 priority patent/WO2007013580A1/ja
Priority to TW095127909A priority patent/TW200720660A/zh
Publication of JP2007040704A publication Critical patent/JP2007040704A/ja
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Publication of JP4712474B2 publication Critical patent/JP4712474B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Wire Bonding (AREA)
JP2005221691A 2005-07-29 2005-07-29 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置 Expired - Fee Related JP4712474B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005221691A JP4712474B2 (ja) 2005-07-29 2005-07-29 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置
PCT/JP2006/314957 WO2007013580A1 (ja) 2005-07-29 2006-07-28 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置
TW095127909A TW200720660A (en) 2005-07-29 2006-07-28 Semiconductor device, manufacturing method of semiconductor device, manufacturing method program of semiconductor device, and semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005221691A JP4712474B2 (ja) 2005-07-29 2005-07-29 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置

Publications (2)

Publication Number Publication Date
JP2007040704A JP2007040704A (ja) 2007-02-15
JP4712474B2 true JP4712474B2 (ja) 2011-06-29

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Family Applications (1)

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JP2005221691A Expired - Fee Related JP4712474B2 (ja) 2005-07-29 2005-07-29 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置

Country Status (3)

Country Link
JP (1) JP4712474B2 (https=)
TW (1) TW200720660A (https=)
WO (1) WO2007013580A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024543021A (ja) * 2021-11-02 2024-11-19 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Ｍｅｍｓ装置の動的パラメータを特定する方法および装置、ならびにｍｅｍｓ装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325630B2 (ja) * 2009-03-27 2013-10-23 株式会社東芝 マイクロホン装置並びにその調整装置及び調整方法
JP5511260B2 (ja) * 2009-08-19 2014-06-04 キヤノン株式会社 容量型電気機械変換装置、及びその感度調整方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706765C3 (de) * 1987-03-03 1995-11-09 Telefunken Microelectron Aufprallsensor für ein Fahrzeug, mit einer Prüfschaltung
JPH0534371A (ja) * 1991-07-31 1993-02-09 Tokai Rika Co Ltd 半導体加速度センサの感度測定装置
JP3382030B2 (ja) * 1994-10-14 2003-03-04 株式会社日立製作所 フルモールド実装型加速度センサ
JPH0933567A (ja) * 1995-07-21 1997-02-07 Akebono Brake Ind Co Ltd 半導体加速度センサのセンサチップ検査方法及び検査装置
JPH11183507A (ja) * 1997-12-25 1999-07-09 Fujikura Ltd 半導体センサ
JP4229347B2 (ja) * 1999-05-31 2009-02-25 キヤノン株式会社 能動制振装置、露光装置及びデバイス製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024543021A (ja) * 2021-11-02 2024-11-19 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Ｍｅｍｓ装置の動的パラメータを特定する方法および装置、ならびにｍｅｍｓ装置
JP7689248B2 (ja) 2021-11-02 2025-06-05 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Ｍｅｍｓ装置の動的パラメータを特定する方法および装置、ならびにｍｅｍｓ装置
US12522499B2 (en) 2021-11-02 2026-01-13 Robert Bosch Gmbh Method and device for ascertaining dynamic parameters of a MEMS apparatus, and MEMS apparatus

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Publication number Publication date
JP2007040704A (ja) 2007-02-15
TW200720660A (en) 2007-06-01
TWI292042B (https=) 2008-01-01
WO2007013580A1 (ja) 2007-02-01

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