JP4710880B2 - Laser processing equipment - Google Patents

Description

    The present invention relates to a laser processing apparatus capable of processing both blind hole processing (non-through hole processing) and through hole processing (through hole processing) with a single processing apparatus in a laser processing apparatus that performs processing by irradiating a laser beam. About.

  In conventional hole drilling using, for example, laser, there is a broad classification, through-hole machining (through-hole machining) for making a through-hole in a workpiece, and blinds for making a non-through-hole leaving a part of the surface layer of the workpiece. There are two types of hole hole processing (non-through hole processing). When blind hole hole processing (non-through hole processing) is performed, in order to hold the lower surface of the workpiece with a holding base, FIG. As shown in FIG. 4, the suction plate 134 provided on the holding table 133 is provided with a through hole 134a, and the sheet placed on the suction plate 134 is evacuated from the vacuum exhaust port 135. The workpiece 131 was processed while being vacuum-sucked and held at a predetermined position.

In addition, when performing through-hole processing, in order to perform processing with the lower surface of the processing portion of the workpiece in a hollow state, as shown in FIG. 7B, at least one pair of clamps 107 that respectively hold opposite ends. And tension applying devices 106, 110, 111, and 112 that apply a biasing force in a direction away from each other between the pair of clamps 107 to apply tension to the workpiece, and the workpiece 102 is opposed to the workpiece 102. The two sides were held by the clamp 107, and the workpiece was processed while applying tension to the workpiece by the tension applying devices 106, 110, 111, and 112 while maintaining the plane (see, for example, Patent Document 1).
JP-A-10-296473

  However, the conventional laser processing apparatus has a problem that two types of equipment must be possessed when performing both blind hole processing (non-through hole processing) and through hole processing (through hole processing). It was.

  An object of this invention is to provide the laser processing apparatus which enables two types of processing with one installation.

In order to solve the above problems, the present invention provides a laser beam irradiation apparatus for irradiating a processing region of a rectangular quadrilateral plate-like workpiece with a laser beam and a two-side chuck that opposes the workpiece. A tensioning device that holds the workpiece while applying a force, and the workpiece is formed by the tensioning device to form a plurality of processing regions in the workpiece while the workpiece is pulled and maintained in a plane. A moving device for moving, a dust collector having a size over the entire processing region is disposed on the back side of the surface irradiated with the laser beam of the workpiece, and the dust collecting device in a direction perpendicular to the tensile force. Two holding devices that respectively hold the sides of the workpiece and an adjusting device that moves one of the holding devices in a direction perpendicular to the tensile force are provided.

  In addition, a suction device provided with a plurality of suction holes for sucking the workpiece is detachably disposed between the workpiece and the dust collector, and when the suction device is disposed, It holds a thing, does not hold | maintain the said workpiece with the said tension | pulling apparatus and the said holding | maintenance apparatus, and has a stop device which stops the gas flow inside the said dust collector when the adsorption | suction apparatus is arrange | positioned.

  When performing blind hole processing (non-through-hole processing), the workpiece is pulled by the tension device that holds the workpiece while applying a tensile force by the two-side chucks that oppose the workpiece, and the tension device. A moving device for moving the workpiece in order to form a plurality of machining areas on the workpiece, and a plurality of machining areas on the back side of the surface irradiated with laser light of the workpiece. A dust collector having a size over the entire area, two holding devices each holding the side of the workpiece perpendicular to the tensile force, and an adjustment for moving one of the holding devices in a direction perpendicular to the tensile force Hold the workpiece in the machine.

  In addition, when performing through-hole processing (through-hole processing), an adsorption device with a plurality of adsorption holes for adsorbing workpieces is placed between the dust collectors, and the gas flow inside the dust collector is stopped. The workpiece is stopped by the apparatus and the workpiece is held by the suction device, and the workpiece is held by the pulling device and the holding device.

      As described above, the present invention arranges a dust collector having a size over the whole of the plurality of processing regions on the back side of the surface irradiated with the laser light of the workpiece, and sucks the workpiece. A suction device having a plurality of holes is detachably disposed between the workpiece and the dust collector. When the suction device is disposed, the workpiece is held by the suction device, and the suction device is disposed. By providing a stop device that stops the gas flow inside the dust collector when it is done, two types of processing can be performed with one facility.

(Embodiment)
In FIG. 1, reference numeral 1 denotes a thin plate-shaped workpiece formed of a soft member, 2 denotes a chuck sandwiched between two sides facing the workpiece 1, and 3 denotes a workpiece 1 by the chuck 2. The workpiece 1 is held by the chuck 2 and the tensioning device 3 with a tensioning device that applies a tensile force while being held. 4 is a moving device for moving the workpiece 1, and 5 is a dust collecting device having a size over the entire processing region on the back side of the surface irradiated with the laser beam. It has a stop device 6 for stopping the gas flow. Reference numeral 7 denotes two holding devices that respectively hold the sides of the workpiece in a direction perpendicular to the side on which the tensile force applied by the tensioning device 3 acts. Reference numeral 8 denotes one of the holding devices 7 that moves in a direction perpendicular to the tensile force. It is an adjustment device. The adjusting device 8 corresponds to the size of the workpiece 1 in the direction perpendicular to the tensile force, and holds the workpiece 1 without being affected by the size in the direction perpendicular to the tensile direction of the workpiece 1. is there.

  FIG. 2 shows a state in which a large workpiece 1a in a direction perpendicular to the tensile direction is held.

  In FIG. 3, reference numeral 9 denotes a suction device provided with a plurality of suction holes for sucking the workpiece 1, and a plurality of suction holes can be detachably disposed between the workpiece 1 and the dust collector 5. When the suction device 9 is disposed, the workpiece 1 is held by the suction device 9, and the workpiece is held by the pulling device 3 and the holding device 2 together. 4A and 4B show the holding state of the workpieces 1 and 1a.

  The operation of the laser processing apparatus configured as described above will be described with reference to FIGS. 1, 3, 5, and 6.

  5 and 6, 10 is a means for turning on / off the holding state of the holding device 7, and 11 is a means for turning on / off the holding state of the suction device 9.

  First, when performing through-hole processing (through-hole processing), in FIG. 1, the workpiece 1 is conveyed from a supply device for the workpiece 1 not shown in the drawing to the processing stage shown in FIG. 1.

  After the conveyed workpiece 1 is held by the holding device 2 at the two opposing sides, a tensile force is applied by the tension device 3 to maintain the plane of the workpiece.

  Thereafter, the two holding devices 7 that hold the sides of the workpiece perpendicular to the tensile force of the workpiece 1 held in a plane are sucked and held.

  The workpiece 1 held in this manner is moved to the laser processing area by the moving device 4, and the dust collector 5 having a size over the whole of the plurality of processing regions on the back side of the surface irradiated with the laser light. Arbitrary processing is performed while operating.

  Further, when performing blind hole processing (non-through hole processing), first, in FIG. 4, a plurality of suction devices 9 provided with a plurality of suction holes for sucking the workpiece 1 are arranged between the dust collectors 5 and irradiated with laser light. The stop device 6 for stopping the dust collector 5 having a size over the entire processing region is operated on the back surface side of the surface to be processed to stop the dust collection on the back surface side of the surface irradiated with the laser beam.

  Thereafter, the workpiece 1 is conveyed from a supply device for the workpiece 1 (not shown) to the machining stage shown in FIG. The conveyed workpiece 1 holds two sides facing each other with a holding device 2. Thereafter, suction holding is performed by two holding devices 7 and suction devices 9 that respectively hold the sides of the workpiece perpendicular to the tensile force of the workpiece 1.

  At this time, since the workpiece 1 is maintained flat by the holding device 7 and the suction device 9, the tension device 3 does not operate.

  The workpiece 1 held in this way moves to the laser processing area by the moving device 4 and performs arbitrary processing.

  According to the laser processing apparatus of the present invention, two types of processing can be performed with one facility, which is industrially useful.

The figure which shows the whole outline | summary of the holding | maintenance apparatus at the time of performing the through-hole process (through-hole process) of this invention The figure which shows a holding | maintenance state when the workpiece in FIG. 1 becomes large in the direction perpendicular to the tensile direction. The figure which shows the whole holding | maintenance apparatus at the time of performing the blind hole processing (non-through-hole processing) of this invention (A) The work piece in FIG. 3 shows a holding state similar to that in FIG. 1, (b) The work piece in FIG. 3 shows a holding state when the work piece becomes larger in the direction perpendicular to the tensile direction. Figure The figure which shows the whole detail of the holding | maintenance apparatus at the time of performing the through-hole process (through-hole process) of this invention The figure which shows the whole detail of the holding | maintenance apparatus at the time of performing the blind hole processing (non-through-hole processing) of this invention (A) (b) The figure which shows the holding structure of the workpiece of the conventional thin plate processing apparatus

Explanation of symbols

1 Workpiece 2 Holding device (chuck) that holds two opposite sides
3 Pulling device that pulls one side of the holding device 2 4 Moving device that moves the workpiece 5 Dust collector 6 Dust collection stop device 7 Holding device that holds each side of the workpiece perpendicular to the tensile force 8 Holding device 8 Adjustment device that adjusts the position of one side of the suction device 9 A plurality of suction devices that can be detachably disposed between the dust collectors 5

Claims (5)

A laser beam irradiation device for irradiating a processing region of a rectangular quadrilateral plate-like workpiece with a laser beam, a tension device for holding the workpiece while applying a tensile force by two chucks opposed to the workpiece, and A moving device for moving the workpiece to form a plurality of machining areas on the workpiece in a state where the workpiece is pulled and maintained by a tensioning device;
A dust collector having a size covering the entire area of the plurality of processing regions is disposed on the back side of the surface of the workpiece that is irradiated with the laser beam, and the sides of the workpiece in a direction perpendicular to the tensile force are respectively set. A laser processing apparatus provided with two holding devices for holding, and an adjusting device for moving one of the holding devices in a direction perpendicular to the tensile force;
A plurality of suction devices each provided with a plurality of suction holes for sucking the workpiece are detachably disposed between the workpiece and the dust collector, and the workpiece is moved by the suction device when the suction device is disposed. holds, the row holding the workpiece by the tensioning device and the retaining device together selling over tHE machining apparatus. A laser beam irradiation device for irradiating a processing region of a rectangular quadrilateral plate-like workpiece with a laser beam, a tension device for holding the workpiece while applying a tensile force by two chucks opposed to the workpiece, and A moving device for moving the workpiece to form a plurality of machining areas on the workpiece in a state where the workpiece is pulled and maintained by a tensioning device;
A dust collector having a size covering the entire area of the plurality of processing regions is disposed on the back side of the surface of the workpiece that is irradiated with the laser beam, and the sides of the workpiece in a direction perpendicular to the tensile force are respectively set. A laser processing apparatus provided with two holding devices for holding, and an adjusting device for moving one of the holding devices in a direction perpendicular to the tensile force;
An adsorption device having a plurality of adsorption holes for adsorbing the workpiece is detachably disposed between the workpiece and the dust collector, and when the adsorption device is arranged, the workpiece is moved by the adsorption device. holding the tensioning device and said at holding device holds the workpiece such put over tHE machining apparatus. The laser processing apparatus according to claim 2 , further comprising a stop device that stops a gas flow inside the dust collector when the adsorption device is arranged. 4. The laser processing apparatus according to claim 3 , wherein when a plurality of the stop devices are arranged, partial holding adsorption is possible when the size of the workpiece changes in a direction perpendicular to the tensile force of the workpiece. . Billing placing the second dust collector having a suction portion for sucking the gas flow and the discharge portion of the gas stream flows parallel to the workpiece between the workpiece and the laser beam illumination device Item 5. The laser processing apparatus according to any one of Items 1 to 4 .

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