JP4694842B2 - Shf放電プラズマ中の気相からダイヤモンド膜を堆積する高速方法及び該方法を実行する装置 - Google Patents
Shf放電プラズマ中の気相からダイヤモンド膜を堆積する高速方法及び該方法を実行する装置 Download PDFInfo
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- 239000010432 diamond Substances 0.000 title claims description 51
- 229910003460 diamond Inorganic materials 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 38
- 238000000151 deposition Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims description 130
- 239000007789 gas Substances 0.000 claims description 68
- 230000005855 radiation Effects 0.000 claims description 49
- 238000006243 chemical reaction Methods 0.000 claims description 45
- 230000005520 electrodynamics Effects 0.000 claims description 44
- 239000000203 mixture Substances 0.000 claims description 37
- 230000005540 biological transmission Effects 0.000 claims description 33
- 230000008021 deposition Effects 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 238000001816 cooling Methods 0.000 claims description 17
- 238000009826 distribution Methods 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 229930195733 hydrocarbon Natural products 0.000 claims description 7
- 150000002430 hydrocarbons Chemical class 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000006557 surface reaction Methods 0.000 claims description 5
- 230000005670 electromagnetic radiation Effects 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 210000002381 plasma Anatomy 0.000 description 135
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000013461 design Methods 0.000 description 14
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- 230000005684 electric field Effects 0.000 description 9
- 239000012071 phase Substances 0.000 description 8
- 230000004807 localization Effects 0.000 description 7
- 230000000737 periodic effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
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- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
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- Crystals, And After-Treatments Of Crystals (AREA)
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Description
Claims (11)
- マイクロ波放電のプラズマ中の気相から、基板上にダイヤモンド膜を堆積する方法であって、
前記マイクロ波放電は、反応チャンバ内に位置され、少なくとも水素及び炭化水素を含むガス混合物中に形成され、このガス混合物は、前記基板上に堆積され、かつ表面反応の結果として、多結晶ダイヤモンド膜を形成する水素原子及び炭素含有ラジカルを形成するマイクロ波放電によって活性化される、方法において、
前記プラズマ中の電子密度Neを増加させるために少なくとも1kWの出力と、2.45GHzの周波数よりも高い周波数fとを有するマイクロ波により、安定した非平衡プラズマを生成することによって、前記ガス混合物を活性化させることと、
前記反応チャンバ内に、前記プラズマを局在化させるように、前記基板近くの領域で交差する少なくとも2つの波ビームによって、前記基板近くに波腹を有する定常マイクロ波が形成され、それらの波腹において、前記基板上にダイヤモンド膜を堆積するように、前記基板を覆うプラズマ層が生成されて維持されることを特徴とする方法。 - 前記ガス混合物は、30GHzに等しい周波数fを用いた電磁放射を用いることにより、電子密度Neを増加させることによって活性化され、前記定常マイクロ波の波腹における前記プラズマ層の大きさは、前記少なくとも2つの波ビームの断面のプロファイル及びサイズを変えることによって制御される請求項1に記載の方法。
- 前記定常波は、2つ1組で交差する4つ以上の収束する波ビームによって形成される請求項1または2に記載の方法。
- 前記定常波は、2つの、収束してかつ交差する波ビームによって形成される請求項1または2に記載の方法。
- 前記定常波は、2つの、対向する方向に向けられた収束する波ビームによって形成される請求項1または2に記載の方法。
- 前記波ビームは、前記定常波を形成するように、前記基板上に入射し、前記基板から反射する請求項1または2に記載の方法。
- マイクロ波放電のプラズマ中の気相からのダイヤモンド膜の堆積のためのリアクタシステムであって、
マイクロ波発生器と、
準光学電気力学システムで終端する伝送ラインと、
反応チャンバ内の基板ホルダ上に基板が配置された前記反応チャンバと、
選択されたガス混合物を注入及び排出するシステムとを含んでいる、リアクタシステムにおいて、
前記準光学電気力学システムは、少なくとも2つの波ビームが前記基板の近くの選択された領域内で交差し、この領域内で定常マイクロ波を形成するように適合され、
前記伝送ラインは、その内面に波形を有するオーバーサイズ円形導波管であり、前記伝送ラインに、少なくとも2つのガウス分布の波ビームに分割するディバイダと、前記準光学電気力学システムに前記少なくとも2つのガウス分布の波ビームを伝えるミラーシステムとが追加されており、
前記準光学電気力学システムおよび前記伝送ラインは、少なくとも1kWの出力と、2.45GHzの周波数よりも高い周波数fとを有するマイクロ波に適合される、リアクタシステム。 - 前記準光学電気力学システムは、プラズマ形成の領域に対して異なる側に位置し、かつマイクロ波放射を4つの交差する波ビームとして向けるように位置する4つのミラーを有し、
該交差は、2つ1組であり、前記準光学電気力学システムは、前記伝送ラインの一部と共に、前記反応チャンバ内に設置されており、
前記伝送ラインは、1つの波ビームを4つのビームに分割し、かつ前記オーバーサイズ円形導波管の出力に設置された、オーバーサイズ円形導波管として形成されているディバイダが追加されている、請求項7に記載のリアクタシステム。 - 前記準光学電気力学システムは、2つの波ビームを、小さな角度で、前記基板の表面に向けるように配置されたプラズマ形成の領域に対して、異なる側に位置する2つのミラーで形成されており、
前記伝送ラインには、1つの波ビームを2つの波ビームに分割し、かつ前記オーバーサイズ円形導波管の出力に設置された、オーバーサイズ円形導波管として形成されているディバイダが追加されている、請求項7に記載のリアクタシステム。 - 前記準光学電気力学システムは、プラズマ形成の領域に対して異なる側に位置し、かつ波ビームを互いに対向方向に向けるように配置された2つのミラーで形成されており、
前記2つのミラーの一方は、それ自体と平行に、±λ/4の距離まで前後に移動可能なように設置されており、ただし、λはマイクロ波放射波長であり、
前記伝送ラインは、1つの波ビームを2つのビームに分割し、かつ前記オーバーサイズ円形導波管の出力に設置された、オーバーサイズ円形導波管として形成されているディバイダが追加されている、請求項7に記載のリアクタシステム。 - 前記反応チャンバ内のプラズマ形成の領域内のガスを排出するシステムは、中心部に供給チューブを有する凹面金属スクリーンであり、
前記スクリーンは、調節可能な距離に、前記基板ホルダ上に位置しており、
ガスを排出するシステムは、排出されるガス混合物のための空間を有した前記基板ホルダの開口部のセットとして形成されており、
前記基板ホルダの上方部の水冷のためのシステムは、この空間内に位置している、請求項8ないし10のうちのいずれか1項に記載のリアクタシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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RU2002125807/02A RU2215061C1 (ru) | 2002-09-30 | 2002-09-30 | Высокоскоростной способ осаждения алмазных пленок из газовой фазы в плазме свч-разряда и плазменный реактор для его реализации |
RU2002125807 | 2002-09-30 | ||
PCT/RU2003/000410 WO2004029325A1 (en) | 2002-09-30 | 2003-09-18 | High velocity method for deposing diamond films from a gaseous phase in shf discharge plasma and a plasma reactor for carrying out said method |
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JP4694842B2 true JP4694842B2 (ja) | 2011-06-08 |
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US (3) | US7694651B2 (ja) |
EP (1) | EP1643001B1 (ja) |
JP (1) | JP4694842B2 (ja) |
KR (1) | KR100838384B1 (ja) |
CN (1) | CN100523288C (ja) |
CA (1) | CA2501070C (ja) |
HK (1) | HK1085245A1 (ja) |
RU (1) | RU2215061C1 (ja) |
WO (1) | WO2004029325A1 (ja) |
ZA (1) | ZA200502854B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7776408B2 (en) * | 2007-02-14 | 2010-08-17 | Rajneesh Bhandari | Method and apparatus for producing single crystalline diamonds |
US10039157B2 (en) | 2014-06-02 | 2018-07-31 | Applied Materials, Inc. | Workpiece processing chamber having a rotary microwave plasma source |
US10269541B2 (en) * | 2014-06-02 | 2019-04-23 | Applied Materials, Inc. | Workpiece processing chamber having a thermal controlled microwave window |
WO2016017217A1 (ja) * | 2014-07-29 | 2016-02-04 | 三菱電機株式会社 | マイクロ波加熱照射装置 |
RU2595156C2 (ru) * | 2014-12-15 | 2016-08-20 | Федеральное государственное бюджетное научное учреждение "Федеральный исследовательский центр Институт прикладной физики Российской академии наук" (ИПФ РАН) | Плазменный свч реактор для газофазного осаждения алмазных пленок в потоке газа (варианты) |
US10490425B2 (en) | 2015-07-29 | 2019-11-26 | Infineon Technologies Ag | Plasma systems and methods of processing using thereof |
RU2624754C2 (ru) * | 2015-12-25 | 2017-07-06 | Федеральное государственное бюджетное научное учреждение "Федеральный исследовательский центр Институт прикладной физики Российской академии наук" (ИПФ РАН) | Способ создания легированных дельта-слоев в CVD алмазе |
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-
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Also Published As
Publication number | Publication date |
---|---|
WO2004029325A9 (fr) | 2004-05-27 |
HK1085245A1 (en) | 2006-08-18 |
KR100838384B1 (ko) | 2008-06-13 |
KR20050083704A (ko) | 2005-08-26 |
EP1643001B1 (en) | 2015-09-02 |
US20060110546A1 (en) | 2006-05-25 |
US20090123663A1 (en) | 2009-05-14 |
JP2006501122A (ja) | 2006-01-12 |
CN1694977A (zh) | 2005-11-09 |
RU2002125807A (ru) | 2004-03-27 |
CN100523288C (zh) | 2009-08-05 |
US7694651B2 (en) | 2010-04-13 |
US20100218722A1 (en) | 2010-09-02 |
CA2501070A1 (en) | 2004-04-08 |
US8091506B2 (en) | 2012-01-10 |
ZA200502854B (en) | 2005-12-28 |
RU2215061C1 (ru) | 2003-10-27 |
CA2501070C (en) | 2012-06-26 |
EP1643001A1 (en) | 2006-04-05 |
EP1643001A4 (en) | 2007-08-08 |
WO2004029325A1 (en) | 2004-04-08 |
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