JP3571519B2 - Laser processing apparatus and laser processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing apparatus and a laser processing method for performing laser processing such as micro-drilling processing with a laser beam on a workpiece such as a circuit board.
[0002]
[Prior art]
FIG. 11 shows a configuration of a workpiece holding device in a conventional laser processing apparatus. The laser processing apparatus 130 is configured to perform laser processing while holding a sheet-like workpiece 131 in a predetermined position.
[0003]
In FIG. 11, the suction plate 134 disposed on the holding table 133 is provided with a through hole 134 a, and is evacuated from the vacuum exhaust port 135, whereby a sheet-like sheet placed on the suction plate 134. The workpiece 131 is vacuum-sucked and held at a predetermined position. By irradiating the workpiece 131 held at the predetermined position with laser light, a minute drilling process is performed.
[0004]
Further, as shown in FIG. 12, as a device for processing a surface of a thin sheet-like workpiece (work) such as a metal plate with high speed and high accuracy, the workpiece is positioned, and laser light is applied to the workpiece surface. CO processed by irradiation₂Laser processing apparatuses are known. As shown in FIG. 12, this type of laser processing apparatus receives a large number of locations on the lower surface of the workpiece 41 by a sword ridge 42, flattens the workpiece 41 using its own weight, and performs the workpiece 41. The laser beam 43 is irradiated and processed from the upper surface.
[0005]
[Problems to be solved by the invention]
However, in the conventional example shown in FIG. 11, when the workpiece 131 is drilled with laser light, the laser light penetrating the workpiece 131 by drilling is reflected by the suction plate 134, so the reflected light is The workpiece 131 is heated and deformed. Since the circuit board material and the like are thin and easily deformed by heat, as a countermeasure, the suction plate 134 is previously provided with a through hole for reflection prevention at a position corresponding to the drilling position of the workpiece 131. However, since the position of the anti-reflection through hole differs depending on the type of the workpiece 131 to be processed, there is a problem that it is difficult to cope with various types. If the through hole for preventing reflection is formed large, it becomes possible to cope with a change in the processing position. However, when the workpiece 131 is thin, distortion due to suction occurs and the processing accuracy is lowered. . Further, since the workpiece 131 is vacuum-sucked, the processed residue is sucked, and there is a problem that the intake channel portion is clogged with residue.
[0006]
The conventional example shown in FIG. 12 is used when a through hole for a via electrode is drilled in a thin resin sheet or metal sheet for a multilayer substrate by laser processing, but has the following problems. That is, thin sheets such as resin sheets have poor shape stability and are likely to curl. Therefore, when the above conventional method is applied to this thin sheet, a large amount of undulation near the center of the thin sheet remains, and the surface height changes. However, the allowable working distance of the laser beam is exceeded and there is a problem that it cannot be processed with high accuracy.
[0007]
The present invention is a laser processing apparatus capable of solving the problems in the conventional example that occur when punching a sheet-like workpiece by laser processing and the problems that occur when laser processing a thin sheet as a workpiece. It is another object of the present invention to provide a laser processing method.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a laser processing apparatus according to the present invention includes a clamping device that applies tension to a sheet, and one of the sheets.ParcelThe portion can be maintained in a plane state by the tension, andAround the sectionAdsorbing device for adsorbing and supporting the sheetapparatusSupported by adsorptionParcelAnd a laser beam irradiation device for laser processing the portion.
[0010]
In order to achieve the above object, the laser processing apparatus of the present invention can attach and detach the periphery of the partition portion so that the tension portion is applied to the sheet and the partition portion of the sheet can maintain a flat state by the tension. An adsorbing device that adsorbs and supports the sheet, a laser beam irradiation device that laser-processes a section of the sheet that is adsorbed and supported by the adsorbing device, and moves the sheet relative to the laser beam irradiation device and the adsorbing device, And a moving device that sequentially laser-processes each section of the sheet.
[0011]
Further laser processing of the present inventionMethodApply tension to the sheet to achieve the above purposeAndSheetThe periphery of the partition portion is supported by suction, and the partition portion is laser processed.It is characterized by that.
[0012]
In addition, the laser processing method of the present invention applies a tension to the sheet in order to achieve the above object.As well asSheetAround the sectionThe partition portion is laser processed, and the laser processing is repeatedly performed by sequentially changing the partition portion.
[0013]
According to the laser machining apparatus and the laser machining method of the above invention, the clamping device isSheetThe adsorption device isSheetA section ofMinutesIn order to adsorb and support in a tensioned state, in its compartmentSheetSince the surface undulation can be corrected and flattened, each section by the laser beam irradiation apparatus can be laser processed with high accuracy. Furthermore, the mobile deviceSheetIs divided into a plurality of sections and each section is sequentially introduced into the suction section of the suction device.SheetHowever, laser processing can be performed with high accuracy.
[0014]
Further, the laser processing method of the present invention achieves the above object,SheetWhile applying tension so that is flatSheetWhen laser processing was performed by irradiating the laser beam, it was stretched by tensionSheetThe amount of displacement of a machining point that is displaced by elastic return when the tension is released is calculated in advance, input to the control data as a correction value, and laser machining is performed based thereon.
[0015]
According to the laser processing method of the present invention, the shape stability is low.SheetStretched by tension while securing a flat state by applying tension toSheetThe amount of laser machining point displacement due to elastic recovery and contraction when released from the tension after machining can be calculated in advance, and machining data can be further improved by correcting the machining point data according to the value. It is possible to reliably perform drilling or other processing at a desired processing point.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0017]
FIG. 1 is a perspective view showing a configuration of a laser processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a front view of the apparatus. In addition, illustration of the structure of a laser beam irradiation part is abbreviate | omitted. A workpiece to be laser processed is a sheet-like circuit board made of resin or metal. In particular, in the present embodiment, a thin sheet made of an aramid epoxy resin is used as a workpiece.
[0018]
In FIG. 1, a laser processing apparatus 101 is configured as a processing apparatus that forms a minute through hole in a circuit board 102 of a sheet-like workpiece, and a laser beam 118 is applied to the circuit board 102 held at a predetermined position. Is drilled.
[0019]
The circuit board 102 includes a fixed side clamp (reference side holding unit) 103 fixed on the base plate 105 and a movable side clamp (movable side holding unit) 104 mounted on a guide rail 111 attached on the base plate 105. In the meantime, both ends thereof are gripped and held at a predetermined processing position. The movable side clamp 104 is urged in a direction away from the fixed side clamp 103 by the urging cylinder 106, so that tension is applied to the circuit board 102 gripped at both ends, and the plane side state is maintained and held. The The structure for holding the circuit board 102 will be described in detail with reference to FIG.
[0020]
In FIG. 2, a clamp operation arm 107 is provided above each of the fixed side clamp 103 and the movable side clamp 104, and is configured to be opened and closed by a detachable cylinder 109. After the clamping arm 107 is opened by the detachable cylinder 109, both ends of the circuit board 102 are placed between the gripping block 108 of the fixed side clamp 103 and the gripping block 110 of the movable side clamp 104, and then attached and detached. The clamp operation arms 107 are closed by the cylinders 109 to grip both ends of the circuit board 102.
[0021]
The movable side clamp 104 is mounted on a guide rail 111 attached on the base plate 105, and is urged in a direction away from the fixed side clamp 103 by an urging cylinder 106 connected to the gripping block 110. When the biasing cylinder 106 is driven after the circuit board 102 is held by the clamp operation arms 107 of the fixed side clamp 103 and the movable side clamp 104, the movable side clamp 104 moves on the guide rail 111 on the fixed side clamp 103. The circuit board 102 that is held by being biased away from the circuit is tensioned.
[0022]
The urging force by the urging cylinder 106 may be a tension that allows the circuit board 102 to be supported only at both ends and eliminates the state where the center part is bent, and the sheet-like circuit board 102 that is likely to be bent, particularly its circuit. Even when the substrate 102 is made of a thin sheet, it can be maintained in a certain flat state.
[0023]
By irradiating a predetermined processing position with a laser beam on the sheet-like circuit board 102 that is held at both ends and in a state in which the planar state is maintained with a constant tension, minute drilling is performed. Can be implemented accurately. Even when the perforated part is penetrated by the laser light, a large space is formed in the lower part thereof, so that the reflection of the laser light transmitted from the through hole does not affect the circuit board 102 and heating by the reflected light is performed. No deformation occurs. In addition, since the residue generated by the processing only accumulates below the circuit board 102, the harmful effects caused by the residue do not occur by removing it as needed.
[0024]
FIG. 3 is a front view showing a modified example of the above configuration. In the above configuration, the sheet-like circuit board 102 is configured to have a constant outer size. As shown in FIG. By mounting on the adjustment unit 112, it is possible to cope with a change in the external size of the circuit board 102. The holding width adjusting unit 112 includes a rail 112a fixed on the base plate 105, a slider 112b that can slide on the rail 112a, and fixing means (not shown) for fixing the movement of the slider 112b at a set position. If the movable side clamp 104 is mounted on the slider 112b, the movable side clamp 104 can be adjusted according to the size of the circuit board 102 to be processed. In this configuration, the urging cylinder 106 is configured to urge the movable side clamp 104 in the pulling direction, and is disposed so as to avoid the space below the circuit board 102, so that processing residues generated by laser processing accumulate. Easy cleaning of the space below the circuit board 102 can be achieved.
[0025]
FIG. 4 is a partial front view showing a modification of the structure of the gripping surface of the sheet-like circuit board 102 by the clamping operation arm 107 and the gripping block 108. Since tension is applied to both ends of the circuit board 102, it is necessary to hold the position securely so that the gripping position does not shift. As shown in the figure, the gripping force of the circuit board 102 can be strengthened by forming the recess 113 in the gripping block 108 and providing the protrusion 114 on the clamp operation arm 107 so as to face the recess 113. Although the figure shows the structure of the fixed side clamp 103, the movable side clamp 104 is similarly configured.
[0026]
Furthermore, FIG. 5 is a perspective view showing a configuration of a laser processing apparatus 120 according to the second embodiment for accommodating a large-sized sheet-like workpiece. Elements common to the configuration of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
[0027]
In addition to the configuration of the first embodiment, the laser processing apparatus 120 is provided with vacuum suction portions 115 and 116 that hold the peripheral portion of the sheet-like circuit board 102a that is not gripped. It is possible to stably hold 102a and to easily set the processing position. In the case where distortion occurs only by applying tension by holding both ends of the circuit board 102a formed in a large size with a thin resin sheet or metal sheet, stable flatness can be maintained by this configuration. . In addition, the circuit board 102a that has been carried in can be temporarily held by the vacuum suction portions 115 and 116 at the time of setting for positioning to the processing position, and the setting operation can be easily performed.
[0028]
In the configuration described above, a circuit board is targeted as a workpiece, but it can also be applied to laser processing of other thin sheet workpieces. Further, when the workpiece has a deformed shape other than a rectangular shape, a plurality of pairs of fixed side clamps 103 and movable side clamps 104 may be provided.
[0029]
FIGS. 6-8 has shown the laser processing apparatus in the 3rd Embodiment of this invention. This embodiment relates to a laser processing apparatus that processes the surface of a thin resin sheet used for a multilayer substrate or the like of an electric device with laser light.
[0030]
As shown in FIGS. 6 to 9, this laser processing apparatus can maintain a clamping device (clamping means) 5 that applies tension to the thin sheet 1 and a flat section of the thin sheet 1 by the tension. Thus, a suction device (suction means) 8 that detachably sucks and supports the peripheral portion of the partition portion 1a, and a laser beam irradiation device that laser-processes the partition portion 1a sucked and supported by the suction device 8 of the thin sheet 1 (Laser light irradiating means) 4 and the thin sheet 1 are moved relative to the laser light irradiating device 4 and the suction device 8 so that each section 1a of the thin sheet 1 is sequentially laser processed. Moving devices (moving means) 6 and 7 are provided.
[0031]
An example of the thin sheet 1 is a resin sheet having a large flexibility and having a thickness of 0.2 to 0.3 mm and a size of about 30 cm × 60 cm. The size of the partition portion 1a is limited to about 50 mm × 50 mm so that the size and shape of the focused spot of the laser beam 3 focused within this range are uniform.
[0032]
The laser light irradiation device 4 includes a laser optical system 20 and a laser oscillator 21 that oscillates the laser light 3 in a pulsed manner in synchronization with the laser optical system 20. The laser optical system 20 condenses the laser light 3. A condensing lens 22 and a galvano scanner 23 for positioning the condensing point of the laser beam 3 at the processing point A of the thin sheet 1 are provided.
[0033]
The clamp device 5 includes a sub-table 24, a fixed-side clamp (reference-side chuck) 25 that is fixed to the sub-table 24 and grips one side of the thin sheet 1, and a movable-side clamp that grips one side opposite to the one side. (Movable side chuck) 26 and the thin sheet 1 is stretched horizontally by a spring 27 that urges the movable side clamp 26 to apply tension to the thin sheet 1 in the X direction.
[0034]
The X table 6 and the Y table 7 move the sub table 24 so that the sub table 24 can be positioned in the X and Y directions. The thin sheet 1 is divided into a plurality of partition portions 1a, and the processing of one partition portion 1a is completed. If it does so, the next division part 1a will be introduce | transduced in the adsorption | suction part of the adsorption | suction apparatus 8, and will be positioned.
[0035]
As shown in FIGS. 6 to 8, the suction device 8 includes a frame-like member 11 having a plurality of ducts 12 built in by providing suction ports 12 a on a frame-like end surface 11 a facing the thin sheet 1 and communicating with each other. And a suction member 13 that is connected to the base end side 12b of the pipe 12 and sucks air. The frame-shaped member 11 surrounds each partition portion 1a of the thin sheet 1 with a distance that prevents the frame-shaped member 11 from interfering with the laser beam 3, and can adsorb the thin sheet 1 to the end surface 11a. .
[0036]
The suction member (suction means) 13 includes a hose 14 connected to the base end side 12 b of the frame-shaped member 11, and a vacuum pump 15 connected to the hose 14 via a switching valve 17 and a filter 16. The switching valve 17 is connected to a discharge member (discharge means) 18 including a compressor 19 for blowing compressed air. The switching valve 17 selectively connects the suction member 13 and the discharge member 18 with the hose 14. Via the pipe 12.
[0037]
An example of the frame-shaped member 11 is a rectangular frame shape having a rectangular opening of about 6 cm × 6 cm, and a plurality of suction ports 12a having a diameter of about 1 cm are provided on an end surface 11a having a width of about 1 cm at a pitch of about 1 cm. All the conduits 12 are communicated inside the frame-shaped member 11 and assembled into two openings provided on the outer side of the frame-shaped member 11, and this is connected to the proximal end side of all the conduits 12. 12b. Air is sucked from all the suction ports 12a by the suction member 13, and the thin sheet 1 is adsorbed to the end surface 11a, or air is blown from all the suction ports 12a by the discharge member 18, and is sucked into the duct 12. The processing waste remaining on the suction surface of the thin sheet 1 can be blown away.
[0038]
As shown in FIGS. 6 and 9, the frame-shaped member 11 has an air outlet 31 on one inner wall surface and an air inlet 32 on the inner wall surface facing the inner wall surface. And an air blowing member (air blowing means) (not shown) connected to the proximal end side of the blowing port 31 and an air suction member (air sucking means) (not shown) connected to the proximal end side of the suction port 32 A strong flow B of compressed air from the port 31 toward the suction port 32 is formed, and processing waste generated by laser processing is removed from the thin sheet 1 and collected. Further, between the frame-shaped member 11 and the condensing lens 22, a second blow-out port 33 and a second suction port 34 are arranged in parallel to face each other across a laser beam path to be scanned. An unillustrated air blowing member (air blowing means) connected to the proximal end side of the blowout port 33, and an unillustrated air suction member (air sucking means) connected to the proximal end side of the second suction port 34. As a result, a strong flow C of compressed air from the second blow-out port 33 toward the second suction port 34 is formed, and the processing waste generated in the laser processing is excluded and collected so as not to adhere to the laser optical system 20. The
[0039]
In particular, when a thin sheet made of a resin such as an aramid epoxy resin is used as a workpiece, droplet-shaped resin waste heated and melted by laser light is generated during processing, and the resin waste is scattered. When it adheres to the peripheral member and solidifies by cooling, it becomes difficult to remove it, and therefore it is necessary to collect dust immediately after the occurrence. Therefore, in the present embodiment, as shown in FIG. 9, a lower frame member 51 is provided at a position facing the suction device 8 across the thin sheet 1, and directed downward toward the lower frame member 51. The connected dust collection duct 57 quickly collects relatively large machining waste that falls downward due to its own weight. Further, in the lower frame-like member 51, a blowout port 53 is provided on one inner wall surface, and a suction port 55 is provided in parallel on the inner wall surface opposite to the inner wall surface, and the lower frame member 51 is connected to the proximal end side of the blowout port 53. A strong compressed air flow D from the air outlet 53 toward the air inlet 55 is formed by the air outlet member that is not connected to the air inlet member (not shown) connected to the base end side of the air inlet 55, and a thin sheet is formed by laser processing. Fine machining waste generated on the lower side of 1 is instantly eliminated.
[0040]
When a metal sheet is used as a workpiece, the air outlet 31, the air inlet 32, the second air outlet 33, and the second air inlet 34 provided in the frame-like member 11 on the thin sheet 1 are used. Since the desired dust collecting action can be obtained only by this, it is not necessary to provide the lower frame member 51 described above.
[0041]
As shown in FIG. 6, the positioning member (positioning means) 9 includes a linear guide 35 that holds the frame-shaped member 11 so as to be movable perpendicularly to the surface of the thin sheet 1, and a cam follower provided on the outer side of the frame-shaped member 11. 14, and a servo motor 37 that drives the eccentric cam 36. The frame member 11 and the thin sheet 1 are reliably brought into contact with and separated from each other. At the time of laser processing, the end surface 11 a that has attracted the thin sheet 1 is positioned at the working distance of the laser beam 3. Further, when the thin sheet 1 is moved by the X table 6 and the Y table 7 at the separation position, the thin sheet 1 is not damaged by the frame-like member 11 at the separation position, and the thin sheet 1 is thin by the X table 6 and the Y table 7. The sheet 1 is moved at high speed.
[0042]
A laser processing method of the thin sheet 1 having the above configuration will be described below.
[0043]
First, the thin sheet 1 is stretched horizontally by the clamping device 5, and the thin sheet 1 is moved in the X and Y directions by the X table 6 and the Y table 7 so that one partition portion 1 a is below the frame-shaped member 11. Position it. The positioning member 9 positions the end surface 11a of the frame-shaped member 11 to the working distance of the laser light 3, and the suction member 13 is set to the suction side to attract and fix the thin sheet 1 to the end surface 11a. Next, the galvano scanner 23 is positioned at high speed at a desired processing point A at the focused point of the laser optical system 20 in the positioned section 1a, and is stationary. The light 3 is oscillated in a pulse shape, the machining point A is immediately drilled, and the process immediately moves to the next machining point A.
[0044]
When the processing of one section 1a of the thin sheet 1 is completed, the frame member 11 is separated from the suction surface of the thin sheet 1 by the positioning member 9, and the X table 6 and the Y table 7 are thin in the X and Y directions. The sheet 1 is moved and positioned, the switching valve 17 is switched, and the discharge member 18 blows away the processing waste sucked into the pipe line 12 and the processing waste remaining on the suction surface of the thin sheet 1, so that the next partition portion 1 a Shift to machining. In this way, a minute hole can be precisely processed by the laser beam 3 at a desired processing point A of the thin sheet 1 having a thin and large area.
[0045]
In the said embodiment, although the resin sheet material was used as the thin sheet 1, this invention is not limited to this, An ultra-thin metal foil, paper, or the single-piece | unit of resin, or the composite sheet material which bonded these together Applicable.
[0046]
In the above embodiment, the thin sheet 1 is processed with the pulsed laser beam 3. However, the present invention is not limited to this, and various laser beam intensity and oscillation patterns can be set to perform welding or image printing. Various laser processing can be performed.
[0047]
Next, a fourth embodiment of the present invention shown in FIG. 10 will be described. FIG. 10 shows only the main part of the laser processing apparatus in the same embodiment, and the other members are the same as those in the first to third embodiments, and the illustration and description thereof are omitted.
[0048]
Among the above-described embodiments, when a resin sheet is used as a workpiece, the elastic material is stretched when both ends are urged away from each other. As a result, the machining point is slightly displaced. Therefore, in the present embodiment, when processing a thin sheet whose plane state is ensured by a tension applying device, the amount of displacement caused by the elongation is calculated from data obtained in advance and the processing point data is corrected to further improve processing accuracy. It is increasing.
[0049]
That is, when tension F is applied to a thin sheet body having a length L, a width W, and a thickness T, assuming that the Young's modulus of the resin is E, the maximum elongation λ is
λ = L · F / A · E (A = W · T)
[0050]
Specifically, for example, a thin sheet having a length L = 510 mm, a width W = 340 mm, and a thickness T = 0.13 mm, and F = 13.5 kgf in a direction in which both ends of the thin sheet are separated from each other along the longitudinal direction P. When tension is applied, the maximum elongation λ = 0.135 mm in the longitudinal direction P is obtained from Young's modulus E = 1153 kgf / mm 2. Further, the maximum shrinkage amount ρ in the width direction Q of the thin sheet at this time can be obtained in the same manner.
[0051]
When the maximum elongation amount λ and the maximum shrinkage amount ρ obtained as described above are added to the CAD data 65 as correction values, the converter 63 calculates the machining point position after displacement using this as a coefficient, and converts it into the actual machining point data. Based on the control value from the converter 63, the galvano controller 61 controls the galvanometers 29x and 29y. In FIG. 10, 28x and 28y denote X-axis and Y-axis galvanometer mirrors, respectively, and the mirrors are driven by X-axis and Y-axis galvanometers 29x and 29y, respectively.
[0052]
As described above, in the present embodiment, not only the thin sheet is kept in a flat state by the tension applying device and the suction device, but also the displacement of the processing point on the thin sheet caused by elongation due to the tension is calculated in advance. By correcting the data, laser processing can be reliably performed at a desired processing point, and processing accuracy can be further improved.
[0054]
【The invention's effect】
According to the present invention,Since the sheet is stretched by the clamping device and the suction device sucks and supports one section of the sheet in a tensioned state, the surface of the sheet can be corrected and flattened in the section. Therefore, each partition part by a laser beam irradiation apparatus can be laser processed with high accuracy. Furthermore, since the moving device divides the sheet into a plurality of partition portions and sequentially introduces each partition portion into the suction portion of the suction device, laser processing can be performed with high precision even on a thin and large area sheet. .
[0055]
Furthermore, shape stability is lowSheetWhile preserving the planar state by applying tension to the workpiece, the amount of displacement of the laser processing point due to elastic return and contraction when the workpiece extended by tension is released from the post-processing tension is calculated in advance. By correcting the processing point data according to the value, the processing accuracy can be further increased, and a desired processing point can be punched and other processing can be reliably performed.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a laser processing apparatus according to a first embodiment of the present invention.
FIG. 2 is a front view showing the configuration of the apparatus.
FIG. 3 is a front view showing a configuration corresponding to a size change of a workpiece in the apparatus.
FIG. 4 is a partial front view showing a modification of the workpiece holding structure of the apparatus.
FIG. 5 is a perspective view showing a configuration of a laser processing apparatus according to a second embodiment of the present invention.
FIG. 6 is a front view showing a configuration of a laser processing apparatus according to a third embodiment of the present invention.
FIG. 7 is a front view showing an adsorption device of the laser processing apparatus.
FIG. 8 is a bottom view of the same.
FIG. 9 is a front view showing an overall structure of an adsorption device of the laser processing apparatus.
FIG. 10 is a schematic configuration diagram of a laser processing apparatus according to a fourth embodiment of the present invention.
FIG. 11 is a cross-sectional view showing a configuration of a conventional laser processing apparatus.
FIG. 12 is a schematic perspective view showing a conventional example.
[Explanation of symbols]
102 Workpiece
103 Fixed side clamp (holding means)
104 Movable clamp (holding means)
106 Biasing cylinder (biasing means)

Claims (13)

A clamping device for providing tension to the sheet, a suction device for sucking and supporting the periphery of the partition part a section portion of the sheet so as to be kept a flat state by the tension, which is sucked and supported by the suction device for a seat A laser processing apparatus comprising: a laser beam irradiation apparatus that performs laser processing on a partition portion. A clamping device that applies tension to the sheet, a suction device that detachably sucks and supports the periphery of the partition portion so as to maintain a flat state due to the tension, and the suction device of the sheet. Laser beam irradiating device for laser processing the supported partition portion, and movement for moving the sheet relative to the laser beam irradiation device and the suction device so that each partition portion of the sheet is sequentially laser processed. A laser processing apparatus comprising the apparatus. The adsorbing device includes a frame-like member having a plurality of conduits that are connected to each other by providing a suction port on a frame-like end surface facing the sheet, and a suction member that is connected to the proximal end side of the conduit and sucks air The laser processing apparatus of Claim 1 or 2 provided with these. The adsorption device includes a switching valve connected between the proximal end of the pipe line of the frame-like member and the suction member, and a discharge member that is connected to the switching valve and blows air into the switching valve. The laser processing apparatus according to claim 3, wherein a member and the discharge member are selectively communicated with the pipe line. The laser processing apparatus according to claim 3, further comprising a positioning member that positions the frame member so as to be movable in a direction perpendicular to the sheet. A blow-out port provided on one inner wall surface of the frame-shaped member, a suction port provided on the other inner wall surface facing the blow-out port, and an air blow-off member connected to the base end side of the blow-out port; The laser processing apparatus of Claim 3 provided with the air suction member connected to the base end side of the said suction inlet. A blowout port and a suction port arranged in parallel and facing each other across a laser beam path between the frame-shaped member and the laser optical system, an air blower member connected to a proximal end side of the blowout port, and the suction port The laser processing apparatus of Claim 3 provided with the air suction member connected to the base end side. Rutotomoni applying tension to the sheet, the periphery of the compartment portion of the sheet by suction support, a laser processing method, which comprises laser machining the compartment. A laser processing method characterized by applying tension to a sheet, adsorbing and supporting the periphery of a partition portion of the sheet, laser processing the partition portion, sequentially changing the partition portion, and repeatedly performing the laser processing. When laser processing is performed by irradiating the sheet with laser light while applying tension so that the sheet is in a flat state, the amount of displacement of the processing point that is displaced by elastic return when the sheet stretched by tension is released from the tension 10. The laser processing method according to claim 8 or 9, wherein the laser processing is performed based on the control data that is calculated in advance and inputted as a correction value. 10. The laser processing method according to claim 8, wherein the processing waste generated by the laser processing is collected in a compressed air flow. A second frame-shaped member is provided at a position facing the frame-shaped member across the sheet in a direction perpendicular to the sheet maintained in a planar state, and the second frame-shaped member is provided on one inner wall surface. An air outlet provided on the other inner wall surface opposite to the air outlet, an air outlet member connected to the base end side of the air outlet, and a base end side of the air inlet The laser processing apparatus according to claim 6, further comprising a connected air suction member. In a laser processing apparatus that performs drilling by irradiating a workpiece with a laser beam, a pair of clamps that respectively hold opposite ends of the workpiece, and a relative relationship between the pair of clamps. A laser processing apparatus comprising: a tension applying device that applies an urging force in a direction away from the workpiece and applies tension to the workpiece; and suction holding means that sucks and holds a peripheral portion that is not held by a clamp.

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